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| name = Atom Z670 | | name = Atom Z670 | ||
| image = lincroft chips.png | | image = lincroft chips.png |
Latest revision as of 15:15, 13 December 2017
Edit Values | |||||||||
Atom Z670 | |||||||||
General Info | |||||||||
Designer | Intel | ||||||||
Manufacturer | Intel | ||||||||
Model Number | Z670 | ||||||||
Part Number | AY80609007293AA | ||||||||
S-Spec | SLC2P | ||||||||
Market | Mobile | ||||||||
Introduction | April 11, 2011 (announced) April 11, 2011 (launched) | ||||||||
End-of-life | May 31, 2013 (last order) November 08, 2013 (last shipment) | ||||||||
Release Price | $75 | ||||||||
Shop | Amazon | ||||||||
General Specs | |||||||||
Family | Atom | ||||||||
Series | Z650 | ||||||||
Locked | Yes | ||||||||
Frequency | 1,500 MHz | ||||||||
Bus type | cDMI | ||||||||
Bus speed | 100 MHz | ||||||||
Bus rate | 400 MT/s | ||||||||
Clock multiplier | 8 | ||||||||
CPUID | 20661 | ||||||||
Microarchitecture | |||||||||
ISA | x86-32 (x86) | ||||||||
Microarchitecture | Bonnell | ||||||||
Platform | Oak Trail | ||||||||
Chipset | Langwell | ||||||||
Core Name | Lincroft | ||||||||
Core Family | 6 | ||||||||
Core Model | 38 | ||||||||
Core Stepping | 1 | ||||||||
Process | 45 nm | ||||||||
Technology | CMOS | ||||||||
Word Size | 32 bit | ||||||||
Cores | 1 | ||||||||
Threads | 2 | ||||||||
Max Memory | 2 GiB | ||||||||
Multiprocessing | |||||||||
Max SMP | 1-Way (Uniprocessor) | ||||||||
Electrical | |||||||||
Vcore | 0.7 V-1.15 V | ||||||||
TDP | 3 W | ||||||||
Tjunction | 0 °C – 90 °C | ||||||||
Tcase | 0 °C – 70 °C | ||||||||
Tstorage | -55 °C – 125 °C | ||||||||
Packaging | |||||||||
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Atom Z670 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in mid-2011. The Z670, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z670 incorporates a GMA 600 IGP operating at 400 MHz.
This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.
Contents
Cache[edit]
- Main article: Bonnell § Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
Integrated Memory Controller
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Expansions[edit]
Expansion Options
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Graphics[edit]
This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.
Integrated Graphics Information
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- Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
- Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)
Features[edit]
[Edit/Modify Supported Features]
Supported x86 Extensions & Processor Features
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Die Shot[edit]
- See also: Bonnell § Lincroft Die
Documents[edit]
Datasheet[edit]
- Atom Z670 Datasheet, April 2011
- Atom Z670 Specs Update, July 2014
Manuals[edit]
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Atom Z670 - Intel#package + |
base frequency | 1,500 MHz (1.5 GHz, 1,500,000 kHz) + |
bus rate | 400 MT/s (0.4 GT/s, 400,000 kT/s) + |
bus speed | 100 MHz (0.1 GHz, 100,000 kHz) + |
bus type | cDMI + |
chipset | Langwell + |
clock multiplier | 8 + |
core count | 1 + |
core family | 6 + |
core model | 38 + |
core name | Lincroft + |
core stepping | 1 + |
core voltage (max) | 1.15 V (11.5 dV, 115 cV, 1,150 mV) + |
core voltage (min) | 0.7 V (7 dV, 70 cV, 700 mV) + |
cpuid | 20661 + |
designer | Intel + |
family | Atom + |
first announced | April 11, 2011 + |
first launched | April 11, 2011 + |
full page name | intel/atom/z670 + |
has ecc memory support | false + |
has feature | Hyper-Threading Technology + and Enhanced SpeedStep Technology + |
has intel enhanced speedstep technology | true + |
has locked clock multiplier | true + |
has simultaneous multithreading | true + |
instance of | microprocessor + |
integrated gpu | PowerVR SGX535 + |
integrated gpu base frequency | 400 MHz (0.4 GHz, 400,000 KHz) + |
integrated gpu designer | Imagination Technologies + |
integrated gpu max memory | 256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) + |
isa | x86-32 + |
isa family | x86 + |
l1$ size | 56 KiB (57,344 B, 0.0547 MiB) + |
l1d$ description | 6-way set associative + |
l1d$ size | 24 KiB (24,576 B, 0.0234 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 32 KiB (32,768 B, 0.0313 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + |
last order | May 31, 2013 + |
last shipment | November 8, 2013 + |
ldate | April 11, 2011 + |
main image | + |
manufacturer | Intel + |
market segment | Mobile + |
max case temperature | 343.15 K (70 °C, 158 °F, 617.67 °R) + |
max cpu count | 1 + |
max junction temperature | 363.15 K (90 °C, 194 °F, 653.67 °R) + |
max memory | 2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) + |
max memory bandwidth | 2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) + |
max memory channels | 1 + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Bonnell + |
min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
min storage temperature | 218.15 K (-55 °C, -67 °F, 392.67 °R) + |
model number | Z670 + |
name | Atom Z670 + |
package | FCBGA-518 + |
part number | AY80609007293AA + |
platform | Oak Trail + |
process | 45 nm (0.045 μm, 4.5e-5 mm) + |
release price | $ 75.00 (€ 67.50, £ 60.75, ¥ 7,749.75) + |
s-spec | SLC2P + |
series | Z650 + |
smp max ways | 1 + |
socket | BGA-518 + |
supported memory type | DDR-400 + and DDR2-800 + |
tdp | 3 W (3,000 mW, 0.00402 hp, 0.003 kW) + |
technology | CMOS + |
thread count | 2 + |
word size | 32 bit (4 octets, 8 nibbles) + |