Latest revision as of 10:59, 24 February 2025

Snapdragon 850 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018.

Fabricated on Samsung's 10nm LPP process, the 850 features four Kryo 385 Silver high-efficiency cores operating at 1.77 GHz along with four high-performance Kryo 385 Gold operating at 2.96 GHz.

The Snapdragon 850 integrates the Adreno 630 GPU operation at 710 MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

See also: Qualcomm and Snapdragon 8

Overview[edit]

Positioned as a replacement for the 845 for always-connected ARM-based PCs and fabricated on Samsung's second-generation 10LPP process, the 850 is for the most part a higher-binned version of its predecessor. The chip features four high-performance cores based on the Cortex-A75 microarchitecture and four low-power cores based on the Cortex-A55 microarchitecture. This chip incorporates the X20 LTE modem, supporting Cat 18 up to 1.2 Gbps download and Cat 13 up to 150 Mbps upload.

Cache[edit]

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache

Quad-core cluster Cortex-A75:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 1 MiB 1,024 KiB 1,048,576 B 9.765625e-4 GiB     4x256 KiB 8-way set associative

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 2-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     4x128 KiB 8-way set associative

• 2 MiB L3

Memory controller[edit]

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3733 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 4 Width 16 bit Max Bandwidth 29.87 GiB/s 30,586.88 MiB/s 32.073 GB/s 32,072.668 MB/s 0.0292 TiB/s 0.0321 TB/s Bandwidth Single 6.95 GiB/s Double 13.91 GiB/s Quad 29.87 GiB/s

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 630 Designer Qualcomm Frequency 710 MHz 0.71 GHz 710,000 KHz Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• Hardware Acceleration
• 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
• Decode: H.264 (AVC), H.265 (HEVC) and VP9

• Up to 4K Ultra HD video capture @30FPS
• Up to 1080p video capture @120FPS

Audio[edit]

• Aqstic audio codec and Aqstic smart speaker amplifier
  • Up to native DSD support, PCM up to 384 kHz/32-bit
• Qualcomm aptX audio playback with support for aptX Classic and HD

ISP[edit]

• Qualcomm Spectra 280 image sensor processor

• 2x Image Sensor Processor (ISP)
• 14-bit

Megapixel:

• Up to 16 MP dual camera
• Up to 32 MP single camera

Connectivity[edit]

• WiFi
  • Integrated 802.11ac 2 x 2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual
  • Band Simultaneous (DBS) + 60 GHz
• Bluetooth 5.0
• RF Front End
• LTE Modem
  • Snapdragon X20
    • Downlink:
      • Category 18 up to 1,200 Mbps
      • 5 x 20 MHz carrier aggregation, up to 256-QAM
      • Up to 4 x 4 MIMO on three aggregated carriers
    • Uplink:
      • Category 13 up to 150 Mbps
      • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location[edit]

• GPS
  • Glonass, BeiDou, Galileo, QZSS, and SBAS
• Low power geofencing and tracking, sensor assisted navigation