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Difference between revisions of "amd/k6-iii+"
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== Architecture == | == Architecture == | ||
{{main|amd/microarchitectures/k6-iii|l1=K6-III Microarchitecture}} | {{main|amd/microarchitectures/k6-iii|l1=K6-III Microarchitecture}} | ||
| − | K6-III+ models are architecturally identical to the original {{amd|K6-III}}, except manufactured on a [[0.18 µm]] after a process shrink. K6-III+ models do incorporate {{amd|PowerNow!}} as well. | + | K6-III+ models are architecturally identical to the original {{amd|K6-III}}, except manufactured on a [[0.18 µm]] after a process shrink. K6-III+ models do incorporate {{amd|PowerNow!}} as well. Instructions set: MMX , 3DNow! , Extended 3DNow! (Extended MMX NOT support) |
== Members == | == Members == | ||
Latest revision as of 18:14, 27 October 2018
| K6-III+ | |
| |
| Marketing Logo | |
| Developer | AMD |
| Manufacturer | AMD |
| Type | Microprocessors |
| Introduction | April 18, 2000 (announced) April 18, 2000 (launch) |
| ISA | IA-32 |
| µarch | K6-III |
| Word size | 32 bit 4 octets
8 nibbles |
| Process | 180 nm 0.18 μm
1.8e-4 mm |
| Technology | CMOS |
| Clock | 450 MHz-550 MHz |
| Package | CPGA-321, OBGA-349 |
| Socket | Socket 7, Super Socket 7, BGA-349 |
| Succession | |
| ← | |
| K6-III | |
K6-III+ (K6-III Plus) was a family of mobile microprocessors introduced by AMD in early 2000 as a replacement for the previous generation of K6-III mobile processors. K6-III+ enjoyed higher performance and lower voltage as a result of a die shrink.
Contents
Overview[edit]
Introduced in April of 2000 and on AMD's new 0.18 µm process, the K6-III+ was designed to replace the older K6-III-P mobile processors. Due to the processor shrink, the new models operated at higher frequency, dissipated less power, and operated at lower voltages. Many models could be clocked as high as 600-650 MHz. K6-III+ never recived as much attention because AMD was focused on promoting their Athlon and Duron (K7) families instead.
Architecture[edit]
- Main article: K6-III Microarchitecture
K6-III+ models are architecturally identical to the original K6-III, except manufactured on a 0.18 µm after a process shrink. K6-III+ models do incorporate PowerNow! as well. Instructions set: MMX , 3DNow! , Extended 3DNow! (Extended MMX NOT support)
Members[edit]
K6-III+ Mobile models[edit]
,,| Mobile K6-III+ Processors | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Model | Launched | Process | Freq | Mult. | Bus | Max Mem | VCORE | Package | Min Tcase | Max Tcase |
| AMD-K6-III+/400ACZ | 18 April 2000 | 180 nm 0.18 μm 1.8e-4 mm | 449.99 MHz 0.45 GHz 449,990 kHz | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | ||
| AMD-K6-III+/475ACZ | 18 April 2000 | 180 nm 0.18 μm 1.8e-4 mm | 475 MHz 0.475 GHz 475,000 kHz | 5 | 95 MHz 0.095 GHz 95,000 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | |
| AMD-K6-III+/500ACZ | 18 April 2000 | 180 nm 0.18 μm 1.8e-4 mm | 499.99 MHz 0.5 GHz 499,990 kHz | 5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | |
| Count: 3 | ||||||||||
K6-III+ Embedded models[edit]
Note that while AMD's Ordering Part Number (OPN) included the "E" for embedded, the actual chips themselves did not. This makes it impossible to distinguish some K6-III+ Embedded parts from K6-III+ Mobile by just looking at the chip markings.
,,,,,,,,| Embedded K6-III+ Processors | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Model | Launched | Process | Freq | Mult. | Bus | Max Mem | VCORE | Package | Min Tcase | Max Tcase |
| AMD-K6-IIIE+/400ACR | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 399.99 MHz 0.4 GHz 399,990 kHz | 4 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 70 °C 343.15 K 158 °F 617.67 °R | |
| AMD-K6-IIIE+/400ATZ | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 399 MHz 0.399 GHz 399,000 kHz | 4 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 1.6 V 16 dV 160 cV 1,600 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | |
| AMD-K6-IIIE+/400ICR | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 399.99 MHz 0.4 GHz 399,990 kHz | 4 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | OBGA-349 | 0 °C 273.15 K 32 °F 491.67 °R | 70 °C 343.15 K 158 °F 617.67 °R |
| AMD-K6-IIIE+/400ITZ | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 399.99 MHz 0.4 GHz 399,990 kHz | 4 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 1.6 V 16 dV 160 cV 1,600 mV | OBGA-349 | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R |
| AMD-K6-IIIE+/450ACR | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 449.99 MHz 0.45 GHz 449,990 kHz | 4.5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 70 °C 343.15 K 158 °F 617.67 °R | |
| AMD-K6-IIIE+/450APZ | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 449.99 MHz 0.45 GHz 449,990 kHz | 4.5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 1.7 V 17 dV 170 cV 1,700 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | |
| AMD-K6-IIIE+/500ACR | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 499.99 MHz 0.5 GHz 499,990 kHz | 5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 70 °C 343.15 K 158 °F 617.67 °R | |
| AMD-K6-IIIE+/500ANZ | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 499.99 MHz 0.5 GHz 499,990 kHz | 5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 1.8 V 18 dV 180 cV 1,800 mV | 0 °C 273.15 K 32 °F 491.67 °R | 85 °C 358.15 K 185 °F 644.67 °R | |
| AMD-K6-IIIE+/550ACR | 25 September 2000 | 180 nm 0.18 μm 1.8e-4 mm | 499.99 MHz 0.5 GHz 499,990 kHz | 5 | 99.99 MHz 0.1 GHz 99,990 kHz | 4,096 MiB 4,194,304 KiB 4,294,967,296 B 4 GiB 0.00391 TiB | 2 V 20 dV 200 cV 2,000 mV | 0 °C 273.15 K 32 °F 491.67 °R | 70 °C 343.15 K 158 °F 617.67 °R | |
| Count: 9 | ||||||||||
Documents[edit]
Datasheets[edit]
- AMD K6-IIIE+ Embedded Processor Data Sheet; Publication # 23543; Rev: A; Amendment/0; Issue Date: September 2000.
- Mobile AMD-K6-III+ Processor Data Sheet; Publication # 23535; Rev: A; Amendment/0; Issue Date: May 2000.
Facts about "K6-III+ - AMD"
| designer | AMD + |
| first announced | April 18, 2000 + |
| first launched | April 18, 2000 + |
| full page name | amd/k6-iii+ + |
| instance of | microprocessor family + |
| instruction set architecture | IA-32 + |
| main designer | AMD + |
| manufacturer | AMD + |
| microarchitecture | K6-III + |
| name | K6-III+ + |
| package | CPGA-321 + and OBGA-349 + |
| process | 180 nm (0.18 μm, 1.8e-4 mm) + |
| socket | Socket 7 +, Super Socket 7 + and BGA-349 + |
| technology | CMOS + |
| word size | 32 bit (4 octets, 8 nibbles) + |