Revision as of 14:46, 1 September 2017

In 2017:

• January 3: Intel introduces their mainstream processors based on Kaby Lake, including i3, i5, and i7 models.
• January 4-8: CES 2017
• January 4: NXP launched the i.MX 8M family of processors capable of full 4K UltraHD for Audio, Voice and Video Interactions
• February 2: Amkor Technology acquires NANIUM for undisclosed sum.
• February 5-9: IEEE international Solid-State Circuits Conference (ISSCC) 2017
• February 8: Intel announced a $7B investment in Fab 42 which will be used to manufacture chips on a 7 nm process
• February 22: AMD announces the Ryzen 7 processor family for high-end performance x86 based on Zen
• February 28: Xiaomi launches the Surge family of in-house developed ARM processors
• March 2: AMD launches the Ryzen 7 family
• March 1-3: GDC 2017 Expro
• March 13: Intel acquires Mobileye for $15.3 billion.
• March 13: TSMC Technology Symposium
• March 28: Intel Technology and Manufacturing Day
• March 28: Intel introduces their 10 nm process featuring the highest density transistor at the time
• March 28: Intel announces a new 22 nm process "22FFL" for IOT and Mobile
• April 4: Fujitsu introduces the SPARC64 XII and announces commitment to future SPARC development
• April 6: Beijing Shanhai Capital completed the acquisition of Analogix Semiconductor for $500M
• April 19-21: COOLChips XX
• May 4: Intel introduces the Xeon Bronze Xeon Silver, Xeon Gold, Xeon Platinum server families
• May 15-18: Advanced Semiconductor Manufacturing Conference (ASMC) 2017
• May 16: AMD introduces the EPYC server family
• May 29: ARM introduces the Cortex-A55 and Cortex-A75 cores, first ARMv8.2 implementations
• May 30-3: Computex Taipei 2017
  • May 30: Intel introduces Skylake X
  • May 30: Intel introduces the Core i9 family of extreme-performance desktop processors
• June 5-9: VLSI Symposium
  • June 6: IBM announces a breakthrough in the mass manufacturing of GAA FET-based 5 nm process
• June 20: SPEC released the SPEC CPU2017 benchmark suite.
• August 22-26: Gamescom 2017
• July 11: Intel introduces Skylake SP along with the Ultra Path Interconnect (UPI) with supersedes QPI
• July 17: IBM introduces the z14 microprocessor
• August 10: AMD introduces Threadripper, a family of enthusiasts-class x86 microprocessors
• August 20: Day 1: Hot Chips 29 - Hot Chips: A Symposium on High Performance Chips
• August 21:
  • Day 2: HotChips 29
    • Microsoft introduces Xbox One X Scorpio Engine
    • AMD introduces their Vega GPU microarchitecture
    • NVIDIA showcases Volta GPU microarchitecture
    • SiFive introduces the industry first RISC-V chip
    • Renesas showcases R-Car Gen3
    • Intel introduces the Knights Mill microarchitecture for Xeon Phi
    • ThinCI introduces their Graph Streaming Processor (GSP)
• August 21: Intel introduces Kaby Lake Refresh, doubling the core count of many mainstream mobile processors.
• August 22:
  • Day 3: HotChips 29
    • Intel showcases the Stratix 10 FPGA
    • ARM showcases the DynamIQ architecture
    • IBM showcases the z14 microarchitecture
    • AMD showcases EPYC server processors
    • Intel showcases Xeon Scalable Family (Skylake-SP) server processors
    • Qualcomm introduces the Centriq server processor family and the Falkor microarchitecture
• August 29: Intel introduces the Xeon W family, a family of business-class workstation processors
• December 2-6: IEEE IEDM 2017

Microprocessors released in 2017