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Revision as of 14:15, 11 August 2018

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Socket SP3
General Info
DesignerAMD
IntroductionMay 16, 2017 (announced)
June 20, 2017 (launched)
MarketDesktop
MicroarchitectureZen
TDP120 W
120,000 mW
0.161 hp
0.12 kW
, 155 W
155,000 mW
0.208 hp
0.155 kW
, 180 W
180,000 mW
0.241 hp
0.18 kW
Package
NameFCLGA-4094
TypeOrganic Flip-Chip Land Grid Array
Contacts4094
Dimension58.5 mm
5.85 cm
2.303 in
× 75.4 mm
7.54 cm
2.969 in
Pitch1.00 mm
0.0394 in
Socket
NameSocket SP3,
LGA-4094
TypeLGA

Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.

Retrieved from "https://en.wikichip.org/w/index.php?title=amd/packages/socket_sp3&oldid=81454"
Facts about "Socket SP3 - Packages - AMD"
RDF feed
designerAMD +
first announcedMay 16, 2017 +
first launchedJune 20, 2017 +
instance ofpackage +
market segmentDesktop +
microarchitectureZen +
nameSocket SP3 +
packageFCLGA-4094 +
package contacts4,094 +
package length58.5 mm (5.85 cm, 2.303 in) +
package pitch1 mm (0.0394 in) +
package typeOrganic Flip-Chip Land Grid Array +
package width75.4 mm (7.54 cm, 2.969 in) +
socketSocket SP3 + and LGA-4094 +
tdp120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) +