Milan - Cores - AMD

	Edit Values
	Milan
	General Info
Designer	AMD
Manufacturer	TSMC, GlobalFoundries
Introduction	January 12, 2021 (announced); March 15, 2021 (launched)
	Microarchitecture
ISA	x86-64
Microarchitecture	Zen 3
Word Size	8 octets ; 16 nibbles ; 64 bit
Process	7 nm+ "nm+" is not declared as a valid unit of measurement for this property.
Technology	CMOS
	Packaging
Package	SP3, FCLGA-4094 (FC-OLGA)
Dimension	75.4 mm 7.54 cm ; 2.969 in ; × 58.5 mm 5.85 cm ; 2.303 in ; × 6.26 mm 0.246 in ;
Pitch	0.87 mm 0.0343 in ; × 1 mm 0.0394 in ;
Contacts	4094
Socket	SP3, LGA-4094
	Succession
	Rome Genoa

Milan is the codename of AMD's EPYC 7003 series of high-performance microprocessors based on the Zen 3 microarchitecture for single- and dual-socket server platforms. Launched in March 2021 it succeeded the second generation of EPYC processors, the EPYC 7002 "Rome" series.^[1]

The codename "Milan" first appeared on AMD roadmaps in 2017. In 2019 a presentation leaked on YouTube and later removed revealed the basic CCD configuration.^[2] The launch of the EPYC 7003 series was announced and a 32-core model demonstrated in a keynote by AMD CEO Lisa Su on January 12, 2021 for CES 2021.

EPYC 7003 processors identify as members of AMD CPU Family 19h, Model 01h (engineering samples as Model 00h).

Overview

"Milan" development focused on microarchitectural improvements, see the Zen 3 article for details. The "Milan" SoCs support single and 2-way multiprocessing as well as 2-way multithreading with up to 64 cores and 128 threads per processor. AMD claims up to 15% better performance per cost and 25% more performance in the mid-stack segment compared to the prior generation.

The processors are available in a 4094-contact land grid array package for Socket SP3 and backwards compatible with motherboards designed for "Rome" processors (EPYC "Type-1" boards) after a BIOS update. Due to limited NVM capacity this update may remove support for first generation EPYC 7001 "Naples" series CPUs. "Type-0" boards designed for the lower memory and PCIe bus frequencies of "Naples" processors are not supported.^[3] The codename of AMD's Type-1 reference platform is "Ethanol X".

Like the "Rome" series, "Milan" processors are multi-chip modules containing one large I/O die and (as of May 2021) four or eight Core Complex Dies fabricated on a TSMC advanced 7 nm process. The "Rome" CCD integrates two Zen 2 Core Complexes (CCX), each providing four CPU cores and a shared 16 MiB L3 cache with 39 cycles average load-to-use latency. In contrast the "Milan" CCD contains a single Zen 3 CCX comprising eight CPU cores (the number of usable cores varies by SKU) which share a 32 MiB L3 cache with 46 cycles average latency, doubling the L3 capacity available to one core.

The "Milan" I/O die has largely the same features as the prior generation die fabricated on GlobalFoundries' 14 nanometer "14LPP" process. Apart of the memory controllers and I/O facilites described below it integrates an AMD Secure Processor, a SMU, RTC, and other functions traditionally found in a separate chipset.

In an interview on March 15, 2021 AMD SVP Forrest Norrod confirmed plans for another server processor series based on the Zen 3 microarchitecture with the codename "Trento". These processors will use a different I/O die with additional coherent Infinity Fabric links to attach accelerators. They will be used in the exaflop Frontier supercomputer with nodes comprising one EPYC CPU and four Radeon Instinct MI200 GPUs.^[4] "Milan" processors will power the 100 petaflop Perlmutter supercomputer, Jetstream 2, Anvil, and a yet-to-be-named HPE Cray EX system at NSCC Singapore.

Memory Interface

The "Milan" I/O die integrates eight DDR4 memory controllers (UMCs), two per I/O die quadrant, which achieve data rates from 1333 to 3200 MT/s.^[5] Up to 2 DIMMs per channel are supported. The Infinity Fabric and memory bus clock can be coupled to slightly reduce the memory latency, "Milan" processors permit this up to 1600 MHz matching DDR4-3200 memory.^[6] The memory controllers support ECC memory and the following DIMM types:^[7]

SR/DR RDIMM built with x4 and x8 DDR4 devices
4R/8R LRDIMM built with x4 devices (4DR, 2S2R, 2S4R)
4R/8R 3DS DIMM built with x4 devices (2S2R, 2S4R)
NVDIMM-N (DRAM with NVM backup)

The maximum total memory capacity is 4 TiB per socket using 16 LRDIMMs or 3DS DIMMs of 256 GiB capacity.

Memory speed based on DIMM population
DIMM Type	DIMM Population/Channel		Max. Data Rate (MT/s)
DIMM Type	DIMM0	DIMM1	Max. Data Rate (MT/s)
RDIMM	-	1R	3200
	-	2R or 2DR	3200
	1R	1R	2933
	1R	2R or 2DR	2933
	2R or 2DR	2R or 2DR	2933
LRDIMM	–	4DR	3200
	–	2S2R (4 ranks)	3200
	–	2S4R (8 ranks)	3200
	4DR	4DR	2933
	2S2R (4 ranks)	2S2R (4 ranks)	2933
	2S4R (8 ranks)	2S4R (8 ranks)	2933
3DS	–	2S2R (4 ranks)	2933
	–	2S4R (8 ranks)	2933
	2S2R (4 ranks)	2S2R (4 ranks)	2666
	2S4R (8 ranks)	2S4R (8 ranks)	2666

DIMM0 is the module closer to the CPU. This socket is not present on motherboards which support only one DIMM per channel.

The memory channels are designated A to H. "Rome" and "Milan" processors support 2-, 4-, 8-, and 16-way (on 2P systems) memory interleaving. 4-way mode interleaves the memory channels ABCD and/or EFGH, or CDGH if only these four channels are populated. In contrast to the prior generation CDGH interleaving is supported by all EPYC 7003 SKUs with 128 MiB L3 cache or less, none having only two CCDs. Additionally all "Milan" processors support 6-way interleaving if channels B and F remain unpopulated, with a maximum of 256 GiB capacity per channel and restricted to 2 or 4 KiB interleaving size.^[7] The new options enable balanced memory utilization at reduced memory cost when peak memory performance is not required.

With all UMCs implemented in a central I/O die "Rome" and "Milan" processors have a single NUMA domain per socket and two NUMA distances on dual-socket platforms. AMD advertised a flatter NUMA domain and reduced inter-core latency since the CCXs were pairwise united and the CPU cores in a CCX can exchange data through the shared L3 cache rather than the Scalable Data Fabric on the I/O die. "Milan" still supports the NUMA Nodes Per Socket (NPS) and LLC/L3/CCX as NUMA domain BIOS setup options. 6-way memory interleaving is only possible with NPS=1.^[7]

Finally an unspecified probe filter improvement was advertised.

Input/Output Interfaces

The "Milan" I/O die integrates eight 16-lane PCIe Gen 4 (16 GT/s) controllers. Link bifurcation permits configuration of the PCIe lanes as x16, x8, x4, x2, or x1 wide independent links. Each controller supports up to eight PCIe links. On dual-socket systems four, or optionally three, x16 links are repurposed for cache coherent inter-socket traffic. The raw data rate of these xGMI-2 links can reach 18 GT/s. The I/O die also integrates four SATA 3.0 (6 Gb/s) controllers which support up to eight links each, multiplexed with the lower eight lanes of four x16 links. NVMe devices are supported as well. An additional 2-lane PCIe Gen 2 controller powers the WAFL links. One or both of these lanes serve as SCF links between sockets and are otherwise available for I/O, e.g. to attach a BMC. In sum up to 128 + 2 PCIe lanes are available per socket and up to 2 × 80 + 2 × 1 = 162 lanes total on dual-socket platforms.^[5]

With the "Milan" series the integrated IOMMUs were optimized to better handle high-bandwidth devices such as 200 Gbps Ethernet adapters. Support for hotplug surprise removal was brought up to current PCI-SIG implementation guidelines.

Four USB 1.1/2.0/3.1 (10 Gb/s) ports are available on the CPU package, and several low-speed interfaces listed below.

Feature Summary

All "Milan" processors have the following features:

8 to 64 Zen 3 x86 CPU cores with 2-way SMT
- 4,096-entry Op cache, 2 × 32 KiB L1, and 512 KiB L2 cache per core
- x86 extensions (new): ABM, ADX, AES, AVX, AVX2, BMI1, BMI2, CLFLUSH, CLFLUSHOPT, CLWB, CLZERO, CMOV, CMPXCHG8B, CMPXCHG16B, EMMX, F16C, FMA3, FPU, FSGSBASE, FXSR, INVLPGB, INVPCID, LahfSahf, MCOMMIT, MMX, MONITOR, MONITORX, MOVBE, MSR, PCLMULQDQ, PKU, POPCNT, PREFETCH, RDPID, RDPRU, RDRAND, RDTSCP, RDSEED, SHA, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, SysCallSysRet, SysEnterSysExit, TSC, VAES, VPCLMULQDQ, WBNOINVD, XSAVE, XSAVEC, XSAVEOPT
- Security extensions: CET_SS, GMET, NX, SEV, SEV-ES, SEV-SNP, SMAP, SME/TSME, SMEP, UMIP
- Speculation control: IBPB, IBRS, PSFD, SSBD, STIBP
Up to 32 MiB L3 cache per Core Complex (up to 8 CPU cores), 64 to 256 MiB total

8 × 64/72 bit DDR4 SDRAM interface up to 1600 MHz, PC4-25600 (DDR4-3200), 204.8 GB/s
- Up to 2 DIMMs per channel, 16 total
- SR/DR RDIMMs, 4R/8R LRDIMMs, 3DS DIMMs, NVDIMMs type N
- SEC-DED ECC support
- Up to 4 TiB total

Eight 16-lane PCIe Gen 4 (16 GT/s) controllers
- Configurable x16, x8, x4, x2, x1
- Up to 8 links per controller
- SATA, xGMI function on some lanes
One 2-lane PCIe Gen 2 controller (WAFL)
Four SATA 3.0 (6 Gb/s) controllers, up to 8 lanes each
Four USB 1.1/2.0/3.1 (10 Gb/s) ports
SD interface, 6 × I2C, 2 × SMBus, LPC interface, 4 × UART, SPI/eSPI, GPIO

AMD Secure Processor, Secure Boot, Hardware root-of-trust

TDP range 155 to 280 Watt, configurable

Naming Scheme

EPYC

7

5

3

P

Feature Modifier
(none)	1P, 2P
P	1P (single socket) only

Generation
3	Third generation, 7003 "Milan" series

Performance Level
1	Value
4, 5, 6	Performance
F	Frequency optimized and high cache/core ratio, high performance per core

Product Model (Core Count)
2	8 cores
3	16
4	24-28
5	32
6	40-56
7	64 cores

Product Series
7xxx	High-performance server CPU/SOC

Product Family

Milan Processors

	List of Milan Processors
Model	Family	Price	Launched	Cores	Threads	TDP	L2$	L3$	Base	Turbo
	Uniprocessors
7313P	EPYC	$ 913.00 € 821.70 £ 739.53 ¥ 94,340.29	15 March 2021	16	32	155 W 155,000 mW 0.208 hp 0.155 kW	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3 GHz 3,000 MHz 3,000,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz
7443P	EPYC	$ 1,337.00 € 1,203.30 £ 1,082.97 ¥ 138,152.21	15 March 2021	24	48	200 W 200,000 mW 0.268 hp 0.2 kW	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.85 GHz 2,850 MHz 2,850,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
7543P	EPYC	$ 2,730.00 € 2,457.00 £ 2,211.30 ¥ 282,090.90	15 March 2021	32	64	225 W 225,000 mW 0.302 hp 0.225 kW	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.8 GHz 2,800 MHz 2,800,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz
7713P	EPYC	$ 5,010.00 € 4,509.00 £ 4,058.10 ¥ 517,683.30	15 March 2021	64	128	225 W 225,000 mW 0.302 hp 0.225 kW	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.675 GHz 3,675 MHz 3,675,000 kHz
	Multiprocessors (dual-socket)
72F3	EPYC	$ 2,468.00 € 2,221.20 £ 1,999.08 ¥ 255,018.44	15 March 2021	8	16	180 W 180,000 mW 0.241 hp 0.18 kW	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.7 GHz 3,700 MHz 3,700,000 kHz	4.1 GHz 4,100 MHz 4,100,000 kHz
7313	EPYC	$ 1,083.00 € 974.70 £ 877.23 ¥ 111,906.39	15 March 2021	16	32	155 W 155,000 mW 0.208 hp 0.155 kW	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3 GHz 3,000 MHz 3,000,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz
7343	EPYC	$ 1,565.00 € 1,408.50 £ 1,267.65 ¥ 161,711.45	15 March 2021	16	32	190 W 190,000 mW 0.255 hp 0.19 kW	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	3.2 GHz 3,200 MHz 3,200,000 kHz	3.9 GHz 3,900 MHz 3,900,000 kHz
73F3	EPYC	$ 3,521.00 € 3,168.90 £ 2,852.01 ¥ 363,824.93	15 March 2021	16	32	240 W 240,000 mW 0.322 hp 0.24 kW	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.5 GHz 3,500 MHz 3,500,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
7413	EPYC	$ 1,825.00 € 1,642.50 £ 1,478.25 ¥ 188,577.25	15 March 2021	24	48	180 W 180,000 mW 0.241 hp 0.18 kW	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.65 GHz 2,650 MHz 2,650,000 kHz	3.6 GHz 3,600 MHz 3,600,000 kHz
7443	EPYC	$ 2,010.00 € 1,809.00 £ 1,628.10 ¥ 207,693.30	15 March 2021	24	48	200 W 200,000 mW 0.268 hp 0.2 kW	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.85 GHz 2,850 MHz 2,850,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
7453	EPYC	$ 1,570.00 € 1,413.00 £ 1,271.70 ¥ 162,228.10	15 March 2021	28	56	225 W 225,000 mW 0.302 hp 0.225 kW	14 MiB 14,336 KiB 14,680,064 B 0.0137 GiB	64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB	2.75 GHz 2,750 MHz 2,750,000 kHz	3.45 GHz 3,450 MHz 3,450,000 kHz
74F3	EPYC	$ 2,900.00 € 2,610.00 £ 2,349.00 ¥ 299,657.00	15 March 2021	24	48	240 W 240,000 mW 0.322 hp 0.24 kW	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.2 GHz 3,200 MHz 3,200,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
7513	EPYC	$ 2,840.00 € 2,556.00 £ 2,300.40 ¥ 293,457.20	15 March 2021	32	64	200 W 200,000 mW 0.268 hp 0.2 kW	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	128 MiB 131,072 KiB 134,217,728 B 0.125 GiB	2.6 GHz 2,600 MHz 2,600,000 kHz	3.65 GHz 3,650 MHz 3,650,000 kHz
7543	EPYC	$ 3,761.00 € 3,384.90 £ 3,046.41 ¥ 388,624.13	15 March 2021	32	64	225 W 225,000 mW 0.302 hp 0.225 kW	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.8 GHz 2,800 MHz 2,800,000 kHz	3.7 GHz 3,700 MHz 3,700,000 kHz
75F3	EPYC	$ 4,860.00 € 4,374.00 £ 3,936.60 ¥ 502,183.80	15 March 2021	32	64	280 W 280,000 mW 0.375 hp 0.28 kW	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.95 GHz 2,950 MHz 2,950,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
7643	EPYC	$ 4,995.00 € 4,495.50 £ 4,045.95 ¥ 516,133.35	15 March 2021	48	96	225 W 225,000 mW 0.302 hp 0.225 kW	24 MiB 24,576 KiB 25,165,824 B 0.0234 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.3 GHz 2,300 MHz 2,300,000 kHz	3.6 GHz 3,600 MHz 3,600,000 kHz
7663	EPYC	$ 6,366.00 € 5,729.40 £ 5,156.46 ¥ 657,798.78	15 March 2021	56	112	240 W 240,000 mW 0.322 hp 0.24 kW	28 MiB 28,672 KiB 29,360,128 B 0.0273 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.5 GHz 3,500 MHz 3,500,000 kHz
7713	EPYC	$ 7,060.00 € 6,354.00 £ 5,718.60 ¥ 729,509.80	15 March 2021	64	128	225 W 225,000 mW 0.302 hp 0.225 kW	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2 GHz 2,000 MHz 2,000,000 kHz	3.675 GHz 3,675 MHz 3,675,000 kHz
7763	EPYC	$ 7,890.00 € 7,101.00 £ 6,390.90 ¥ 815,273.70	15 March 2021	64	128	280 W 280,000 mW 0.375 hp 0.28 kW	32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.45 GHz 2,450 MHz 2,450,000 kHz	3.5 GHz 3,500 MHz 3,500,000 kHz
	Frequency-optimized SKUs
72F3	EPYC	$ 2,468.00 € 2,221.20 £ 1,999.08 ¥ 255,018.44	15 March 2021	8	16	180 W 180,000 mW 0.241 hp 0.18 kW	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.7 GHz 3,700 MHz 3,700,000 kHz	4.1 GHz 4,100 MHz 4,100,000 kHz
73F3	EPYC	$ 3,521.00 € 3,168.90 £ 2,852.01 ¥ 363,824.93	15 March 2021	16	32	240 W 240,000 mW 0.322 hp 0.24 kW	8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.5 GHz 3,500 MHz 3,500,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
74F3	EPYC	$ 2,900.00 € 2,610.00 £ 2,349.00 ¥ 299,657.00	15 March 2021	24	48	240 W 240,000 mW 0.322 hp 0.24 kW	12 MiB 12,288 KiB 12,582,912 B 0.0117 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	3.2 GHz 3,200 MHz 3,200,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
75F3	EPYC	$ 4,860.00 € 4,374.00 £ 3,936.60 ¥ 502,183.80	15 March 2021	32	64	280 W 280,000 mW 0.375 hp 0.28 kW	16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB	256 MiB 262,144 KiB 268,435,456 B 0.25 GiB	2.95 GHz 2,950 MHz 2,950,000 kHz	4 GHz 4,000 MHz 4,000,000 kHz
Count: 19

SKU Comparison

Below are a number of SKU comparison graphs based on their specifications.

Loading...

References

↑ "AMD EPYC™ 7003 Series CPUs Set New Standard as Highest Performance Server Processor" (Press release). AMD.com. March 15, 2021. Retrieved April 2021.
↑ Hilgeman, Martin. "Innovator Insights: AMD Epyc for High Performance Computing Workloads". HPC-AI conference 2019, September 16, 2019.
↑ "AMD EPYC™ Family of Processors Claim Information". AMD.com. Retrieved May 2021.
↑ "The Tour of Italy with EPYC Milan: Interview with AMD's Forrest Norrod. anandtech.com. Retrieved May 2021.
↑ ^5.0 ^5.1 "Preliminary Processor Programming Reference (PPR) for AMD Family 19h Model 01h, Revision B1 Processors", AMD Publ. #55898, Rev. 0.35, February 5, 2021
↑ "High Performance Computing (HPC) Tuning Guide for AMD EPYC™ 7003 Series Processors", AMD Publ. #57091, Rev. 2.0, March 2021
↑ ^7.0 ^7.1 ^7.2 "Memory Population Guidelines for AMD EPYC™ 7003 Series Processors", AMD Publ. #56873, Rev. 0.70, November 2020

designer	AMD +
first announced	January 12, 2021 +
first launched	March 15, 2021 +
instance of	core +
isa	x86-64 +
manufacturer	TSMC + and GlobalFoundries +
microarchitecture	Zen 3 +
name	Milan +
package	SP3 + and FCLGA-4094 +
socket	SP3 + and LGA-4094 +
technology	CMOS +
word size	64 bit (8 octets, 16 nibbles) +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas