Semiconductor & Computer Engineering
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Difference between revisions of "amd/packages/socket sp3"
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|first announced=May 16, 2017 | |first announced=May 16, 2017 | ||
|first launched=June 20, 2017 | |first launched=June 20, 2017 | ||
| − | |market= | + | |market=Server |
|microarch=Zen | |microarch=Zen | ||
|tdp=120 W | |tdp=120 W | ||
Revision as of 17:28, 23 November 2018
| Edit Values | |
| Socket SP3 | |
| General Info | |
| Designer | AMD |
| Introduction | May 16, 2017 (announced) June 20, 2017 (launched) |
| Market | Server |
| Microarchitecture | Zen |
| TDP | 120 W 120,000 mW , 155 W0.161 hp 0.12 kW 155,000 mW , 180 W0.208 hp 0.155 kW 180,000 mW 0.241 hp 0.18 kW |
| Package | |
| Name | FCLGA-4094 |
| Type | Organic Flip-Chip Land Grid Array |
| Contacts | 4094 |
| Dimension | 58.5 mm 5.85 cm × 75.4 mm2.303 in 7.54 cm 2.969 in |
| Pitch | 1.00 mm 0.0394 in |
| Socket | |
| Name | Socket SP3, LGA-4094 |
| Type | LGA |
Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.
Overview
SP3 is a socket specifically designed by AMD for their EPYC family of server processors and is supported by processors based on the Zen microarchitectures. Physically, the package is identical to the one used for Socket TR4 for their Threadripper processors, however, the features are very different.
Supported Processors
Bibliography
- David. S. (March 2018). "ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging"
- AMD (November 2017). "Thermal Design Guide for Socket SP3 Processors"
Facts about "Socket SP3 - Packages - AMD"
| designer | AMD + |
| first announced | May 16, 2017 + |
| first launched | June 20, 2017 + |
| instance of | package + |
| market segment | Server + |
| microarchitecture | Zen + |
| name | Socket SP3 + |
| package | FCLGA-4094 + |
| package contacts | 4,094 + |
| package length | 58.5 mm (5.85 cm, 2.303 in) + |
| package pitch | 1 mm (0.0394 in) + |
| package type | Organic Flip-Chip Land Grid Array + |
| package width | 75.4 mm (7.54 cm, 2.969 in) + |
| socket | Socket SP3 + and LGA-4094 + |
| tdp | 120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) + |