Latest revision as of 04:27, 28 January 2019

v · d · e

Yield

Yield

Wafer Die Assembly Burn-in

Yield loss

Parametric Catastrophic

Concepts

CA CAA D0 DFM

Critical area (CA) is the area of a die layout where a particle of a given size will cause catastrophic yield loss.

See also[edit]

• Critical Area Analysis] (CAA)
• Defect density (D0)

This article is still a stub and needs your attention. You can help improve this article by editing this page and adding the missing information.