Revision as of 03:05, 4 August 2020

Ryzen 5 PRO 4650U is a 64-bit hexa-core entry-level performance x86 mobile microprocessor introduced by AMD in mid-2020. Fabricated on TSMC's 7-nanometer process based on AMD's Zen 2 microarchitecture, the PRO 4650U operates at a base frequency of 2.1 GHz with a TDP of 15 W and a Boost frequency of up to 4.0 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4650U integrates a Radeon Vega 6 Graphics operating at up to 1.5 GHz.

This model supports a configurable TDP-down of 10 W and TDP-up of 25 W.

Compared to its mainstream counterparts, the PRO 4650U includes a set of enterprise-oriented features such as Memory Guard, image stability, software stability, and manageability support.

Cache

Main article: Zen 2 § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 384 KiB 393,216 B 0.375 MiB L1I$ 192 KiB 196,608 B 0.188 MiB 6x32 KiB 8-way set associative   L1D$ 192 KiB 196,608 B 0.188 MiB 6x32 KiB 8-way set associative write-back L2$ 3 MiB 3,072 KiB 3,145,728 B 0.00293 GiB     6x512 KiB 8-way set associative write-back L3$ 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB     2x4 MiB

Memory controller

This SoC features two memory controllers, each supporting DDR4 or LPDDR4x. This chip supports up to 64 GiB of dual-channel DDR4 memory with data rates of up to 3200 MT/s (51.2 GB/s) or up to 32 GiB of quad-channel LPDDR4x with data rates of up to 4266 MT/s (68.27 GB/s).

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-3200 Max Mem 64 GiB Controllers 2 Channels 4 Max Bandwidth 68.27 GiB/s 69,908.48 MiB/s 73.304 GB/s 73,304.354 MB/s 0.0667 TiB/s 0.0733 TB/s Bandwidth Single 17.88 GiB/s Double 34.13 GB/s Quad 68.27 GB/s

Expansions

This processor has 16 PCIe lanes, 1x8 designated for a discrete GPU, 1x4 additional lanes for storage (e.g., NVMe), and 1x4 additional lanes reserved for additional peripherals such as WiFi or LTE.

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0 Max Lanes: 16 Configuration: 1x8+1x4+1x4, 2x4+1x4+1x4

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Radeon Vega 6 Designer AMD Execution Units 6 Max Displays 4 Unified Shaders 384 Burst Frequency 1,500 MHz 1.5 GHz 1,500,000 KHz Output DP, HDMI Standards DirectX 12.1

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 SSE4.1 Streaming SIMD Extensions 4.1 SSE4.2 Streaming SIMD Extensions 4.2 SSE4a Streaming SIMD Extensions 4a AVX Advanced Vector Extensions AVX2 Advanced Vector Extensions 2 ABM Advanced Bit Manipulation BMI1 Bit Manipulation Instruction Set 1 BMI2 Bit Manipulation Instruction Set 2 FMA3 3-Operand Fused-Multiply-Add AES AES Encryption Instructions RdRand Hardware RNG SHA SHA Extensions ADX Multi-Precision Add-Carry CLMUL Carry-less Multiplication Extension F16C 16-bit Floating Point Conversion x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute SMT Simultaneous Multithreading AMD-Vi AMD-Vi (I/O MMU virtualization) AMD-V AMD Virtualization TSME Transparent SME SenseMI SenseMI Technology

Die

Main article: Zen 2 § Die

Renoir microprocessors are fabricated on TSMC's 7-nanometer process. This SoC integrates 9.8 billion transistors on a single 156 mm² monolithic die which includes both the Zen 2 CPU cores along with the Vega GPU and various other additional components.

• 7-nanometer process (N7)
• 9,800,000,000 transistors
• 156 mm² die size