From WikiChip
Difference between revisions of "qualcomm/msm6xxx"
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| succession = Yes | | succession = Yes | ||
− | | predecessor = | + | | predecessor = MSM5500 |
− | | predecessor link = qualcomm/ | + | | predecessor link = qualcomm/msm5500 |
| successor = MSM7xxx | | successor = MSM7xxx | ||
| successor link = qualcomm/msm7xxx | | successor link = qualcomm/msm7xxx | ||
}} | }} | ||
− | '''MSM6xxx''' was a family of mobile [[ | + | '''MSM6xxx''' was a family of {{arch|32}} mobile [[ARM]] [[system on chip]]s with [[2G]]/[[3G]] capabilities designed by [[Qualcomm]] and introduced in [[2002]]. |
== Overview == | == Overview == |
Revision as of 00:05, 20 November 2016
Qualcomm MSM5500 | |
Developer | Qualcomm |
Introduction | March 20, 2001 (announced) 2002 (launch) |
Architecture | Mobile system-on-a-chip |
ISA | ARMv4 |
µarch | ARM7TDMI |
Word size | 32 bit 4 octets
8 nibbles |
Process | 180 nm 0.18 μm , 130 nm1.8e-4 mm 0.13 μm , 90 nm1.3e-4 mm 0.09 μm
9.0e-5 mm |
Technology | CMOS |
Package | FBGA-320 |
Succession | |
← | → |
MSM5500 | MSM7xxx |
MSM6xxx was a family of 32-bit mobile ARM system on chips with 2G/3G capabilities designed by Qualcomm and introduced in 2002.
Overview
Qualcomm announced the MSM6xxx family of system on chips in March of 2001. The chips offered key technologies such as second-generation (2G) and third-generation (3G) wireless technologies and wireless global roaming. All chips have support for gpsOne position location capabilities, Bluetooth connectivity capabilities, UMTS Subscriber Identity Module (SIM), Removable User Identity Module (R-UIM) and advanced multimedia features such as Qtunes audio decoders, MPEG, MP3, and Compact Media Extension (CME) MIDI software support.
Members
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Documents
Facts about "MSM6xxx - Qualcomm"
designer | Qualcomm + and ARM Holdings + |
first announced | March 20, 2001 + |
first launched | 2002 + |
full page name | qualcomm/msm6xxx + |
instance of | system on a chip family + |
instruction set architecture | ARMv4 + and ARMv5 + |
main designer | Qualcomm + |
manufacturer | TSMC + and IBM + |
microarchitecture | ARM7TDMI + and ARM926EJ-S + |
name | Qualcomm MSM6xxx + |
package | FBGA-208 +, CSP-225 +, CSP-351 + and CSP-409 + |
process | 250 nm (0.25 μm, 2.5e-4 mm) +, 180 nm (0.18 μm, 1.8e-4 mm) +, 130 nm (0.13 μm, 1.3e-4 mm) +, 90 nm (0.09 μm, 9.0e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) + |
technology | CMOS + |
word size | 32 bit (4 octets, 8 nibbles) + |