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| title            = K3
 
| title            = K3
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| image            = hi3620.png
 
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| developer        = HiSilicon
 
| developer        = HiSilicon
 
| developer 2      = ARM Holdings
 
| developer 2      = ARM Holdings
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| word              = 32 bit
 
| word              = 32 bit
 
| proc              = 0.18 µm
 
| proc              = 0.18 µm
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| proc 2            = 40 nm
 
| tech              = CMOS
 
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== Overview ==
 
== Overview ==
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K3 was a family of high-performance mobile [[ARM]] [[system on chips]] designed by HiSilicon. Introduced in [[2008]], those chips were designed for high-performance [[smartphones]] and [[tablets]] primarily. Most of those chips were used heavily, although not exclusively, by [[Huawei]] own consumer electronics. K3 was HiSilicon's first series to directly target the mobile performance market. In late 2013, HiSilicon replaced the K3 family by the {{\\|Kirin}} family and expanded their portfolio into mid-range performance models.
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[[File:kunpeng roadmap (2019).jpeg|left|thumb|Roadmap]]
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[[File:hi1620 exhibit sign.jpg|left|thumb|TaiShan]]
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K3 was a family of high-performance mobile [[ARM]] [[system on chips]] designed by [[HiSilicon]].  
  
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== Members ==
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Introduced in [[2008]], those chips were designed for high-performance [[smartphones]] and [[tablets]] primarily. Most of those chips were used heavily, although not exclusively, by [[Huawei]] own consumer electronics. K3 was [[HiSilicon]]'s first series to directly target the mobile performance market. In late [[2013]], [[HiSilicon]] replaced the K3 family by the {{\\|Kirin}} family and expanded their portfolio into mid-range performance models.  
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Latest revision as of 15:05, 27 March 2025

K3
hi3620.png
Developer HiSilicon, ARM Holdings
Manufacturer TSMC
Type Sysstem on chips
Introduction 2008 (announced)
ISA ARMv5
µarch ARM9
Word size 32 bit
4 octets
8 nibbles
Process 0.18 µm
180 nm
1.8e-4 mm
, 40 nm
0.04 μm
4.0e-5 mm
Technology CMOS
Succession
→
Kirin

K3 was a family of 32-bit ARM mobile SoCs introduced by HiSilicon since 2008.

Overview[edit]

Roadmap
TaiShan

K3 was a family of high-performance mobile ARM system on chips designed by HiSilicon.

Introduced in 2008, those chips were designed for high-performance smartphones and tablets primarily. Most of those chips were used heavily, although not exclusively, by Huawei own consumer electronics. K3 was HiSilicon's first series to directly target the mobile performance market. In late 2013, HiSilicon replaced the K3 family by the Kirin family and expanded their portfolio into mid-range performance models.

Models[edit]

 List of K3 Processors
 Main processorIntegrated Graphics
ModelLaunchedTransistorsCoresFrequencyCoresISADesignerNameFrequency
K3V1June 2008200,000,00010.46 GHz
460 MHz
460,000 kHz
ARM926EJ-SARMv5
K3V226 February 2012600,000,00041.5 GHz
1,500 MHz
1,500,000 kHz
Cortex-A9ARMv7VivanteGC4000480 MHz
0.48 GHz
480,000 KHz
K3V2E2013600,000,00041.5 GHz
1,500 MHz
1,500,000 kHz
Cortex-A9ARMv7VivanteGC4000480 MHz
0.48 GHz
480,000 KHz
Count: 3

See also[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=hisilicon/k3&oldid=103080"
Facts about "K3 - HiSilicon"
RDF feed
designerHiSilicon + and ARM Holdings +
first announced2008 +
full page namehisilicon/k3 +
instance ofintegrated circuit family +
instruction set architectureARMv5 +
main designerHiSilicon +
manufacturerTSMC +
microarchitectureARM9 +
nameK3 +
process180 nm (0.18 μm, 1.8e-4 mm) + and 40 nm (0.04 μm, 4.0e-5 mm) +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) +