Difference between revisions of "intel/core i7/i7-8650u"

	Edit Values
	Core i7-8650U
	General Info
Designer	Intel
Manufacturer	Intel
Model Number	i7-8650U
Part Number	FJ8067703281718
S-Spec	SR3L8
Market	Mobile
Introduction	August 21, 2017 (announced); August 21, 2017 (launched)
Release Price	$409.00
Shop	Amazon
	General Specs
Family	Core i7
Series	i7-8000
Locked	Yes
Frequency	1,900 MHz
Turbo Frequency	Yes
Turbo Frequency	4,200 MHz (1 core)
Bus type	OPI
Bus rate	4 GT/s
Clock multiplier	19
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Kaby Lake
Platform	Kaby Lake
Core Name	Kaby Lake R
Core Family	6
Core Model	142
Core Stepping	Y0
Process	14 nm
Technology	CMOS
Die	123 mm²
Word Size	64 bit
Cores	4
Threads	8
Max Memory	32 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
Vcore	0.55 V-1.52 V
TDP	15 W
cTDP down	10 W
cTDP down frequency	800 MHz
cTDP up	25 W
cTDP up frequency	2,100 MHz
Tjunction	0 °C – 100 °C
Tstorage	-25 °C – 125 °C
	Packaging
Package	FCBGA-1356 (BGA)
Dimension	42 mm x 24 mm x 1.3 mm
Pitch	0.65 mm
Ball Count	1356
Ball Comp	SAC405
Interconnect	BGA-1356

Revision as of 16:23, 13 December 2017

Core i7-8650U is a 64-bit quad-core performance x86 mobile microprocessor introduced by Intel in mid-2017. This processor, which is based on an enhanced version of the Kaby Lake microarchitecture, is manufactured on Intel's 2nd generation enhanced 14nm+ process. The i7-8650U operates at 1.9 GHz with a TDP of 15 W and Turbo Boost frequency of up to 4.2 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Intel's UHD Graphics 620 IGP operating at 300 MHz with a burst frequency of 1.15 GHz.

This model has a configurable TDP-down of 10 W at 800 MHz and a TDP-up of 25 W at 2.1 GHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

256 KiB

262,144 B
0.25 MiB

L1I$	128 KiB 131,072 B 0.125 MiB	4x32 KiB	8-way set associative
L1D$	128 KiB 131,072 B 0.125 MiB	4x32 KiB	8-way set associative	write-back

L2$

1 MiB

1,024 KiB
1,048,576 B
9.765625e-4 GiB

		4x256 KiB	4-way set associative	write-back

L3$

8 MiB

8,192 KiB
8,388,608 B
0.00781 GiB

		4x2 MiB	16-way set associative	write-back

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-2400, LPDDR3-2133
Supports ECC	No
Max Mem	32 GiB
Controllers	1
Channels	2
Max Bandwidth	35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s
Bandwidth	Single 17.88 GiB/s Double 35.76 GiB/s

Expansions

[Edit/Modify Expansions Info]

Expansion Options

PCIe	Revision: 3.0
	Max Lanes: 12
	Configuration: 1x4, 2x2, 1x2+2x1, 4x1

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

UHD Graphics 620

Designer

Intel

Device ID

0x5917

Execution Units

24

Max Displays

3

Max Memory

32 GiB

32,768 MiB
33,554,432 KiB
34,359,738,368 B

Frequency

300 MHz

0.3 GHz
300,000 KHz

Burst Frequency

1,150 MHz

1.15 GHz
1,150,000 KHz

Output

DP, eDP, HDMI, DVI

Max Resolution

HDMI	4096x2304 @24 Hz
DP	4096x2304 @60 Hz
eDP	4096x2304 @60 Hz

Standards

DirectX	12
OpenGL	4.4
OpenCL	2.0
DP	1.2
eDP	1.4
HDMI	1.4a

Additional Features

Intel Quick Sync Video

Intel InTru 3D

Intel Clear Video

Intel Clear Video HD

[Edit] Kaby Lake (Gen9.5) Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Codec	Profiles	Levels	Max Resolution	Profiles	Levels	Max Resolution
MPEG-2 (H.262)	Main	High	1080p (FHD)	Main	Main, High	1080p (FHD)
MPEG-4 AVC (H.264)	High, Main	5.1	2160p (4K)	Main, High, MVC, Stereo	5.1	2160p (4K)
JPEG/MJPEG	Baseline	-	16k x 16k	Baseline	Unified	16k x 16k
HEVC (H.265)	Main, Main 10	5.1	2160p (4K)	Main, Main 10	5.1	2160p (4K)
VC-1	✘			Advanced, Main, Simple	3, High, Simple	3840x3840
VP8	Unified	Unified	N/A	0	Unified	1080p
VP9	0		2160p (4K)	0, 2	Unified	2160p (4K)

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
SSE4a	Streaming SIMD Extensions 4a
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
HT	Hyper-Threading
TBT 2.0	Turbo Boost Technology 2.0
EIST	Enhanced SpeedStep Technology
SST	Speed Shift Technology
VT-x	VT-x (Virtualization)
VT-d	VT-d (I/O MMU virtualization)
EPT	Extended Page Tables (SLAT)
MPX	Memory Protection Extensions
SGX	Software Guard Extensions
Secure Key	Secure Key Technology
SMEP	OS Guard Technology
Flex Memory	Flex Memory Access
ISRT	Smart Response Technology
MWT	My WiFi Technology
IPT	Identity Protection Technology

Die Shot

See also: Kaby Lake § Die Shot

A die shot of Intel's Kaby Lake R Quad Core mobile processors:

14 nm+ process
11 metal layers
123 mm² die size
4 CPU cores + 24 GPU EUs

@@ Line 1: / Line 1: @@
 {{intel title|Core i7-8650U}}
-{{mpu
+{{chip
 |future=Yes
 |name=Core i7-8650U

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core i7-8650U - Intel#package + and Core i7-8650U - Intel#pcie +
base frequency	1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus rate	4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus type	OPI +
clock multiplier	19 +
core count	4 +
core family	6 +
core model	142 +
core name	Kaby Lake R +
core stepping	Y0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x5917 +
die area	123 mm² (0.191 in², 1.23 cm², 123,000,000 µm²) +
family	Core i7 +
first announced	August 21, 2017 +
first launched	August 21, 2017 +
full page name	intel/core i7/i7-8650u +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel identity protection technology support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel turbo boost technology 2 0	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	UHD Graphics 620 +
integrated gpu base frequency	300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	1,150 MHz (1.15 GHz, 1,150,000 KHz) +
integrated gpu max memory	32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	256 KiB (262,144 B, 0.25 MiB) +
l1d$ description	8-way set associative +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) +
l1i$ description	8-way set associative +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) +
l2$ description	4-way set associative +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description	16-way set associative +
l3$ size	8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldate	3000 +
main image	+
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth	35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels	2 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	i7-8650U +
name	Core i7-8650U +
package	FCBGA-1356 +
part number	FJ8067703281718 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 409.00 (€ 368.10, £ 331.29, ¥ 42,261.97) +
s-spec	SR3L8 +
series	i7-8000 +
smp max ways	1 +
supported memory type	DDR4-2400 + and LPDDR3-2133 +
tdp	15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down	10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
tdp down frequency	800 MHz (0.8 GHz, 800,000 kHz) +
tdp up	25 W (25,000 mW, 0.0335 hp, 0.025 kW) +
tdp up frequency	2,100 MHz (2.1 GHz, 2,100,000 kHz) +
technology	CMOS +
thread count	8 +
turbo frequency (1 core)	4,200 MHz (4.2 GHz, 4,200,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

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AMD

ARM

Cavium

Samsung

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AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Revision as of 16:23, 13 December 2017

Contents

Cache

Memory controller

Expansions

Graphics

Features

Die Shot