MediaTek Dimensity
Developer	MediaTek, Arm Holdings
Manufacturer	TSMC
Type	System on chips
Introduction	November 26, 2019 (announced)
Architecture	Multicore 64-bit ARM SoCs
ISA	ARMv8
µarch	Cortex-A55, Cortex-A76, Cortex-A77, Cortex-A78
Word size	64 bit 8 octets 16 nibbles
Process	7 nm 0.007 μm 7.0e-6 mm , 6 nm 0.006 μm 6.0e-6 mm
Technology	CMOS
←	→
Helio Genio	Kompanio

Dimensity is a family of 64-bit multi-core ARM system on chips developed by MediaTek announced in 2019, serving as a sucessor to the Helio family.

Dimensity is MediaTek's flagship family of SoCs presenting their highest-performance and largest selection of features.

Overview

Dimensity is the successor to Helio, a family of high-performance mobile SoCs first announced in late 2019.

MediaTek Dimensity Series

• ARMv8.2-A

• Dimensity 700 Series
• Dimensity 800 Series
• Dimensity 900 Series
• Dimensity 1000 Series

• Dimensity 6000 Series
• Dimensity 7000 Series
• Dimensity 8000 Series
• Dimensity 9000 Series

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Dimensity 700 (MT6833/G/V) • 7nm (TSMC N7) • Q1 2021 2× Cortex-A76 @2.2GHz + 6× Cortex-A55 @2.0GHz Mali-G57 MC2 @950MHz (121.6 GFLOPS in FP32) Dimensity 720 (MT6853V/Z/N) • Q3 2020 2× Cortex-A76 @2.0GHz + 6× Cortex-A55 @2.0GHz Mali-G57 MC3 @730MHz (140.2 GFLOPS in FP32) Dimensity 800 (MT6873) • 7nm (TSMC N7) • Q2 2020 4× Cortex-A76 @2.0GHz + 4× Cortex-A55 @2.0GHz Mali-G57 MC4 @748MHz (191.5 GFLOPS in FP32) Dimensity 800U (MT6853T/V) • Q3 2020 2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz Mali-G57 MC3 @950MHz (182.4 GFLOPS in FP32) Dimensity 810 (MT6833P/GP/V) • 6nm (TSMC N6) • Q3 2021 2× Cortex-A76 @2.4GHz + 6× Cortex-A55 @2.0GHz Mali-G57 MC2 @1068MHz (136.7 GFLOPS in FP32) Dimensity 820 (MT6875) • 7nm (TSMC N7) • Q2 2020 4× Cortex-A76 @2.6GHz + 4× Cortex-A55 @2.0GHz Mali-G57 MC5 @900MHz (288 GFLOPS in FP32) Dimensity 900 (MT6877/V) • 6nm (TSMC N6) • Q2 2021 2× Cortex-A78 @2.4GHz + 6× Cortex-A55 @2.0GHz Mali-G68 MC4 @900MHz (230.4 GFLOPS in FP32) Dimensity 920 (MT6877/T/V/TZA) • Q3 2021 2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32) Dimensity 930 (MT6855 MT6855V/AZA) • Q3 2022 2× Cortex-A78 @2.2GHz + 6× Cortex-A55 @2.0GHz IMG BXM-8-256 @950MHz • 108MP Single Camera

Dimensity 1000 (MT6889) • 7nm (TSMC N7) • Q2 2020 4× Cortex-A77 @2.6GHz + 4× Cortex-A55 @2.0GHz Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32) Dimensity 1000+ (MT6889Z/CZA) • Q2 2020 Dimensity 1000C (MT6883Z/CZA) • Q3 2020 4× Cortex-A77 @2.0GHz + 4× Cortex-A55 @2.0GHz Mali-G57 MC5 @654MHz (209.3 GFLOPS in FP32) Dimensity 1000L (MT6885Z/CZA) • Q1 2020 4× Cortex-A77 @2.2GHz + 4× Cortex-A55 @2.0GHz Mali-G77 MC7 @695MHz (311.4 GFLOPS in FP32) Dimensity 1050 (MT6879/V/ZA) • 6nm (TSMC N6) • Q3 2022 2× Cortex-A78 @2.5GHz + 6× Cortex-A55 @2.0GHz Mali-G610 MC3 @1.0GHz (384 GFLOPS in FP32) Dimensity 1080 (MT6877/V) • Q4 2022 2× Cortex-A78 @2.6GHz + 6× Cortex-A55 @2.0GHz Mali-G68 MC4 @950MHz (243.2 GFLOPS in FP32) Dimensity 1100 (MT6891/Z) • Q1 2021 4× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz Mali-G77 MC9 @836MHz (481.5 GFLOPS in FP32) Dimensity 1200 (MT6893/Z) • 1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32) Dimensity 1300 (MT6893Z_Z/_T/CZA) • Q2 2022 1× Cortex-A78 @3.0GHz + 3× Cortex-A78 @2.6GHz + 4× Cortex-A55 @2.0GHz Mali-G77 MC9 @886MHz (510.3 GFLOPS in FP32)

Models

	List of Dimensity Processors
	Main processor						Graphics
Model	Part number	Process	Cores	CPU	Frequency	Launched	GPU	Frequency
1000	MT6889	7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A77,  Cortex-A55	2.6 GHz 2,600 MHz 2,600,000 kHz ,  2 GHz 2,000 MHz 2,000,000 kHz	2020	Mali-G77
1000L	MT6885Z	7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A77,  Cortex-A55	2.2 GHz 2,200 MHz 2,200,000 kHz ,  2 GHz 2,000 MHz 2,000,000 kHz	2020	Mali-G77
800		7 nm 0.007 μm 7.0e-6 mm	8	Cortex-A76,  Cortex-A55	2 GHz 2,000 MHz 2,000,000 kHz	March 2020	Mali-G57
Count: 3

See also

• Apple • Ax
• MediaTek • Helio
• Qualcomm • Kryo