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Difference between revisions of "hisilicon/kunpeng/920-6426"
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'''Hi1620''' is a planned [[octatetraconta-core]] {{arch|64}} [[ARM]] server microprocessor set to be introduced by HiSilicon in late-2018. Fabricated by [[TSMC]] on a [[? nm process]], this chip incorporates 48 {{armh|Ares}} cores operating at 3 GHz. The Hi1620 supports up to 512 GiB of quad-channel DDR4-2400 memory.
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'''Hi1620''' is a planned [[octatetraconta-core]] {{arch|64}} [[ARM]] server microprocessor set to be introduced by HiSilicon in late-2018. Fabricated by [[TSMC]] on a [[? nm process]], this chip incorporates 48 {{armh|Ares|l=arch}} cores operating at 3 GHz. The Hi1620 supports up to 512 GiB of quad-channel DDR4-2400 memory.
  
  

Revision as of 23:45, 5 September 2018

Edit Values
Hi1620
General Info
DesignerHiSilicon,
ARM Holdings
ManufacturerTSMC
Model NumberHi1620
MarketServer
IntroductionSeptember, 2018 (announced)
September, 2018 (launched)
General Specs
FamilyHi16xx
Frequency3,000 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureAres
Core NameAres
TechnologyCMOS
Word Size64 bit
Cores48
Threads48
Max Memory512 GiB
Multiprocessing
Max SMP2-Way (Multiprocessor)

Hi1620 is a planned octatetraconta-core 64-bit ARM server microprocessor set to be introduced by HiSilicon in late-2018. Fabricated by TSMC on a ? nm process, this chip incorporates 48 Ares cores operating at 3 GHz. The Hi1620 supports up to 512 GiB of quad-channel DDR4-2400 memory.


DIL16 Blank.svg Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.

Cache

Main article: Cortex-A72 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$3.75 MiB
3,840 KiB
3,932,160 B
L1I$2.25 MiB
2,304 KiB
2,359,296 B
48x48 KiB8-way set associative 
L1D$1.5 MiB
1,536 KiB
1,572,864 B
48x32 KiB8-way set associative 
L2$12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
  48x256 KiB8-way set associative 
L3$48 MiB
49,152 KiB
50,331,648 B
0.0469 GiB
  48x1 MiB16-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2400
Supports ECCYes
Max Mem512 GiB
Controllers1
Channels4
Width64 bit
Max Bandwidth71.53 GiB/s
73,246.72 MiB/s
76.805 GB/s
76,804.753 MB/s
0.0699 TiB/s
0.0768 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s
Quad 71.53 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 2x8

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported ARM Extensions & Processor Features
NEONAdvanced SIMD extension
CRC32CRC-32 checksum Extension

Utilizing devices

  • HiSilicon D06

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=hisilicon/kunpeng/920-6426&oldid=82176"
Facts about "Kunpeng 920-6426 - HiSilicon"
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Kunpeng 920-6426 - HiSilicon#pcie +
base frequency2,600 MHz (2.6 GHz, 2,600,000 kHz) +
core count64 +
core nameTaiShan v110 +
designerHiSilicon + and ARM Holdings +
die count3 +
familyHi16xx +
first announcedSeptember 2018 +
first launchedJanuary 7, 2019 +
full page namehisilicon/kunpeng/920-6426 +
has ecc memory supporttrue +
instance ofmicroprocessor +
is multi-chip packagetrue +
isaARMv8.2 +
isa familyARM +
l1$ size8,192 KiB (8,388,608 B, 8 MiB) +
l1d$ size4,096 KiB (4,194,304 B, 4 MiB) +
l1i$ size4,096 KiB (4,194,304 B, 4 MiB) +
l2$ size32 MiB (32,768 KiB, 33,554,432 B, 0.0313 GiB) +
l3$ size64 MiB (65,536 KiB, 67,108,864 B, 0.0625 GiB) +
ldateJanuary 7, 2019 +
main imageFile:kunpeng 920 (front).png +
manufacturerTSMC +
market segmentServer +
max cpu count4 +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory bandwidth190.7 GiB/s (195,276.8 MiB/s, 204.763 GB/s, 204,762.566 MB/s, 0.186 TiB/s, 0.205 TB/s) +
max memory channels8 +
max sata ports2 +
max usb ports4 +
microarchitectureTaiShan v110 +
model number920-6426 +
nameKunpeng 920-6426 +
series920 +
smp max ways4 +
supported memory typeDDR4-2933 +
tdp195 W (195,000 mW, 0.261 hp, 0.195 kW) +
technologyCMOS +
thread count64 +
transistor count20,000,000,000 +
used byHiSilicon D06 +, TaiShan 5280 +, TaiShan 5290 +, TaiShan X6000 + and TaiShan 2280 +
word size64 bit (8 octets, 16 nibbles) +