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Difference between revisions of "intel/xeon e/e-2286m"
< intel‎ | xeon e

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{{integrated graphics
 
{{integrated graphics
 
| gpu                = UHD Graphics P630
 
| gpu                = UHD Graphics P630
| device id          = 0x3E96
+
| device id          = 0x3E94
 
| designer            = Intel
 
| designer            = Intel
 
| execution units    = 24
 
| execution units    = 24

Revision as of 08:07, 2 June 2019

Edit Values
Xeon E-2286M
coffee lake e (front).png
General Info
DesignerIntel
ManufacturerIntel
Model NumberE-2286M
Part NumberCL8068404068710
S-SpecSRFCZ
MarketWorkstation, Server
IntroductionMay 27, 2019 (announced)
May 27, 2019 (launched)
Release Price$623.00 (tray)
ShopAmazon
General Specs
FamilyXeon E
SeriesE-2200
LockedYes
Frequency2,400 MHz
Turbo Frequency5,000 MHz (1 core)
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier24
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureCoffee Lake
PlatformMehlow
ChipsetCannon Point
Core NameCoffee Lake HR
Core Family6
Core SteppingR0
Process14 nm
TechnologyCMOS
Die174 mm²
Word Size64 bit
Cores8
Threads16
Max Memory128 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm × 28 mm × 1.46 mm
Contacts1440

Xeon E-2286M is a 64-bit octa-core high-end performance x86 workstation microprocessor introduced by Intel in early 2019. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The E-2286M operates at 2.4 GHz with a TDP of 45 W and a turbo boost of up to 5 GHz. This chip integrates Intel's UHD Graphics P630 GPU operating at 350 MHz with a burst frequency of up to 1.25 GHz and supports up to 128 GiB of dual-channel DDR4-2666 memory.

This model has a configurable TDP-down of 35 W.


Cache

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associativewrite-back

L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  8x256 KiB4-way set associativewrite-back

L3$16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
  8x2 MiB16-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, LPDDR3-2133
Supports ECCYes
Max Mem128 GiB
Controllers1
Channels2
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUUHD Graphics P630
DesignerIntelDevice ID0x3E94
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,250 MHz
1.25 GHz
1,250,000 KHz
OutputDP, eDP, HDMI, DVI

Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.5
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD
Facts about "Xeon E-2286M - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Xeon E-2286M - Intel#pcie +
base frequency2,400 MHz (2.4 GHz, 2,400,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetCannon Point +
clock multiplier24 +
core count8 +
core family6 +
core nameCoffee Lake HR +
core steppingR0 +
designerIntel +
device id0x3E94 +
die area174 mm² (0.27 in², 1.74 cm², 174,000,000 µm²) +
familyXeon E +
first announcedMay 27, 2019 +
first launchedMay 27, 2019 +
full page nameintel/xeon e/e-2286m +
has ecc memory supporttrue +
has locked clock multipliertrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,250 MHz (1.25 GHz, 1,250,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description8-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description8-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description4-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
l3$ description16-way set associative +
l3$ size16 MiB (16,384 KiB, 16,777,216 B, 0.0156 GiB) +
ldateMay 27, 2019 +
main imageFile:coffee lake e (front).png +
manufacturerIntel +
market segmentWorkstation + and Server +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory131,072 MiB (134,217,728 KiB, 137,438,953,472 B, 128 GiB, 0.125 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureCoffee Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberE-2286M +
nameXeon E-2286M +
packageFCBGA-1440 +
part numberCL8068404068710 +
platformMehlow +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 623.00 (€ 560.70, £ 504.63, ¥ 64,374.59) +
release price (tray)$ 623.00 (€ 560.70, £ 504.63, ¥ 64,374.59) +
s-specSRFCZ +
seriesE-2200 +
smp max ways1 +
supported memory typeDDR4-2666 + and LPDDR3-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count16 +
turbo frequency (1 core)5,000 MHz (5 GHz, 5,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +