Semiconductor & Computer Engineering
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MSM6xxx - Qualcomm
| Qualcomm MSM5500 | |
| Developer | Qualcomm |
| Introduction | March 20, 2001 (announced) 2002 (launch) |
| Architecture | Mobile system-on-a-chip |
| ISA | ARMv4 |
| µarch | ARM7TDMI |
| Word size | 32 bit 4 octets
8 nibbles |
| Process | 180 nm 0.18 μm , 130 nm1.8e-4 mm 0.13 μm , 90 nm1.3e-4 mm 0.09 μm
9.0e-5 mm |
| Technology | CMOS |
| Package | FBGA-320 |
| Succession | |
| ← | → |
| MSM5100 | MSM7xxx |
MSM6xxx was a family of mobile 2G/3G ARM system on chips designed by Qualcomm and introduced in 2002.
Overview
Qualcomm announced the MSM6xxx family of system on chips in March of 2001. The chips offered key technologies such as second-generation (2G) and third-generation (3G) wireless technologies and wireless global roaming. All chips have support for gpsOne position location capabilities, Bluetooth connectivity capabilities, UMTS Subscriber Identity Module (SIM), Removable User Identity Module (R-UIM) and advanced multimedia features such as Qtunes audio decoders, MPEG, MP3, and Compact Media Extension (CME) MIDI software support.
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Facts about "MSM6xxx - Qualcomm"
| designer | Qualcomm + and ARM Holdings + |
| first announced | March 20, 2001 + |
| first launched | 2002 + |
| full page name | qualcomm/msm6xxx + |
| instance of | system on a chip family + |
| instruction set architecture | ARMv4 + and ARMv5 + |
| main designer | Qualcomm + |
| manufacturer | TSMC + and IBM + |
| microarchitecture | ARM7TDMI + and ARM926EJ-S + |
| name | Qualcomm MSM6xxx + |
| package | FBGA-208 +, CSP-225 +, CSP-351 + and CSP-409 + |
| process | 250 nm (0.25 μm, 2.5e-4 mm) +, 180 nm (0.18 μm, 1.8e-4 mm) +, 130 nm (0.13 μm, 1.3e-4 mm) +, 90 nm (0.09 μm, 9.0e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) + |
| technology | CMOS + |
| word size | 32 bit (4 octets, 8 nibbles) + |