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Difference between revisions of "nervana/nnp/nnp-t 1300"
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{{nervana title|NNP-T 1300}}
 
{{nervana title|NNP-T 1300}}
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{{chip}}
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{{chip
 +
|name=NNP-T 1300
 +
|image=spring crest package (front).png
 +
|back image=spring crest package (back).png
 +
|caption=NPU with 4 HBM2 stacks
 +
|designer=Intel
 +
|manufacturer=TSMC
 +
|model number=NNP-T 1300
 +
|market=Server
 +
|first announced=November 12, 2019
 +
|first launched=November 12, 2019
 +
|family=NNP
 +
|series=NNP-T
 +
|frequency=950 MHz
 +
|microarch=Spring Crest
 +
|process=16 nm
 +
|transistors=27,000,000,000
 +
|technology=CMOS
 +
|die area=680 mm²
 +
|core count=22
 +
|max memory=32 GiB
 +
|smp interconnect=InterChip Link
 +
|smp interconnect links=16
 +
|smp interconnect rate=28 GT/s
 +
|power=150 W
 +
|tdp=300 W
 +
|package name 1=intel,fcbga_3325
 +
}}
 
'''NNP-T 1300''' is a [[neural processor]] designed by [[Intel Nervana]] and introduced in late 2019. Fabricated on TSMC [[16 nm process]] based on the {{nervana|Spring Crest|l=arch}} microarchitecture, the NNP-T 1300 has 22 {{nervana|Spring Crest#Tensor Processing Cluster (TPC)|TPCs|l=arch}} along with 55 MiB of scratchpad memory and operates at up to 950 MHz. This chip comes in a PCIe 4.0 [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}} for scale-out capabilities.
 
'''NNP-T 1300''' is a [[neural processor]] designed by [[Intel Nervana]] and introduced in late 2019. Fabricated on TSMC [[16 nm process]] based on the {{nervana|Spring Crest|l=arch}} microarchitecture, the NNP-T 1300 has 22 {{nervana|Spring Crest#Tensor Processing Cluster (TPC)|TPCs|l=arch}} along with 55 MiB of scratchpad memory and operates at up to 950 MHz. This chip comes in a PCIe 4.0 [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}} for scale-out capabilities.

Revision as of 23:34, 31 January 2020

Edit Values
NNP-T 1300
spring crest package (front).png
NPU with 4 HBM2 stacks
General Info
DesignerIntel
ManufacturerTSMC
Model NumberNNP-T 1300
MarketServer
IntroductionNovember 12, 2019 (announced)
November 12, 2019 (launched)
ShopAmazon
General Specs
FamilyNNP
SeriesNNP-T
Frequency950 MHz
Microarchitecture
MicroarchitectureSpring Crest
Process16 nm
Transistors27,000,000,000
TechnologyCMOS
Die680 mm²
Cores22
Max Memory32 GiB
Multiprocessing
InterconnectInterChip Link
Interconnect Links16
Interconnect Rate28 GT/s
Electrical
Power dissipation150 W
TDP300 W
Packaging
PackageFCBGA-3325 (FCBGA)
Dimension60 mm × 60 mm
Contacts3325
spring crest package (back).png

NNP-T 1300 is a neural processor designed by Intel Nervana and introduced in late 2019. Fabricated on TSMC 16 nm process based on the Spring Crest microarchitecture, the NNP-T 1300 has 22 TPCs along with 55 MiB of scratchpad memory and operates at up to 950 MHz. This chip comes in a PCIe 4.0 accelerator card form factor and incorporates 32 GiB of HBM2 memory. This NPU exposes 16 inter-chip links for scale-out capabilities.

Retrieved from "https://en.wikichip.org/w/index.php?title=nervana/nnp/nnp-t_1300&oldid=95681"
Facts about "NNP-T 1300 - Intel Nervana"
RDF feed
back imageFile:spring crest package (back).png +
base frequency950 MHz (0.95 GHz, 950,000 kHz) +
core count22 +
designerIntel +
die area680 mm² (1.054 in², 6.8 cm², 680,000,000 µm²) +
familyNNP +
first announcedNovember 12, 2019 +
first launchedNovember 12, 2019 +
full page namenervana/nnp/nnp-t 1300 +
instance ofmicroprocessor +
ldateNovember 12, 2019 +
main imageFile:spring crest package (front).png +
main image captionNPU with 4 HBM2 stacks +
manufacturerTSMC +
market segmentServer +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
microarchitectureSpring Crest +
model numberNNP-T 1300 +
nameNNP-T 1300 +
packageFCBGA-3325 +
power dissipation150 W (150,000 mW, 0.201 hp, 0.15 kW) +
process16 nm (0.016 μm, 1.6e-5 mm) +
seriesNNP-T +
smp interconnectInterChip Link +
smp interconnect links16 +
smp interconnect rate28 GT/s +
tdp300 W (300,000 mW, 0.402 hp, 0.3 kW) +
technologyCMOS +
transistor count27,000,000,000 +