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Difference between revisions of "amd/microarchitectures/zen 3"
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== Architecture == | == Architecture == | ||
| − | + | Little is currently known about the architectural improvements that is being done for Zen 3. | |
=== Key changes from {{\\|Zen 2}} === | === Key changes from {{\\|Zen 2}} === | ||
* [[7 nm+ process]] (from [[7 nm]]) , 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+. | * [[7 nm+ process]] (from [[7 nm]]) , 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+. | ||
| + | * 32+ MiB unified L3 cache on the 8-core CCD chiplet, previously 16 MiB local to each 4-core CCX. | ||
{{expand list}} | {{expand list}} | ||
| Line 48: | Line 49: | ||
* AMD 'Tech Day', February 22, 2017 | * AMD 'Tech Day', February 22, 2017 | ||
* AMD 2017 Financial Analyst Day, May 16, 2017 | * AMD 2017 Financial Analyst Day, May 16, 2017 | ||
| + | * "[https://www.tomshardware.com/uk/news/amd-zen-3-zen-4-epyc-rome-milan-genoa-architecture-microarchitecture,40561.html AMD Dishes on Zen 3 and Zen 4 Architecture, Milan and Genoa Roadmap]", Tom's Hardware, October 5, 2019 | ||
== See Also == | == See Also == | ||
* AMD {{\\|Zen}} | * AMD {{\\|Zen}} | ||
* Intel {{intel|Tigerlake|l=arch}} | * Intel {{intel|Tigerlake|l=arch}} | ||
Revision as of 15:43, 29 November 2019
| Edit Values | |
| Zen 3 µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | AMD |
| Manufacturer | TSMC |
| Introduction | 2020 |
| Process | 7 nm+ |
| Succession | |
Zen 3 is a planned microarchitecture being developed by AMD as a successor to Zen 2.
Contents
History
Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the Zen microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize 7nm+ process.
Codenames
 |
Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release. |
| Core | C/T | Target |
|---|---|---|
| Milan | ?/? | High-end server multiprocessors |
| Vermeer | ?/? | Mainstream to high-end desktops & enthusiasts market processors |
| Renoir | ?/? | Mainstream desktop & mobile processors with GPU |
Process technology
Zen 3 will be fabricated on TSMC's 7nm+ process.
Architecture
Little is currently known about the architectural improvements that is being done for Zen 3.
Key changes from Zen 2
- 7 nm+ process (from 7 nm) , 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+.
- 32+ MiB unified L3 cache on the 8-core CCD chiplet, previously 16 MiB local to each 4-core CCX.
This list is incomplete; you can help by expanding it.
References
- AMD 'Tech Day', February 22, 2017
- AMD 2017 Financial Analyst Day, May 16, 2017
- "AMD Dishes on Zen 3 and Zen 4 Architecture, Milan and Genoa Roadmap", Tom's Hardware, October 5, 2019
See Also
Facts about "Zen 3 - Microarchitectures - AMD"
| codename | Zen 3 + |
| designer | AMD + |
| first launched | 2020 + |
| full page name | amd/microarchitectures/zen 3 + |
| instance of | microarchitecture + |
| manufacturer | TSMC + |
| microarchitecture type | CPU + |
| name | Zen 3 + |