Edit Values
FT3b
General Info
Designer	AMD
Introduction	June 4, 2014 (launched)
Market	Mobile, Embedded
Microarchitecture	Puma
TDP	25 W 25,000 mW 0.0335 hp 0.025 kW
Package
Name	BGA-769
Type	Organic Micro Ball Grid Array
Contacts	769
Dimension	24.5 mm 2.45 cm 0.965 in × 24.5 mm 2.45 cm 0.965 in
Pitch	0.65 mm 0.0256 in

FT3b is a BGA-769 package for low power AMD microprocessors with an integrated north bridge, graphics processor, and controller hub targeting the notebook, tablet, all-in-one desktop, and embedded segment. FT3b succeeded the FT3 package and was superseded by the FT4 package.

All processors in the FT3b package, codename "Beema", "Mullins", "Steppe Eagle", "Crowned Eagle", and "Carrizo-L", are members of AMD's Family 16h with CPU cores based on the Puma microarchitecture, and are fabricated on a 28 nm SOI process.

The FT3b package is mechanically and electrically compatible with the FT3 package for processors based on the earlier Jaguar microarchitecture.

Features

• 769-pin lidless micro ball grid array package, 0.65-1.1 mm multi-pitch, 24.5 × 24.5 mm, organic substrate

• 64/72 bit DDR3 SDRAM interface up to 933 MHz, PC3-14900 (DDR3-1866), 14.9 GB/s
  • Up to 2 SR/DR UDIMMs or SODIMMs, ECC supported
  • JEDEC 1.5V, 1.35V, 1.25V
  • AMD Memory Controller PowerCap

• PCIe Gen 1.0 and 2.0 (5 GT/s)
  • One x4 external graphics card link
  • Configurable x4 General Purpose Ports (1x4, 2x2, 1x2 + 2x1, 4x1)

• Two independent display controllers
  • Two single link digital display interfaces
  • DisplayPort 1.2 up to 4096 × 2160 at 30 Hz, 30 bpp
  • Single link DVI up to 1920 × 1200 at 60 Hz, 24 bpp
  • Integrated LVDS interface
  • HDMI, HDCP, eDP 1.4, DP++, 3D video, DP audio, Aux Channel
  • VGA/DAC interface, up to 2048 × 1536 at 60 Hz
  • Miracast-certified, one wireless display up to 1920 × 1080, HDCP 2

• Integrated Controller Hub
  • 2 × USB 1.1, 2.0, 3.0 (5 Gb/s)
  • 8 × USB 1.1, 2.0
  • 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s)
  • 2 × 1 Gigabit Ethernet, multiplexed with GPP
  • SD 3.0 interface, SMBus, LPC, HD audio, 4 × UART, Serial IRQ, SPI, GPIO

• Power Management
  • AMD AllDay power technology
  • ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
  • PCIe power gating
  • PCIe speed power policy
  • AMD Turbo CORE technology 3.0 with per core power gating

• Thermal Controls
  • Sideband temperature control
  • Hardware thermal control
  • Local hardware thermal control
  • DRAM thermal protection
  • Fan control

Processors using package FT3b

• AMD A-Series
• AMD E-Series
• AMD G-Series 2nd Gen
• AMD G-Series LX Family

	List of all FT3b-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
Count: 0

Package Diagram

See Package FT3.

Pin Map

See Package FT3.

References

• "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 16h Models 30h-3Fh Processors", AMD Publ. #52740, Rev. 3.06, March 18, 2016
• "Revision Guide for AMD Family 16h Models 30h-3Fh Processors", AMD Publ. #53072, Rev. 3.00, May 2, 2014
• "Product Brief: 1st and 2nd Generation AMD Embedded G-Series System-on-Chip (SOC)", PID 169776-A, 2015
• "Product Brief: AMD Embedded G-Series LX Family SOCs", PID 1710902-C, 2017

See also

• Package FT3
• Package FT4