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Difference between revisions of "amd/ryzen 9/4900hs"
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This processor is a lower-power version of the {{\\|4900H}}, featuring slightly lower base and turbo frequencies.
 
This processor is a lower-power version of the {{\\|4900H}}, featuring slightly lower base and turbo frequencies.
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== Cache ==
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{{main|amd/microarchitectures/zen 2#Memory_Hierarchy|l1=Zen 2 § Cache}}
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{{cache size
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|l1 cache=512 KiB
 +
|l1i cache=256 KiB
 +
|l1i break=8x32 KiB
 +
|l1i desc=8-way set associative
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|l1d cache=256 KiB
 +
|l1d break=8x32 KiB
 +
|l1d desc=8-way set associative
 +
|l1d policy=write-back
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|l2 cache=4 MiB
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|l2 break=8x512 KiB
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|l2 desc=8-way set associative
 +
|l2 policy=write-back
 +
|l3 cache=8 MiB
 +
|l3 break=2x4 MiB
 +
}}

Revision as of 14:16, 9 May 2020

Edit Values
Ryzen 9 4900HS
General Info
DesignerAMD
ManufacturerTSMC
Model Number4900HS
MarketMobile
IntroductionMarch 16, 2020 (announced)
March 16, 2020 (launched)
ShopAmazon
General Specs
FamilyRyzen 9
Series4000
LockedYes
Frequency3,000 MHz
Turbo Frequency4,300 MHz
Clock multiplier30
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen 2
Core NameRenoir
Process7 nm
Transistors9,800,000,000
TechnologyCMOS
Die156 mm²
Word Size64 bit
Cores8
Threads16
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP35 W
Tcase0 °C – 105 °C
Packaging
Unknown package "amd,socket_fp6"

Ryzen 9 4900HS is a 64-bit octa-core high-end performance x86 mobile microprocessor introduced by AMD in early 2020. Fabricated on TSMC's 7-nanometer process based on AMD's Zen 2 microarchitecture, the 4900HS operates at a base frequency of 3.0 GHz with a TDP of 35 W and a Boost frequency of up to 4.3 GHz. This APU supports up to 64 GiB of DDR4-3200 or up to 32 GiB of quad-channel LPDDR4x-4266 memory. The 4900HS integrates a Radeon Vega 8 Graphics operating at up to 1.75 GHz.

This processor is a lower-power version of the 4900H, featuring slightly lower base and turbo frequencies.

Cache

Main article: Zen 2 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associativewrite-back
L2$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  8x512 KiB8-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  2x4 MiB  
Retrieved from "https://en.wikichip.org/w/index.php?title=amd/ryzen_9/4900hs&oldid=96859"
Facts about "Ryzen 9 4900HS - AMD"
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"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Ryzen 9 4900HS - AMD#pcie +
base frequency3,000 MHz (3 GHz, 3,000,000 kHz) +
clock multiplier30 +
core count8 +
core family23 +
core model96 +
core nameRenoir +
core steppingA1 +
designerAMD +
die area156 mm² (0.242 in², 1.56 cm², 156,000,000 µm²) +
familyRyzen 9 +
first announcedMarch 16, 2020 +
first launchedMarch 16, 2020 +
full page nameamd/ryzen 9/4900hs +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd amd-vi technologytrue +
has amd sensemi technologytrue +
has ecc memory supportfalse +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 8 +
integrated gpu designerAMD +
integrated gpu execution units8 +
integrated gpu max frequency1,750 MHz (1.75 GHz, 1,750,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description8-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description8-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateMarch 16, 2020 +
manufacturerTSMC +
market segmentMobile +
max case temperature378.15 K (105 °C, 221 °F, 680.67 °R) +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth63.581 GiB/s (65,107.346 MiB/s, 68.27 GB/s, 68,270 MB/s, 0.0621 TiB/s, 0.0683 TB/s) +
max memory channels4 +
microarchitectureZen 2 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number4900HS +
nameRyzen 9 4900HS +
packageFP6 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series4000 +
smp max ways1 +
supported memory typeDDR4-3200 + and LPDDR4x-4266 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count16 +
transistor count9,800,000,000 +
turbo frequency4,300 MHz (4.3 GHz, 4,300,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +