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*** Uplink of up to 200 Mbps (2x2 MIMO, 256-QAM, 1x20MHz CA) | *** Uplink of up to 200 Mbps (2x2 MIMO, 256-QAM, 1x20MHz CA) | ||
* Wi-Fi 802.11 ac | * Wi-Fi 802.11 ac | ||
− | * Bluetooth | + | * Bluetooth 5 |
* NFC | * NFC | ||
* GPS / A-GPS / GLONASS / BDS | * GPS / A-GPS / GLONASS / BDS |
Revision as of 05:17, 7 October 2018
Edit Values | |
Kirin 980 | |
General Info | |
Designer | HiSilicon, ARM Holdings |
Manufacturer | TSMC |
Model Number | 980 |
Market | Mobile |
Introduction | August 31, 2018 (announced) August 31, 2018 (launched) |
General Specs | |
Family | Kirin |
Frequency | 2,600 MHz, 1,920 MHz, 1,800 MHz |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A76, Cortex-A55 |
Core Name | Cortex-A76, Cortex-A55 |
Process | 7 nm |
Transistors | 6,900,000,000 |
Technology | CMOS |
Word Size | 64 bit |
Cores | 8 |
Threads | 8 |
Kirin 980 is a 64-bit high-performance mobile ARM LTE SoC designed by HiSilicon and introduced in late 2018. Fabricated on TSMC's 7 nm process, the 980 incorporates four big Cortex-A76 cores operating at up to 2.6 GHz along with four little Cortex-A55 cores operating at up to 1.8 GHz. This SoC has an LTE modem supporting 1.4 Gbps download (Cat21), incorporates an ARM Mali-G76, and supports LPDDR4X-4266 memory.
Overview
Introduced at the 2018 IFA, the overall core organization has changed from the Kirin 970 which was introduced the previous year. The 980 features two high-performance big Cortex-A76 core operating at 2.6 GHz, 2 medium-performance big Cortex-A76 operating at 1.92 GHz, and four little Cortex-A55 cores operating at 1.8 GHz. Compard to the 970, the 980 features 40% power efficiency and 62.5% smaller die area due to the process shrink. The 980 ballooned to over 25% more transistors from 5.5 billion in the 970 to 6.9 billion. The 980 adds many enhancements, including a more powerful Mali G76 GPU and incorporates a new dual-neural processor designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 21 capable of reaching a maximum downlink of 1.4 Gbps.
Cache
- Main articles: Cortex-A55 § Cache and Cortex-A76 § Cache
For the Cortex-A76:
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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For the Cortex-A55:
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
The Kirin 980 supports 4-channel LPDDR4X up to 2133 MHz. Each channel supports at most two ranks.
Integrated Memory Controller
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Graphics
Integrated Graphics Information
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Wireless
- LTE Modem
- DL: Up to User Equipment (UE) category 21
- Downlink of up to 1.4 Gbps (4x4 MIMO + 256QAM 3CC CA = 1.2 Gbps, 2x2 MIMI + 256QAM + 1CC = 200 Mbps)
- UL: Up to User Equipment (UE) category 18
- Uplink of up to 200 Mbps (2x2 MIMO, 256-QAM, 1x20MHz CA)
- DL: Up to User Equipment (UE) category 21
- Wi-Fi 802.11 ac
- Bluetooth 5
- NFC
- GPS / A-GPS / GLONASS / BDS
Bibliography
- Huawei Kirin 980 Keynote, 2018 IFA
- all microprocessor models
- microprocessor models by hisilicon
- microprocessor models by hisilicon based on cortex-a76
- microprocessor models by hisilicon based on cortex-a55
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a76
- microprocessor models by arm holdings based on cortex-a55
- microprocessor models by tsmc
- future microprocessor models
base frequency | 2,600 MHz (2.6 GHz, 2,600,000 kHz) +, 1,920 MHz (1.92 GHz, 1,920,000 kHz) + and 1,800 MHz (1.8 GHz, 1,800,000 kHz) + |
core count | 8 + |
core name | Cortex-A76 + and Cortex-A55 + |
designer | HiSilicon + and ARM Holdings + |
family | Kirin + |
first announced | August 31, 2018 + |
first launched | August 31, 2018 + |
full page name | hisilicon/kirin/980 + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | Mali-G76 + |
integrated gpu base frequency | 750 MHz (0.75 GHz, 750,000 KHz) + |
integrated gpu designer | ARM Holdings + |
integrated gpu execution units | 10 + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + and 256 KiB (262,144 B, 0.25 MiB) + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + and 128 KiB (131,072 B, 0.125 MiB) + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + and 128 KiB (131,072 B, 0.125 MiB) + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + |
ldate | 3000 + |
manufacturer | TSMC + |
market segment | Mobile + |
max memory bandwidth | 31.78 GiB/s (32,542.72 MiB/s, 34.124 GB/s, 34,123.515 MB/s, 0.031 TiB/s, 0.0341 TB/s) + |
max memory channels | 4 + |
microarchitecture | Cortex-A76 + and Cortex-A55 + |
model number | 980 + |
name | Kirin 980 + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |
supported memory type | LPDDR4X-4266 + |
technology | CMOS + |
thread count | 8 + |
transistor count | 6,900,000,000 + |
word size | 64 bit (8 octets, 16 nibbles) + |