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Difference between revisions of "qualcomm/msm6xxx"
< qualcomm

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| succession        = Yes
 
| succession        = Yes
| predecessor        = MSM5100
+
| predecessor        = MSM5500
| predecessor link  = qualcomm/msm5100
+
| predecessor link  = qualcomm/msm5500
 
| successor          = MSM7xxx
 
| successor          = MSM7xxx
 
| successor link    = qualcomm/msm7xxx
 
| successor link    = qualcomm/msm7xxx
 
}}
 
}}
'''MSM6xxx''' was a family of mobile [[2G]]/[[3G]] [[ARM]] [[system on chip]]s designed by [[Qualcomm]] and introduced in [[2002]].
+
'''MSM6xxx''' was a family of {{arch|32}} mobile [[ARM]] [[system on chip]]s with [[2G]]/[[3G]] capabilities designed by [[Qualcomm]] and introduced in [[2002]].
  
 
== Overview ==
 
== Overview ==

Revision as of 00:05, 20 November 2016

Qualcomm MSM5500
Developer Qualcomm
Introduction March 20, 2001 (announced)
2002 (launch)
Architecture Mobile system-on-a-chip
ISA ARMv4
µarch ARM7TDMI
Word size 32 bit
4 octets
8 nibbles
Process 180 nm
0.18 μm
1.8e-4 mm
, 130 nm
0.13 μm
1.3e-4 mm
, 90 nm
0.09 μm
9.0e-5 mm
Technology CMOS
Package FBGA-320
Succession
MSM5500 MSM7xxx

MSM6xxx was a family of 32-bit mobile ARM system on chips with 2G/3G capabilities designed by Qualcomm and introduced in 2002.

Overview

Qualcomm announced the MSM6xxx family of system on chips in March of 2001. The chips offered key technologies such as second-generation (2G) and third-generation (3G) wireless technologies and wireless global roaming. All chips have support for gpsOne position location capabilities, Bluetooth connectivity capabilities, UMTS Subscriber Identity Module (SIM), Removable User Identity Module (R-UIM) and advanced multimedia features such as Qtunes audio decoders, MPEG, MP3, and Compact Media Extension (CME) MIDI software support.

Members

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Documents

Facts about "MSM6xxx - Qualcomm"
designerQualcomm + and ARM Holdings +
first announcedMarch 20, 2001 +
first launched2002 +
full page namequalcomm/msm6xxx +
instance ofsystem on a chip family +
instruction set architectureARMv4 + and ARMv5 +
main designerQualcomm +
manufacturerTSMC + and IBM +
microarchitectureARM7TDMI + and ARM926EJ-S +
nameQualcomm MSM6xxx +
packageFBGA-208 +, CSP-225 +, CSP-351 + and CSP-409 +
process250 nm (0.25 μm, 2.5e-4 mm) +, 180 nm (0.18 μm, 1.8e-4 mm) +, 130 nm (0.13 μm, 1.3e-4 mm) +, 90 nm (0.09 μm, 9.0e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) +