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Difference between revisions of "amd/ryzen 9/4900hs"
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{{amd title|Ryzen 9 4900HS}} | {{amd title|Ryzen 9 4900HS}} | ||
− | {{chip}} | + | {{chip |
+ | |name=Ryzen 9 4900HS | ||
+ | |no image=No | ||
+ | |designer=AMD | ||
+ | |manufacturer=TSMC | ||
+ | |model number=4900HS | ||
+ | |market=Mobile | ||
+ | |first announced=March 16, 2020 | ||
+ | |first launched=March 16, 2020 | ||
+ | |family=Ryzen 9 | ||
+ | |series=4000 | ||
+ | |locked=Yes | ||
+ | |frequency=3,000 MHz | ||
+ | |turbo frequency=4,300 MHz | ||
+ | |clock multiplier=30 | ||
+ | |isa=x86-64 | ||
+ | |isa family=x86 | ||
+ | |microarch=Zen 2 | ||
+ | |core name=Renoir | ||
+ | |process=7 nm | ||
+ | |transistors=9,800,000,000 | ||
+ | |technology=CMOS | ||
+ | |die area=156 mm² | ||
+ | |word size=64 bit | ||
+ | |core count=8 | ||
+ | |thread count=16 | ||
+ | |max memory=64 GiB | ||
+ | |max cpus=1 | ||
+ | |tdp=35 W | ||
+ | |tcase min=0 °C | ||
+ | |tcase max=105 °C | ||
+ | |package name 1=amd,socket_fp6 | ||
+ | }} | ||
'''Ryzen 9 4900HS''' is a {{arch|64}} [[octa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2020]]. Fabricated on [[N7|TSMC's 7-nanometer process]] based on AMD's {{amd|Zen 2|Zen 2 microarchitecture|l=arch}}, the 4900HS operates at a base frequency of 3.0 GHz with a [[TDP]] of 35 W and a {{amd|Precision Boost|Boost}} frequency of up to 4.3 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4900HS integrates a {{amd|Radeon Vega 8}} Graphics operating at up to 1.75 GHz. | '''Ryzen 9 4900HS''' is a {{arch|64}} [[octa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2020]]. Fabricated on [[N7|TSMC's 7-nanometer process]] based on AMD's {{amd|Zen 2|Zen 2 microarchitecture|l=arch}}, the 4900HS operates at a base frequency of 3.0 GHz with a [[TDP]] of 35 W and a {{amd|Precision Boost|Boost}} frequency of up to 4.3 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4900HS integrates a {{amd|Radeon Vega 8}} Graphics operating at up to 1.75 GHz. | ||
This processor is a lower-power version of the {{\\|4900H}}, featuring slightly lower base and turbo frequencies. | This processor is a lower-power version of the {{\\|4900H}}, featuring slightly lower base and turbo frequencies. |
Revision as of 14:10, 9 May 2020
Edit Values | |
Ryzen 9 4900HS | |
General Info | |
Designer | AMD |
Manufacturer | TSMC |
Model Number | 4900HS |
Market | Mobile |
Introduction | March 16, 2020 (announced) March 16, 2020 (launched) |
Shop | Amazon |
General Specs | |
Family | Ryzen 9 |
Series | 4000 |
Locked | Yes |
Frequency | 3,000 MHz |
Turbo Frequency | 4,300 MHz |
Clock multiplier | 30 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Zen 2 |
Core Name | Renoir |
Process | 7 nm |
Transistors | 9,800,000,000 |
Technology | CMOS |
Die | 156 mm² |
Word Size | 64 bit |
Cores | 8 |
Threads | 16 |
Max Memory | 64 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
TDP | 35 W |
Tcase | 0 °C – 105 °C |
Packaging | |
Unknown package "amd,socket_fp6" |
Ryzen 9 4900HS is a 64-bit octa-core high-end performance x86 mobile microprocessor introduced by AMD in early 2020. Fabricated on TSMC's 7-nanometer process based on AMD's Zen 2 microarchitecture, the 4900HS operates at a base frequency of 3.0 GHz with a TDP of 35 W and a Boost frequency of up to 4.3 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4900HS integrates a Radeon Vega 8 Graphics operating at up to 1.75 GHz.
This processor is a lower-power version of the 4900H, featuring slightly lower base and turbo frequencies.
Facts about "Ryzen 9 4900HS - AMD"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Ryzen 9 4900HS - AMD#pcie + |
base frequency | 3,000 MHz (3 GHz, 3,000,000 kHz) + |
clock multiplier | 30 + |
core count | 8 + |
core family | 23 + |
core model | 96 + |
core name | Renoir + |
core stepping | A1 + |
designer | AMD + |
die area | 156 mm² (0.242 in², 1.56 cm², 156,000,000 µm²) + |
family | Ryzen 9 + |
first announced | March 16, 2020 + |
first launched | March 16, 2020 + |
full page name | amd/ryzen 9/4900hs + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has amd amd-v technology | true + |
has amd amd-vi technology | true + |
has amd sensemi technology | true + |
has ecc memory support | false + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology + |
has locked clock multiplier | true + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
integrated gpu | Radeon Vega 8 + |
integrated gpu designer | AMD + |
integrated gpu execution units | 8 + |
integrated gpu max frequency | 1,750 MHz (1.75 GHz, 1,750,000 KHz) + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) + |
l3$ description | 16-way set associative + |
l3$ size | 8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) + |
ldate | March 16, 2020 + |
manufacturer | TSMC + |
market segment | Mobile + |
max case temperature | 378.15 K (105 °C, 221 °F, 680.67 °R) + |
max cpu count | 1 + |
max memory | 65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) + |
max memory bandwidth | 63.581 GiB/s (65,107.346 MiB/s, 68.27 GB/s, 68,270 MB/s, 0.0621 TiB/s, 0.0683 TB/s) + |
max memory channels | 4 + |
microarchitecture | Zen 2 + |
min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | 4900HS + |
name | Ryzen 9 4900HS + |
package | FP6 + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |
series | 4000 + |
smp max ways | 1 + |
supported memory type | DDR4-3200 + and LPDDR4x-4266 + |
tdp | 35 W (35,000 mW, 0.0469 hp, 0.035 kW) + |
technology | CMOS + |
thread count | 16 + |
transistor count | 9,800,000,000 + |
turbo frequency | 4,300 MHz (4.3 GHz, 4,300,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |