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== Cache == | == Cache == | ||
{{main|nervana/microarchitectures/spring_crest#Memory_Hierarchy|l1=Spring Crest § Cache}} | {{main|nervana/microarchitectures/spring_crest#Memory_Hierarchy|l1=Spring Crest § Cache}} | ||
− | * | + | * 60 MiB of tightly-coupled scratchpad memory |
− | ** | + | ** 24 x 2.5 MiB/core |
== Memory controller == | == Memory controller == | ||
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== Interconnect Topology == | == Interconnect Topology == | ||
The NNP-T 1300 comes in a dual-slot standard PCIe 4.0 card which enables support for only the ring topology. Chips are interconnected using the 16 available {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}}. | The NNP-T 1300 comes in a dual-slot standard PCIe 4.0 card which enables support for only the ring topology. Chips are interconnected using the 16 available {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}}. | ||
+ | |||
+ | == Die == | ||
+ | {{main|nervana/microarchitectures/spring_crest#Die|l1=Spring Crest § Die}} | ||
+ | * 27,000,000,000 transistors | ||
+ | * 680 mm² die size | ||
+ | |||
+ | |||
+ | :[[File:spring crest floorplan.png|400px|link=nervana/microarchitectures/spring_crest#Die]] | ||
== Product Brief == | == Product Brief == | ||
* [[:File:16433-1 NNP-announce NNP-T brief v4.3.pdf|Intel NNP-T Product Brief]] | * [[:File:16433-1 NNP-announce NNP-T brief v4.3.pdf|Intel NNP-T Product Brief]] |
Revision as of 01:38, 1 February 2020
Edit Values | |
NNP-T 1400 | |
NPU with 4 HBM2 stacks | |
General Info | |
Designer | Intel |
Manufacturer | TSMC |
Model Number | NNP-T 1400 |
Market | Server |
Introduction | November 12, 2019 (announced) November 12, 2019 (launched) |
Shop | Amazon |
General Specs | |
Family | NNP |
Series | NNP-T |
Frequency | 1,100 MHz |
Microarchitecture | |
Microarchitecture | Spring Crest |
Process | 16 nm |
Transistors | 27,000,000,000 |
Technology | CMOS |
Die | 680 mm² |
Cores | 24 |
Max Memory | 32 GiB |
Multiprocessing | |
Interconnect | InterChip Link |
Interconnect Links | 16 |
Interconnect Rate | 28 GT/s |
Electrical | |
Power dissipation | 175 W |
Packaging | |
Package | FCBGA-3325 (FCBGA) |
Dimension | 60 mm × 60 mm |
Contacts | 3325 |
NNP-T 1400 is a neural processor designed by Intel Nervana and introduced in late 2019. Fabricated on TSMC 16 nm process based on the Spring Crest microarchitecture, the NNP-T 1400 has the full 24 TPCs enabled along with 60 MiB of scratchpad memory and operates at up to 1.1 GHz. This chip comes in an OAM accelerator card form factor and incorporates 32 GiB of HBM2 memory. This NPU exposes 16 inter-chip links for scale-out capabilities.
Contents
Peak Performance
The NNP-T 1400 comes in an OCP OAM mezzanine card which enables support for various topologies including ring, hybrid cube mesh, and fully connected.
Cache
- Main article: Spring Crest § Cache
- 60 MiB of tightly-coupled scratchpad memory
- 24 x 2.5 MiB/core
Memory controller
Integrated Memory Controller
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Interconnect Topology
The NNP-T 1300 comes in a dual-slot standard PCIe 4.0 card which enables support for only the ring topology. Chips are interconnected using the 16 available inter-chip links.
Die
- Main article: Spring Crest § Die
- 27,000,000,000 transistors
- 680 mm² die size
Product Brief
back image | + |
base frequency | 1,100 MHz (1.1 GHz, 1,100,000 kHz) + |
core count | 24 + |
designer | Intel + |
die area | 680 mm² (1.054 in², 6.8 cm², 680,000,000 µm²) + |
family | NNP + |
first announced | November 12, 2019 + |
first launched | November 12, 2019 + |
full page name | nervana/nnp/nnp-t 1400 + |
has ecc memory support | true + |
instance of | microprocessor + |
ldate | November 12, 2019 + |
main image | + |
main image caption | NPU with 4 HBM2 stacks + |
manufacturer | TSMC + |
market segment | Server + |
max memory | 32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) + |
max memory bandwidth | 1,144.409 GiB/s (1,171,875 MiB/s, 1,228.8 GB/s, 1,228,800 MB/s, 1.118 TiB/s, 1.229 TB/s) + |
max memory channels | 32 + |
microarchitecture | Spring Crest + |
model number | NNP-T 1400 + |
name | NNP-T 1400 + |
package | FCBGA-3325 + |
power dissipation | 175 W (175,000 mW, 0.235 hp, 0.175 kW) + |
process | 16 nm (0.016 μm, 1.6e-5 mm) + |
series | NNP-T + |
smp interconnect | InterChip Link + |
smp interconnect links | 16 + |
smp interconnect rate | 28 GT/s + |
supported memory type | HBM2-2400 + |
technology | CMOS + |
transistor count | 27,000,000,000 + |