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Difference between revisions of "intel/core i3/i3-1000g1"
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{{intel title|i3-1000G1}} | {{intel title|i3-1000G1}} | ||
− | {{chip}} | + | {{chip |
+ | |name=Core i3-1000G1 | ||
+ | |image=ice lake y (front).png | ||
+ | |back image=ice lake y (back).png | ||
+ | |caption=Package, front | ||
+ | |designer=Intel | ||
+ | |manufacturer=Intel | ||
+ | |model number=i3-1000G1 | ||
+ | |market=Mobile | ||
+ | |first announced=August 1, 2019 | ||
+ | |first launched=August 1, 2019 | ||
+ | |family=Core i3 | ||
+ | |series=i3-10000 | ||
+ | |locked=Yes | ||
+ | |frequency=1,100 MHz | ||
+ | |turbo frequency1=3,200 MHz | ||
+ | |turbo frequency2=3,200 MHz | ||
+ | |bus type=OPI | ||
+ | |bus links=4 | ||
+ | |bus rate=4 GT/s | ||
+ | |clock multiplier=11 | ||
+ | |isa=x86-64 | ||
+ | |isa family=x86 | ||
+ | |microarch=Ice Lake | ||
+ | |platform=Ice Lake | ||
+ | |core name=Ice Lake Y | ||
+ | |core family=6 | ||
+ | |process=10 nm | ||
+ | |technology=CMOS | ||
+ | |word size=64 bit | ||
+ | |core count=2 | ||
+ | |thread count=4 | ||
+ | |max cpus=1 | ||
+ | |max memory=32 GiB | ||
+ | |tdp=9 W | ||
+ | |ctdp down=8 W | ||
+ | |ctdp down frequency=800 MHz | ||
+ | |ctdp up=12 W | ||
+ | |tjunc min=0 °C | ||
+ | |tjunc max=100 °C | ||
+ | |package name 1=intel,fcbga_1377 | ||
+ | }} | ||
'''Core i3-1000G1''' is a {{arch|64}} [[dual-core]] high-end performance ultra-low power [[x86]] mobile microprocessor introduced by [[Intel]] in mid-[[2019]]. This chip, which is based on the {{intel|Ice Lake|l=arch}} microarchitecture, is fabricated on Intel's [[10 nm process]]. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a {{intel|Turbo Boost}} frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz. | '''Core i3-1000G1''' is a {{arch|64}} [[dual-core]] high-end performance ultra-low power [[x86]] mobile microprocessor introduced by [[Intel]] in mid-[[2019]]. This chip, which is based on the {{intel|Ice Lake|l=arch}} microarchitecture, is fabricated on Intel's [[10 nm process]]. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a {{intel|Turbo Boost}} frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz. |
Revision as of 13:31, 5 August 2019
Edit Values | |
Core i3-1000G1 | |
Package, front | |
General Info | |
Designer | Intel |
Manufacturer | Intel |
Model Number | i3-1000G1 |
Market | Mobile |
Introduction | August 1, 2019 (announced) August 1, 2019 (launched) |
Shop | Amazon |
General Specs | |
Family | Core i3 |
Series | i3-10000 |
Locked | Yes |
Frequency | 1,100 MHz |
Turbo Frequency | 3,200 MHz (1 core), 3,200 MHz (2 cores) |
Bus type | OPI |
Bus rate | 4 × 4 GT/s |
Clock multiplier | 11 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Ice Lake |
Platform | Ice Lake |
Core Name | Ice Lake Y |
Core Family | 6 |
Process | 10 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 2 |
Threads | 4 |
Max Memory | 32 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
TDP | 9 W |
cTDP down | 8 W |
cTDP down frequency | 800 MHz |
cTDP up | 12 W |
Tjunction | 0 °C – 100 °C |
Packaging | |
Package | FCBGA-1377 (BGA) |
Dimension | 26.5 mm × 18.5 mm × 1.0 mm |
Pitch | 0.43 mm |
Contacts | 1377 |
Socket | Type 3 |
Core i3-1000G1 is a 64-bit dual-core high-end performance ultra-low power x86 mobile microprocessor introduced by Intel in mid-2019. This chip, which is based on the Ice Lake microarchitecture, is fabricated on Intel's 10 nm process. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a Turbo Boost frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics IGP operating at 300 MHz with a burst frequency of 900 MHz.
Facts about "Core i3-1000G1 - Intel"
back image | + |
base frequency | 1,100 MHz (1.1 GHz, 1,100,000 kHz) + |
bus links | 4 + |
bus rate | 4,000 MT/s (4 GT/s, 4,000,000 kT/s) + |
bus type | OPI + |
clock multiplier | 11 + |
core count | 2 + |
core family | 6 + |
core name | Ice Lake Y + |
designer | Intel + |
family | Core i3 + |
first announced | August 1, 2019 + |
first launched | August 1, 2019 + |
full page name | intel/core i3/i3-1000g1 + |
has locked clock multiplier | true + |
instance of | microprocessor + |
isa | x86-64 + |
isa family | x86 + |
ldate | August 1, 2019 + |
main image | + |
main image caption | Package, front + |
manufacturer | Intel + |
market segment | Mobile + |
max cpu count | 1 + |
max junction temperature | 373.15 K (100 °C, 212 °F, 671.67 °R) + |
max memory | 32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) + |
microarchitecture | Ice Lake + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | i3-1000G1 + |
name | Core i3-1000G1 + |
package | FCBGA-1377 + |
platform | Ice Lake + |
process | 10 nm (0.01 μm, 1.0e-5 mm) + |
series | i3-10000 + |
smp max ways | 1 + |
socket | Type 3 + |
tdp | 9 W (9,000 mW, 0.0121 hp, 0.009 kW) + |
tdp down | 8 W (8,000 mW, 0.0107 hp, 0.008 kW) + |
tdp down frequency | 800 MHz (0.8 GHz, 800,000 kHz) + |
tdp up | 12 W (12,000 mW, 0.0161 hp, 0.012 kW) + |
technology | CMOS + |
thread count | 4 + |
turbo frequency (1 core) | 3,200 MHz (3.2 GHz, 3,200,000 kHz) + |
turbo frequency (2 cores) | 3,200 MHz (3.2 GHz, 3,200,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |