From WikiChip
Difference between revisions of "mediatek/helio/mt6795"
(added mode devices using that soc) |
|||
Line 174: | Line 174: | ||
* [[used by::Sony Xperia M5]] | * [[used by::Sony Xperia M5]] | ||
* [[used by::Gionee Elife E8]] | * [[used by::Gionee Elife E8]] | ||
+ | * [[used by::Allview X2 Xtreme]] | ||
+ | * [[used by::BLU Pure XL]] | ||
* [[used by::Elephone Vowney]] | * [[used by::Elephone Vowney]] | ||
* [[used by::LeEco Le1 X600]] | * [[used by::LeEco Le1 X600]] | ||
Line 184: | Line 186: | ||
* [[used by::Meitu V4]] | * [[used by::Meitu V4]] | ||
* [[used by::Meitu V4S]] | * [[used by::Meitu V4S]] | ||
− | * [[used by:: Lumigon T3]] | + | * [[used by::Lumigon T3]] |
+ | * [[used by::Infinix 552]] | ||
{{expand list}} | {{expand list}} |
Revision as of 04:14, 26 April 2020
Edit Values | |
MediaTek Helio X10 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X10 |
Part Number | MT6795, MTK6795 |
Market | Mobile, Embedded |
Introduction | July 15, 2014 (announced) March 27, 2015 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,000 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53 |
Core Name | Cortex-A53 |
Process | 28 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 8 |
Threads | 8 |
Max Memory | 4 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
Vcore | 1 V |
VI/O | 1.8 V, 2.8 V, 3.3 V |
OP Temperature | -20 °C – 80 °C |
Tjunction | – 125 °C |
Tstorage | 0 °C – 125 °C |
Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.
This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.
Contents
Cache
- Main article: Cortex-A53 § Cache
![]() |
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
||||||||||||||||||||||||
|
Memory controller
![]() |
Integrated Memory Controller
|
|||||||||||||||
|
Expansions
![]() |
Expansion Options
|
|||||||||
|
Graphics
![]() |
Integrated Graphics Information
|
|||||||||||||||||||||||||||||||||||||||||
|
- OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
- OpenVG 1.1 vector graphics accelerator
Wireless
![]() | |||||||||||||
Cellular | |||||||||||||
2G |
| ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3G |
| ||||||||||||
4G |
|
Image
- Integrated image signal processor supports 20 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video
- HEVC decoder 4k2k @ 30fps
- H.264 decoder (30fps/40Mbps)
- Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
- MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
- DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
- VP8 / VC-1 decoders
- MPEG-4 / H.263 / H.264 / HEVC encoders
Audio
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices
- Meizu Blue Charm Metal
- Meizu MX5E
- HTC Desire 830
- HTC One S9
- HTC One ME
- Sony Xperia M5
- Gionee Elife E8
- Allview X2 Xtreme
- BLU Pure XL
- Elephone Vowney
- LeEco Le1 X600
- LeEco Le 1s
- PPTV King 7
- Xiaomi Redmi Note 2
- LG G3 (Silk White, 16GB)
- Xiaomi Redmi Note 3
- Canvas 6 pro
- Meitu V4
- Meitu V4S
- Lumigon T3
- Infinix 552
This list is incomplete; you can help by expanding it.
Facts about "Helio X10 (MT6795) - MediaTek"
base frequency | 2,000 MHz (2 GHz, 2,000,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 8 + |
core name | Cortex-A53 + |
core voltage | 1 V (10 dV, 100 cV, 1,000 mV) + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | July 15, 2014 + |
first launched | March 27, 2015 + |
full page name | mediatek/helio/mt6795 + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | PowerVR G6200 + |
integrated gpu base frequency | 700 MHz (0.7 GHz, 700,000 KHz) + |
integrated gpu designer | Imagination Technologies + |
io voltage | 1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 2-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
ldate | March 27, 2015 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max junction temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory bandwidth | 13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) + |
max memory channels | 2 + |
max operating temperature | 80 °C + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Cortex-A53 + |
min operating temperature | -20 °C + |
min storage temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | Helio X10 + |
name | MediaTek Helio X10 + |
part number | MT6795 + and MTK6795 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1866 + |
technology | CMOS + |
thread count | 8 + |
used by | Meizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Allview X2 Xtreme +, BLU Pure XL +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 +, LG G3 +, Xiaomi Redmi Note 3 +, Canvas 6 pro +, Meitu V4 +, Meitu V4S +, Lumigon T3 + and Infinix 552 + |
user equipment category | 4 + |
word size | 64 bit (8 octets, 16 nibbles) + |