Template:mpu Atom Z670 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in mid-2011. The Z670, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z670 incorporates a GMA 600 IGP operating at 400 MHz.

This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.

Cache

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 56 KiB 57,344 B 0.0547 MiB L1I$ 32 KiB 32,768 B 0.0313 MiB 1x32 KiB 8-way set associative   L1D$ 24 KiB 24,576 B 0.0234 MiB 1x24 KiB 6-way set associative write-back L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     1x512 KiB 8-way set associative

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR-400, DDR2-800 Supports ECC No Max Mem 2 GiB Controllers 1 Channels 1 Width 32 bit Max Bandwidth 2.98 GiB/s 3,051.52 MiB/s 3.2 GB/s 3,199.751 MB/s 0.00291 TiB/s 0.0032 TB/s Bandwidth Single 2.98 GiB/s Physical Address (PAE) 32 bit

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
	USB Revision 2.0 Ports 4 UART GP I/O Yes

Graphics

This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU PowerVR SGX535 Designer Imagination Technologies Max Displays 1 Max Memory 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB Frequency 200 MHz 0.2 GHz 200,000 KHz Output LVDS Max Resolution LVDS 1366x768 Standards Direct3D 9.0c OpenGL 2.1 OpenGL ES 1.1, 2.0 OpenVG 1.1 Additional Features Intel Clear Video

• Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
• Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute HT Hyper-Threading BPT Burst Performance Technology EIST Enhanced SpeedStep Technology

Die Shot

See also: Bonnell § Lincroft Die

• 45 nm process