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Helio A22
General Info
Designer	MediaTek, ARM Holdings
Manufacturer	TSMC
Model Number	Helio A22
Market	Mobile, Embedded
Introduction	July 17, 2018 (announced) July 17, 2018 (launched)
General Specs
Family	Helio
Series	Helio A
Frequency	2,000 MHz
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53
Core Name	Cortex-A53
Process	12 nm
Technology	CMOS
Word Size	64 bit
Cores	4
Threads	4
Max Memory	6 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)

Helio A22 is a 64-bit quad-core ARM LTE system on a chip designed by MediaTek and launched in mid-2018. Manufactured on TSMC's 12 nm process, this SoC integrates four Cortex-A53 cores operating at up to GHz and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a PowerVR GE8320 IGP. The chip has a modem supporting LTE cat 7 download and cat 13 upload.

Memory controller

The maximum memory is 4 GiB if LPDDR3 (1x32-bit) is used and 6 GiB if LPDDR4X (2x16-bit) is used.

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3200 Supports ECC No Max Mem 6 GiB Controllers 1 Channels 2 Width 16 bit Max Bandwidth 13.9 GiB/s 14,233.6 MiB/s 14.925 GB/s 14,925.011 MB/s 0.0136 TiB/s 0.0149 TB/s Bandwidth Single 6.95 GiB/s Double 13.9 GiB/s

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU PowerVR GE8320 Designer Imagination Technologies Output DSI Max Resolution DSI 1600x720 Standards Direct3D 9.3 OpenGL 3.0 OpenCL 1.2 OpenGL ES 3.0 Vulkan 1.0

• Encoding
  • H.264 (1080P @ 30 fps)
• Decoding
  • H.264, H.265 / HEVC
    • 1080P @ 30 fps

ISP

• 21MP, 13+8MP
  • 21MP@30fps; 13MP+8MP@30fps

Connectivity

• WiFi
  • Integrated 802.11a/b/g/n/ac
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE, HSPA+
  • Downlink
    • Cat-7, 300 Mbps
  • Uplink
    • Cat-13, 150 Mbps

Location

• GPS
  • Beidou, Galileo, Glonass