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Difference between revisions of "ibm/power/02cy230"
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{{ibm title|POWER9 02CY230}}
 
{{ibm title|POWER9 02CY230}}
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{{chip}}
+
{{chip
 +
|name=02CY230
 +
|no image=Yes
 +
|designer=IBM
 +
|manufacturer=GlobalFoundries
 +
|model number=02CY230
 +
|part number=02CY230
 +
|market=Server
 +
|market 2=Workstation
 +
|first announced=November, 2017
 +
|first launched=November, 2017
 +
|family=POWER
 +
|series=POWER9
 +
|frequency=2.90 GHz
 +
|turbo frequency=3.80 GHz
 +
|isa=Power ISA v3.0B
 +
|isa family=Power ISA
 +
|microarch=POWER9
 +
|core name=Sforza
 +
|process=14 nm
 +
|transistors=8,000,000,000
 +
|technology=CMOS
 +
|die area=693.37 mm²
 +
|die length=25.228 mm
 +
|die width=27.48416 mm
 +
|word size=64 bit
 +
|core count=16
 +
|thread count=64
 +
|max cpus=2
 +
|max memory=2 TiB
 +
|tdp=190 W
 +
|tjunc min=0 °C
 +
|tjunc max=85 °C
 +
|package name 1=ibm,fclga_2601
 +
}}
 
'''POWER9 02CY230''' is a [[16-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY230 has a base frequency of 2.90 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.
 
'''POWER9 02CY230''' is a [[16-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY230 has a base frequency of 2.90 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.

Revision as of 01:43, 17 January 2019

Edit Values
02CY230
General Info
DesignerIBM
ManufacturerGlobalFoundries
Model Number02CY230
Part Number02CY230
MarketServer, Workstation
IntroductionNovember, 2017 (announced)
November, 2017 (launched)
General Specs
FamilyPOWER
SeriesPOWER9
Frequency2.90 GHz
Turbo Frequency3.80 GHz
Microarchitecture
ISAPower ISA v3.0B (Power ISA)
MicroarchitecturePOWER9
Core NameSforza
Process14 nm
Transistors8,000,000,000
TechnologyCMOS
Die693.37 mm²
25.228 mm × 27.48416 mm
Word Size64 bit
Cores16
Threads64
Max Memory2 TiB
Multiprocessing
Max SMP2-Way (Multiprocessor)
Electrical
TDP190 W
Tjunction0 °C – 85 °C
Packaging
PackageFCLGA-2601 (PLGA)
Dimension50 mm × 50 mm
Pitch1.016 mm
Contacts2601

POWER9 02CY230 is a 16-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY230 has a base frequency of 2.90 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.

Retrieved from "https://en.wikichip.org/w/index.php?title=ibm/power/02cy230&oldid=86226"
Facts about "POWER9 02CY230 - IBM"
RDF feed
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
core count16 +
core nameSforza +
designerIBM +
die area693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
familyPOWER +
first announcedNovember 2017 +
first launchedNovember 2017 +
full page nameibm/power/02cy230 +
instance ofmicroprocessor +
isaPower ISA v3.0B +
isa familyPower ISA +
ldateNovember 2017 +
manufacturerGlobalFoundries +
market segmentServer + and Workstation +
max cpu count2 +
max junction temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
microarchitecturePOWER9 +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number02CY230 +
name02CY230 +
packageFCLGA-2601 +
part number02CY230 +
process14 nm (0.014 μm, 1.4e-5 mm) +
seriesPOWER9 +
smp max ways2 +
tdp190 W (190,000 mW, 0.255 hp, 0.19 kW) +
technologyCMOS +
thread count64 +
transistor count8,000,000,000 +
turbo frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +