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Difference between revisions of "qualcomm/snapdragon 800/855"
< qualcomm

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|thread count=8
 
|thread count=8
 
|max cpus=1
 
|max cpus=1
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|max memory=16 GiB
 
|predecessor=Snapdragon 845
 
|predecessor=Snapdragon 845
 
|predecessor link=qualcomm/snapdragon 800/845
 
|predecessor link=qualcomm/snapdragon 800/845
 
}}
 
}}
 
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory.
 
'''Snapdragon 855''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2018]]. Fabricated on TSMC's [[7nm process]], the 855 features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory.

Revision as of 16:51, 7 December 2018

Edit Values
Snapdragon 855
sd 855 (front).png
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC
MarketMobile
IntroductionDecember 4, 2018 (announced)
Q1, 2019 (launched)
General Specs
FamilySnapdragon 800
Series800
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 485 Gold, Kryo 485 Silver
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sd 855 (back).png
Succession

Snapdragon 855 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 855 features four Kryo 485 Silver high-efficiency cores operating at 1.8 GHz along with three high-performance Kryo 485 Gold operating at 2.42 GHz and another higher-performance Kryo 485 Gold core operating at 2.84 GHz. The Snapdragon 855 integrates the Adreno 640 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of quad-channel LPDDR4X-4266 memory.

Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/snapdragon_800/855&oldid=84786"
Facts about "Snapdragon 855 - Qualcomm"
RDF feed
back imageFile:sd 855 (back).png +
base frequency1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,420 MHz (2.42 GHz, 2,420,000 kHz) + and 2,840 MHz (2.84 GHz, 2,840,000 kHz) +
core count8 +
core nameKryo 485 Silver +, Kryo 485 Gold + and Kryo 485 Prime +
designerQualcomm + and ARM Holdings +
die area73.27 mm² (0.114 in², 0.733 cm², 73,270,000 µm²) +
die length8.48 mm (0.848 cm, 0.334 in, 8,480 µm) +
die width8.64 mm (0.864 cm, 0.34 in, 8,640 µm) +
dspHexagon 690 DSP +
familySnapdragon 800 + and Snapdragon 8 +
first announcedDecember 4, 2018 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/855 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 640 GPU +
integrated gpu base frequency257 MHz (0.257 GHz, 257,000 KHz) +
integrated gpu designerQualcomm +
integrated gpu execution units2 +
integrated gpu max frequency585 MHz (0.585 GHz, 585,000 KHz) +
isaARMv8 +
isa familyARM +
l1$ size128 KiB (131,072 B, 0.125 MiB) +, 384 KiB (393,216 B, 0.375 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ description4-way set associative + and 2-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +, 192 KiB (196,608 B, 0.188 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + and 0.75 MiB (768 KiB, 786,432 B, 7.324219e-4 GiB) +
ldateMarch 2019 +
main imageFile:sd 855 (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels4 +
microarchitectureCortex-A55 + and Cortex-A76 +
model numberSDM855 +
nameSnapdragon 855 +
part numberSM8150 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
transistor count6,700,000,000 +
used byAsus ZenFone 6 +, Asus ZenFone 6Z +, Black Shark 2 +, HTC 5G Hub +, Lenovo Z5 Pro GT +, Lenovo Z6 Pro +, Google Pixel 4 (XL) +, LG G8 ThinQ +, LG G8S ThinQ +, LG G8X ThinQ +, LG V50 ThinQ +, LG V50S ThinQ +, Meizu 16s +, Meizu 16T +, Microsoft Surface Duo +, Realme X2 Pro +, Oppo Reno 10x Zoom +, Oppo Reno 5G +, OnePlus 7 +, OnePlus 7 Pro +, Samsung Galaxy Note 10 +, Samsung Galaxy Note 10+ +, Samsung Galaxy S10 +, Samsung Galaxy S10+ +, Samsung Galaxy S10 5G +, Samsung Galaxy S10 Lite +, Samsung Galaxy S10e +, Samsung Galaxy Fold +, Samsung Galaxy A90 5G +, Samsung Galaxy Tab S6 +, Sony Xperia 1 +, Sony Xperia 5 +, Sharp Aquos R3 +, Sharp Aquos Zero 2 +, Xiaomi Mi 9 +, Xiaomi Mi MIX 3 5G +, Xiaomi Poco X3 Pro +, Xiaomi Redmi K20 Pro +, ZTE Axon 10 Pro + and ZTE Nubia Red Magic 3 +
word size64 bit (8 octets, 16 nibbles) +