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Difference between revisions of "apm/x-gene/apm883832-x3"
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== Documents ==
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* [[:File:832-X3 PB.pdf|Product Brief]]

Revision as of 00:57, 26 September 2018

Edit Values
APM883832-X3
General Info
DesignerAppliedMicro
ManufacturerTSMC
Model NumberAPM883832-X3
MarketServer
IntroductionMarch 08, 2017 (announced)
General Specs
Turbo Frequency3,000 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureSkylark
Process16 nm
TechnologyCMOS
Word Size64 bit
Cores32
Threads32
Max Memory1 TiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.85 V
VI/O1.8, 3.3
TDP125 W
Tjunction0 °C – 90 °C

APM883208-X2 is a 64-bit 32-core ARM server microprocessor designed by AppliedMicro and announced in 2016. Fabricated on TSMC's 16 nm process based on the Skylark microarchitecture, this processor features 32 custom ARMv8 cores operating at up to 3 GHz with a TDP of 125 W. This chip supports up to 1 TiB of octa-channel DDR4-2666 memory.

This processor was only sampled and never made it to general availability. Ths IP was eventually sold to Ampere Computing which re-introduced the chip under the eMAG 8180 name.

Cache

Main article: Skylark § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$2 MiB
2,048 KiB
2,097,152 B
L1I$1 MiB
1,024 KiB
1,048,576 B
32x32 KiB  
L1D$1 MiB
1,024 KiB
1,048,576 B
32x32 KiB write-through
L2$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  16x256 KiB  
L3$32 MiB
32,768 KiB
33,554,432 B
0.0313 GiB
  1x32 MiB  

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, DDR4-2400
Supports ECCYes
Max Mem1 TiB
Controllers8
Channels8
Max Bandwidth158.95 GiB/s
162,764.8 MiB/s
170.671 GB/s
170,671.263 MB/s
0.155 TiB/s
0.171 TB/s
Bandwidth
Single 19.89 GiB/s
Double 39.72 GiB/s
Quad 79.47 GiB/s
Hexa 119.21 GiB/s
Octa 158.95 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 42
Configuration: x16, x8, x4
USBRevision: 2.0
Max Ports: 2
SATARevision: 3
Max Ports: 4


Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported ARM Extensions & Processor Features
NEONAdvanced SIMD extension
TrustZoneTrustZone Security Extensions
CryptoCryptographic Extension
FPFloating-point Extension

Documents

Retrieved from "https://en.wikichip.org/w/index.php?title=apm/x-gene/apm883832-x3&oldid=82857"
Facts about "X-Gene 3 APM883832-X3 - AppliedMicro"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
X-Gene 3 APM883832-X3 - AppliedMicro#pcie +
core count32 +
core voltage0.85 V (8.5 dV, 85 cV, 850 mV) +
designerAppliedMicro +
first announcedMarch 8, 2017 +
full page nameapm/x-gene/apm883832-x3 +
has ecc memory supporttrue +
instance ofmicroprocessor +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size2,048 KiB (2,097,152 B, 2 MiB) +
l1d$ size1,024 KiB (1,048,576 B, 1 MiB) +
l1i$ size1,024 KiB (1,048,576 B, 1 MiB) +
l2$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ size32 MiB (32,768 KiB, 33,554,432 B, 0.0313 GiB) +
ldateMarch 8, 2017 +
manufacturerTSMC +
market segmentServer +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory1,048,576 MiB (1,073,741,824 KiB, 1,099,511,627,776 B, 1,024 GiB, 1 TiB) +
max memory bandwidth158.95 GiB/s (162,764.8 MiB/s, 170.671 GB/s, 170,671.263 MB/s, 0.155 TiB/s, 0.171 TB/s) +
max memory channels8 +
max sata ports4 +
max usb ports2 +
microarchitectureSkylark +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberAPM883832-X3 +
nameAPM883832-X3 +
process16 nm (0.016 μm, 1.6e-5 mm) +
smp max ways1 +
supported memory typeDDR4-2666 + and DDR4-2400 +
tdp125 W (125,000 mW, 0.168 hp, 0.125 kW) +
technologyCMOS +
thread count32 +
turbo frequency3,000 MHz (3 GHz, 3,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +