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Cannon Lake µarch
General Info
Arch Type	CPU
Designer	Intel
Manufacturer	Intel
Introduction	2017
Process	10 nm
Instructions
ISA	x86-64
Cores
Core Names	Cannon Lake Y, Cannon Lake U
Succession
Kaby Lake Ice Lake

Cannon Lake (CNL) (formerly Skymont) is a planned microarchitecture by Intel as a successor to Kaby Lake. Cannon Lake is expected to be fabricated using a 10 nm process and is set to be introduced in the fourth quarter of 2017. Cannon Lake is the "Process" microarchitecture as part of Intel's PAO model.

For mobile, Cannon Lake is expected to be branded as 8th Generation Intel Core i3, Core i5. and Core i7 processors.

Process Technology

Cannon Lake is manufactured on Intel's 10 nm process (P1274). Intel's 10 nm process is the first high-volume manufacturing process to employ Self-Aligned Quad Patterning (SAQP) (goes under the "Hyper-Scaling" marketing name). Intel's 10nm features a 0.0367 µm² SRAM bit cell.

Scaling:

	Broadwell	Cannon Lake	Δ
	14 nm	10 nm
Fin Pitch	42 nm	34	0.81x
Fin Width​	8 nm	7 nm	0.88x
Fin Height​	42 nm	53 nm	1.24x
Gate Pitch	70 nm	54 nm	0.77x
Interconnect Pitch	52 nm	36 nm	0.69x
Cell Height	399 nm	272 nm	0.68x

Codenames

Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.

Core	Abbrev	Description	Graphics	Target
Cannon Lake Y	CNL-Y	Extremely low power	GT2	2-in-1s detachable, tablets, and computer sticks
Cannon Lake U	CNL-U	Ultra-low Power	GT2/GT3	Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room
Cannon Lake H	CNL-H	High-performance Graphics	GT2/GT3	Ultimate mobile performance, mobile workstations
Cannon Lake S	CNL-S	Performance-optimized lifestyle	GT2/GT3	Desktop performance to value, AiOs, and minis
Cannon Lake DT	CNL-DT	Workstation	GT2	Workstations & entry-level servers

Architecture

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Key changes from Kaby Lake

• 10 nm process (from 14 nm)
• Mainstream chipset
  • 200 Series chipset → 300 Series chipset
    • Integrated Programmable (Open FW SDK) Quad-Core Audio DSP
    • Soundwire Digital Audio Interface
    • Integrated USB 3.1 (10 Gib/s)
      • Up to 6 ports
    • Integrated Intel wireless controller (IEEE 802.11ac)
    • Integrated SDXC 3.0 controller
    • Thunderbolt 3.0(Titan Ridge) with DisplayPort 1.4 support
    • C10 & S0ix Support for Modern Standby

• Gen9.5 → Gen10 graphics
• Gen10 GPUs
  • HD Graphics 610 → HD Graphics 710 (24 Execution Units, 2x EUs from Kaby Lake)
  • HD Graphics 615 → HD Graphics 715 (40 Execution Units, 1.7x EUs from Kaby Lake)
  • HD Graphics 620 → HD Graphics 720 (40 Execution Units, 1.7x EUs from Kaby Lake)
  • HD Graphics 630 → HD Graphics 730 (40 Execution Units, 1.7x EUs from Kaby Lake)
  • HD Graphics P630 → HD Graphics P730 (40 Execution Units, 1.7x EUs from Kaby Lake)
  • Iris Plus Graphics 640 → Iris Plus Graphics 740 (unknown change)
  • Iris Plus Graphics 650 → Iris Plus Graphics 750 (unknown change)

All Cannon Lake Chips

	Cannon Lake Chips
	Main processor													IGP			Major Feature Diff
Model	Launched	Price	Family	Platform	Core	C	T	L3$	L4$	TDP	Freq	Turbo	Max Mem	Name	Freq	Turbo	TBT	HT	AVX2	TXT	TSX	vPro	VT-d
	Uniprocessors
M3-8114Y			Core M3		Cannon Lake Y	2	4				1.5 GHz 1,500 MHz 1,500,000 kHz		16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB	UHD Graphics ?	300 MHz 0.3 GHz 300,000 KHz		✔	✔	✔	✘	✘	✘	✔
i3-8121U	15 May 2018		Core i3		Cannon Lake U	2	4	4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB		15 W 15,000 mW 0.0201 hp 0.015 kW	2.2 GHz 2,200 MHz 2,200,000 kHz	3.2 GHz 3,200 MHz 3,200,000 kHz	32 GiB 32,768 MiB 33,554,432 KiB 34,359,738,368 B 0.0313 TiB				✔	✔	✔	✘	✘	✘	✔
	No Cannon Lake Chips have been released yet.
Count: 2

References

• Mark Bohr, Intel. Intel Technology and Manufacturing Day. Mar 28, 2017.

See also

• AMD's Zen