Difference between revisions of "mediatek/helio/mt6797x"

	Edit Values
	MediaTek Helio X27
	General Info
Designer	MediaTek,; ARM Holdings
Manufacturer	TSMC
Model Number	Helio X27
Part Number	MT6797X,; MTK6797X
Market	Mobile, Embedded
Introduction	December 2, 2016 (announced); December 2, 2016 (launched)
	General Specs
Family	Helio
Series	Helio X
Frequency	2,600 MHz, 2,000 MHz, 1,600 MHz
Bus type	AMBA 4 AXI
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53, Cortex-A72
Core Name	Cortex-A53, Cortex-A72
Process	20 nm
Technology	CMOS
Word Size	64 bit
Cores	10
Threads	10
	Multiprocessing
Max SMP	1-Way (Uniprocessor)

Revision as of 05:41, 15 March 2019

Helio X27 (MT6797X) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X27 is identical to Helio X20 with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup and MiraVision's EnergySmart Screen technology.

Architecture

The Helio X27 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

Extreme Performance - 2x Cortex-A72 @ 2.6 GHz
Performance/Power Balance - 4x Cortex-A53 @ 2 GHz
Power Efficiency - 4x Cortex-A53 @ 1.6 GHz

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache

This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR3-1600
Supports ECC	No
Max Mem	4 GiB
Controllers	1
Channels	2
Max Bandwidth	11.92 GiB/s 12,206.08 MiB/s 12.799 GB/s 12,799.003 MB/s 0.0116 TiB/s 0.0128 TB/s
Bandwidth	Single 5.96 GiB/s Double 11.92 GiB/s

Expansions

[Edit/Modify Expansions Info]

Expansion Options

USB

Revision	2.0, 3.0
Ports	8

UART

GP I/O	Yes

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Mali-T880

Designer

ARM Holdings

Execution Units

4

Frequency

875 MHz

0.875 GHz
875,000 KHz

Output

DSI

Max Resolution

DSI	2560x1600

Standards

Direct3D	11.2
OpenGL	3.2
OpenCL	1.2
OpenGL ES	3.2
OpenVG	1.1
Vulkan	1.0

Wireless

Wireless Communications

Wi-Fi

WiFi

802.11ac	Yes

Cellular

2G

CSD		Yes
GSM		Yes
GPRS		Yes
EDGE		Yes

3G

UMTS

TD-SCDMA	Yes
DC-HSDPA	Yes
HSUPA	Yes

CDMA2000

1X	Yes
1xEV-DO	Yes

4G

LTE Advanced

E-UTRAN	Yes
UE Cat	6

Image

Integrated image signal processor supports 32 MP
Supports image stabilization
Supports video stabilization
Supports noise reduction
Supports lens shading correction
Supports AE/AWB/AF
Supports edge enhancement
Supports face detection and visual tracking
Hardware JPEG encoder

Video

Video encoding 4K2K @ 30fps with H.265 and HDR
Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

Audio content sampling rates 8kHz to 192kHz
Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
I2S, PCM
Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
7.1 channel MHL output

Utilizing devices

Chuwi Hi9 Plus
Doogee F7
Doogee F7 Pro
Elephone R9
Elephone S7
HomTom HT10
LeEco Le 2 Pro X620
LeEco Le 2 X620
LeEco Le Pro 3 AI Edition X650
Meizu MX6
Planet Computers Gemini
Vernee Apollo Lite
UMIDIGI Z PRO
Ulefone Gemini Pro

@@ Line 145: / Line 145: @@
 == Utilizing devices ==
+* [[used by::Chuwi Hi9 Plus]]
 * [[used by::Doogee F7]]
 * [[used by::Doogee F7 Pro]]

base frequency	2,600 MHz (2.6 GHz, 2,600,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,600 MHz (1.6 GHz, 1,600,000 kHz) +
bus type	AMBA 4 AXI +
core count	10 +
core name	Cortex-A53 + and Cortex-A72 +
designer	MediaTek + and ARM Holdings +
family	Helio +
first announced	December 2, 2016 +
first launched	December 2, 2016 +
full page name	mediatek/helio/mt6797x +
has 2g support	true +
has 3g support	true +
has 4g support	true +
has cdma2000 1x support	true +
has cdma2000 1xev-do support	true +
has cdma2000 support	true +
has csd support	true +
has dc-hsdpa support	true +
has e-utran support	true +
has ecc memory support	false +
has edge support	true +
has feature	Dual-Camera Setup +
has gprs support	true +
has gsm support	true +
has hsupa support	true +
has lte advanced support	true +
has td-scdma support	true +
has umts support	true +
instance of	microprocessor +
integrated gpu	Mali-T880 +
integrated gpu base frequency	875 MHz (0.875 GHz, 875,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	4 +
isa	ARMv8 +
isa family	ARM +
ldate	December 2, 2016 +
manufacturer	TSMC +
market segment	Mobile + and Embedded +
max cpu count	1 +
max memory bandwidth	11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels	2 +
microarchitecture	Cortex-A53 + and Cortex-A72 +
model number	Helio X27 +
name	MediaTek Helio X27 +
part number	MT6797X + and MTK6797X +
process	20 nm (0.02 μm, 2.0e-5 mm) +
series	Helio X +
smp max ways	1 +
supported memory type	LPDDR3-1600 +
technology	CMOS +
thread count	10 +
used by	Chuwi Hi9 Plus +, Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, LeEco Le Pro 3 AI Edition X650 +, Meizu MX6 +, Planet Computers Gemini +, Vernee Apollo Lite +, UMIDIGI Z PRO + and Ulefone Gemini Pro +
user equipment category	6 +
word size	64 bit (8 octets, 16 nibbles) +

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