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Difference between revisions of "mediatek/helio/mt6797"
< mediatek‎ | helio

(Infinix Zero 4 Plus used it too)
 
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|process=20 nm
 
|process=20 nm
 
|technology=CMOS
 
|technology=CMOS
 +
|die area=100 mm²
 
|word size=64 bit
 
|word size=64 bit
 
|core count=10
 
|core count=10
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|type=LPDDR3-1600
 
|type=LPDDR3-1600
 
|ecc=No
 
|ecc=No
−
|max mem=4 GiB
+
|max mem=6 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
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* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 X620]]
 
* [[used by::LeEco Le 2 X620]]
 +
* [[used by::LeEco Le S3 X626]]
 
* [[used by::Meizu MX6]]
 
* [[used by::Meizu MX6]]
 
* [[used by::Sharp Z2]]
 
* [[used by::Sharp Z2]]
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* [[used by::Xiaomi Redmi Pro]]
 
* [[used by::Xiaomi Redmi Pro]]
 
* [[used by::Leagoo T10]]
 
* [[used by::Leagoo T10]]
 +
* [[used by::Lenovo k8 Note]]
 +
* [[used by::Chuwi Hi9 Air]]
 +
* [[used by::CHAOHENG 10]]
 +
* [[used by::Infinix Zero 4 Plus]]
 +
{{expand list}}
 +
 +
== Die ==
 +
* TSMC [[20 nm process]]
 +
* 100 mm² die size
 +
* Quad-core ULP {{armh|Cortex-A53|l=arch}}
 +
** ~21.81 mm² per cluster
 +
*** ~4.23 mm² per core
 +
* Quad-core efficient {{armh|Cortex-A53|l=arch}}
 +
** ~29.73 mm² per cluster
 +
*** ~5.41 mm² per core
 +
* Dual-core High-performance {{armh|Cortex-A72|l=arch}} +  1 MiB L2
 +
** ~27.36 mm² per cluster
 +
*** ~ 9.60 mm² per core
 +
*** ~ 7.50 mm² for 1 MiB L2
 +
 +
 +
:[[File:mt6797 die.png|600px]]
  
 
== Bibliography ==
 
== Bibliography ==
 
* Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
 
* Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.

Latest revision as of 20:16, 2 May 2021

Edit Values
MediaTek Helio X20
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X20
Part NumberMT6797,
MTK6797
MarketMobile, Embedded
IntroductionMay 12, 2015 (announced)
March 16, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,100 MHz, 1,850 MHz, 1,400 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A72
Core NameCortex-A53, Cortex-A72
Process20 nm
TechnologyCMOS
Die100 mm²
Word Size64 bit
Cores10
Threads10
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X20 (MT6797) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.1 GHz) and supports up to 6 GiB of dual-channel LPDDR3-1866 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X20 is identical to Helio X25 except for the lower clocked A72 cores and the lower clocked GPU.

Architecture[edit]

The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Architecture slide (note speeds changed since)

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1600
Supports ECCNo
Max Mem6 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth12.8 GB/s (11.92 GiB/s)
"GB/s(11.92GiB/s)" is not declared as a valid unit of measurement for this property.
Bandwidth
Single 6.4 GB/s (5.96 GiB/s)
Double 12.8 GB/s (11.92 GiB/s)

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T880
DesignerARM Holdings
Execution Units4
Frequency780 MHz
0.78 GHz
780,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image[edit]

  • Integrated image signal processor supports 32 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Alcatel Flash (2017)
  • Doogee F7
  • Doogee F7 Pro
  • Elephone R9
  • Elephone S7
  • HomTom HT10
  • Kodak Ektra
  • LeEco Le 2 Pro X620
  • LeEco Le 2 X620
  • LeEco Le S3 X626
  • Meizu MX6
  • Sharp Z2
  • Vernee Apollo Lite
  • Xiaomi Redmi Note 4
  • Xiaomi Redmi Pro
  • Leagoo T10
  • Lenovo k8 Note
  • Chuwi Hi9 Air
  • CHAOHENG 10
  • Infinix Zero 4 Plus

This list is incomplete; you can help by expanding it.

Die[edit]

  • TSMC 20 nm process
  • 100 mm² die size
  • Quad-core ULP Cortex-A53
    • ~21.81 mm² per cluster
      • ~4.23 mm² per core
  • Quad-core efficient Cortex-A53
    • ~29.73 mm² per cluster
      • ~5.41 mm² per core
  • Dual-core High-performance Cortex-A72 + 1 MiB L2
    • ~27.36 mm² per cluster
      • ~ 9.60 mm² per core
      • ~ 7.50 mm² for 1 MiB L2


mt6797 die.png

Bibliography[edit]

  • Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6797&oldid=98787"
Facts about "Helio X20 (MT6797) - MediaTek"
RDF feed
base frequency2,100 MHz (2.1 GHz, 2,100,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
die area100 mm² (0.155 in², 1 cm², 100,000,000 µm²) +
familyHelio +
first announcedMay 12, 2015 +
first launchedMarch 16, 2016 +
full page namemediatek/helio/mt6797 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency780 MHz (0.78 GHz, 780,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateMarch 16, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X20 +
nameMediaTek Helio X20 +
part numberMT6797 + and MTK6797 +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byAlcatel Flash (2017) +, Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, Kodak Ektra +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, LeEco Le S3 X626 +, Meizu MX6 +, Sharp Z2 +, Vernee Apollo Lite +, Xiaomi Redmi Note 4 +, Xiaomi Redmi Pro +, Leagoo T10 +, Lenovo k8 Note +, Chuwi Hi9 Air +, CHAOHENG 10 + and Infinix Zero 4 Plus +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +