Semiconductor & Computer Engineering
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Difference between revisions of "defect density"
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| − | {{title|Defect Density (D<sub>0</sub>)}} | + | {{title|Defect Density (D<sub>0</sub>)}}{{yield}} |
'''Defect density''' ('''D<sub>0</sub>''') is the number of [[killer defects]] per unit area (typically cm²). | '''Defect density''' ('''D<sub>0</sub>''') is the number of [[killer defects]] per unit area (typically cm²). | ||
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| + | == Overview == | ||
| + | The defect density (D<sub>0</sub>) of a process is the number of defects per die that are large enough to become killer defects per unit area. Defects that are small enough to not cause operational issues are not taken into account in this value. | ||
| + | |||
| + | :<math>D_0 = \frac{n}{N A}</math> | ||
== See also == | == See also == | ||
* [[Yield]] | * [[Yield]] | ||
| + | * [[Critical area]] | ||
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{{stub}} | {{stub}} | ||
Latest revision as of 13:42, 28 January 2019
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| Concepts | |
Defect density (D0) is the number of killer defects per unit area (typically cm²).
Overview[edit]
The defect density (D0) of a process is the number of defects per die that are large enough to become killer defects per unit area. Defects that are small enough to not cause operational issues are not taken into account in this value.
See also[edit]
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