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{{intel title|Atom Z625}}
 
{{intel title|Atom Z625}}
−
{{mpu
+
{{chip
 
| name                = Atom Z625
 
| name                = Atom Z625
−
| no image            = Yes
+
| image              = lincroft chips.png
−
| image              =  
+
| image size          = 250px
−
| image size          =  
 
 
| caption            =  
 
| caption            =  
 
| designer            = Intel
 
| designer            = Intel
Line 10: Line 9:
 
| model number        = Z625
 
| model number        = Z625
 
| part number        = AY80609003987AB
 
| part number        = AY80609003987AB
−
| part number 1      =
 
 
| part number 2      =  
 
| part number 2      =  
 
| part number 3      =  
 
| part number 3      =  
 +
| part number 4      =
 
| s-spec              = SLBZD
 
| s-spec              = SLBZD
 
| s-spec 2            =  
 
| s-spec 2            =  
Line 59: Line 58:
 
| max memory          = 2 GiB
 
| max memory          = 2 GiB
  
−
| electrical          = Yes
+
 
 
| power              =  
 
| power              =  
 
| average power      =  
 
| average power      =  
Line 89: Line 88:
 
| package module 1    = {{packages/intel/fcbga-518}}
 
| package module 1    = {{packages/intel/fcbga-518}}
 
}}
 
}}
−
'''Atom Z625''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in early [[2010]]. The Z625, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz and a burst frequency of 1.9 GHz. The chip has a TDP of 2.2 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z625 incorporates an {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
+
'''Atom Z625''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in early [[2010]]. The Z625, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz and a burst frequency of 1.9 GHz. The chip has a TDP of 2.2 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z625 incorporates a {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
 +
 
 +
This chip communicates with the [[southbridge]] chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a [[GTL|AGTL+]] signaling bus for this.
 +
 
 +
== Cache ==
 +
{{main|intel/microarchitectures/bonnell#Memory_Hierarchy|l1=Bonnell § Cache}}
 +
{{cache size
 +
|l1 cache=56 KiB
 +
|l1i cache=32 KiB
 +
|l1i break=1x32 KiB
 +
|l1i desc=8-way set associative
 +
|l1d cache=24 KiB
 +
|l1d break=1x24 KiB
 +
|l1d desc=6-way set associative
 +
|l1d policy=write-back
 +
|l2 cache=512 KiB
 +
|l2 break=1x512 KiB
 +
|l2 desc=8-way set associative
 +
}}
 +
 
 +
== Memory controller ==
 +
{{memory controller
 +
|type=DDR-400
 +
|type 2=DDR2-800
 +
|ecc=No
 +
|max mem=2 GiB
 +
|controllers=1
 +
|channels=1
 +
|width=32 bit
 +
|max bandwidth=2.98 GiB/s
 +
|bandwidth schan=2.98 GiB/s
 +
|pae=32 bit
 +
}}
 +
 
 +
== Expansions ==
 +
{{expansions
 +
| usb revision      = 2.0
 +
| usb ports          = 4
 +
| uart              = Yes
 +
| gp io              = Yes
 +
}}
 +
 
 +
== Graphics ==
 +
This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed [[Imagination Technologies|Imagination]] {{imgtec|PowerVR SGX 535}} [[IGP]].
 +
{{integrated graphics
 +
| gpu                = PowerVR SGX535
 +
| device id          =
 +
| designer            = Imagination Technologies
 +
| execution units    =
 +
| max displays        = 1
 +
| max memory          = 256 MiB
 +
| frequency          = 400 MHz
 +
 
 +
| output dsi          = Yes
 +
| output lvds        = Yes
 +
 
 +
| max res dsi        = 1024x600
 +
| max res lvds        = 1366x768
 +
 
 +
| direct3d ver        = 9.0c
 +
| opengl ver          = 2.1
 +
| openvg ver          = 1.1
 +
| opengl es ver      = 1.1
 +
| opengl es ver 2    = 2.0
 +
 
 +
| features            = Yes
 +
| intel clear video  = Yes
 +
}}
 +
 
 +
* Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
 +
* Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)
 +
 
 +
== Features ==
 +
{{x86 features
 +
|real=Yes
 +
|protected=Yes
 +
|smm=Yes
 +
|fpu=Yes
 +
|x8616=Yes
 +
|x8632=Yes
 +
|x8664=Yes
 +
|nx=Yes
 +
|mmx=Yes
 +
|emmx=Yes
 +
|sse=Yes
 +
|sse2=Yes
 +
|sse3=Yes
 +
|ssse3=Yes
 +
|sse41=No
 +
|sse42=No
 +
|sse4a=No
 +
|avx=No
 +
|avx2=No
 +
 
 +
|abm=No
 +
|tbm=No
 +
|bmi1=No
 +
|bmi2=No
 +
|fma3=No
 +
|fma4=No
 +
|aes=No
 +
|rdrand=No
 +
|sha=No
 +
|xop=No
 +
|adx=No
 +
|clmul=No
 +
|f16c=No
 +
|tbt1=No
 +
|tbt2=No
 +
|tbmt3=No
 +
|bpt=Yes
 +
|eist=Yes
 +
|sst=No
 +
|flex=No
 +
|fastmem=No
 +
|isrt=No
 +
|sba=No
 +
|mwt=No
 +
|sipp=No
 +
|att=No
 +
|ipt=No
 +
|tsx=No
 +
|txt=No
 +
|ht=Yes
 +
|vpro=No
 +
|vtx=No
 +
|vtd=No
 +
|ept=No
 +
|mpx=No
 +
|sgx=No
 +
|securekey=No
 +
|osguard=No
 +
|3dnow=No
 +
|e3dnow=No
 +
|smartmp=No
 +
|powernow=No
 +
|amdvi=No
 +
|amdv=No
 +
|rvi=No
 +
|smt=No
 +
|sensemi=No
 +
|xfr=No
 +
}}
 +
 
 +
== Die Shot ==
 +
{{see also|intel/microarchitectures/bonnell#Lincroft|l1=Bonnell § Lincroft Die}}
 +
* [[45 nm process]]
 +
* 140,000,000
 +
* Die size 7.34 mm × 8.89 mm
 +
* Size area 65.2526 mm²
 +
[[File:lincroft die shot.png|500px]]
 +
 
 +
[[File:lincroft die shot (annotated).png|500px]]
 +
 
 +
 
 +
[[File:lincroft die shot 2.png|500px]]
 +
 
 +
[[File:lincroft die shot 2 (annotated).png|500px]]
 +
 
 +
== Documents ==
 +
=== Datasheet ===
 +
* [[:File:atom-z6xx-datasheet.pdf|Atom Z6xx Datasheet]], May 2011
 +
* [[:File:atom-z6xx-specification-update.pdf|Atom Z6xx Specs Update]], May 2011

Latest revision as of 15:15, 13 December 2017

Edit Values
Atom Z625
lincroft chips.png
General Info
DesignerIntel
ManufacturerIntel
Model NumberZ625
Part NumberAY80609003987AB
S-SpecSLBZD
MarketMobile
IntroductionMay 4, 2010 (announced)
May 4, 2010 (launched)
ShopAmazon
General Specs
FamilyAtom
SeriesZ600
LockedYes
Frequency1,500 MHz
Turbo FrequencyYes
Turbo Frequency1,900 MHz (1 core)
Bus typecDMI
Bus speed100 MHz
Bus rate400 MT/s
Clock multiplier15
CPUID20661
Microarchitecture
ISAx86-32 (x86)
MicroarchitectureBonnell
PlatformMoorestown
ChipsetLangwell
Core NameLincroft
Core Family6
Core Model38
Core Stepping1
Process45 nm
Transistors140,000,000
TechnologyCMOS
Die65.2526 mm²
8.89 mm × 7.34 mm
Word Size32 bit
Cores1
Threads2
Max Memory2 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.75 V-1.2 V
TDP2.2 W
Tjunction0 °C – 90 °C
Tstorage-55 °C – 125 °C
Packaging
PackageFCBGA-518 (FCBGA)
Dimension13.8 mm x 13.8 mm x 1.1 mm
Pin Count518
SocketBGA-518 (BGA)

Atom Z625 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in early 2010. The Z625, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz and a burst frequency of 1.9 GHz. The chip has a TDP of 2.2 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z625 incorporates a GMA 600 IGP operating at 400 MHz.

This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.

Cache[edit]

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$56 KiB
57,344 B
0.0547 MiB
L1I$32 KiB
32,768 B
0.0313 MiB
1x32 KiB8-way set associative 
L1D$24 KiB
24,576 B
0.0234 MiB
1x24 KiB6-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB8-way set associative 

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR-400, DDR2-800
Supports ECCNo
Max Mem2 GiB
Controllers1
Channels1
Width32 bit
Max Bandwidth2.98 GiB/s
3,051.52 MiB/s
3.2 GB/s
3,199.751 MB/s
0.00291 TiB/s
0.0032 TB/s
Bandwidth
Single 2.98 GiB/s
Physical Address (PAE)32 bit

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0
Ports4
UART
GP I/OYes


Graphics[edit]

This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR SGX535
DesignerImagination Technologies
Max Displays1
Max Memory256 MiB
262,144 KiB
268,435,456 B
0.25 GiB
Frequency400 MHz
0.4 GHz
400,000 KHz
OutputDSI, LVDS
Max Resolution
DSI1024x600
LVDS1366x768
Standards
Direct3D9.0c
OpenGL2.1
OpenGL ES1.1, 2.0
OpenVG1.1
Additional Features
Intel Clear Video
  • Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
  • Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)

Features[edit]

Die Shot[edit]

See also: Bonnell § Lincroft Die
  • 45 nm process
  • 140,000,000
  • Die size 7.34 mm × 8.89 mm
  • Size area 65.2526 mm²

lincroft die shot.png

lincroft die shot (annotated).png


lincroft die shot 2.png

lincroft die shot 2 (annotated).png

Documents[edit]

Datasheet[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/atom/z625&oldid=70414"
Facts about "Atom Z625 - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Atom Z625 - Intel#package +
base frequency1,500 MHz (1.5 GHz, 1,500,000 kHz) +
bus rate400 MT/s (0.4 GT/s, 400,000 kT/s) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
bus typecDMI +
chipsetLangwell +
clock multiplier15 +
core count1 +
core family6 +
core model38 +
core nameLincroft +
core stepping1 +
core voltage (max)1.2 V (12 dV, 120 cV, 1,200 mV) +
core voltage (min)0.75 V (7.5 dV, 75 cV, 750 mV) +
cpuid20661 +
designerIntel +
die area65.253 mm² (0.101 in², 0.653 cm², 65,252,600 µm²) +
die length8.89 mm (0.889 cm, 0.35 in, 8,890 µm) +
die width7.34 mm (0.734 cm, 0.289 in, 7,340 µm) +
familyAtom +
first announcedMay 4, 2010 +
first launchedMay 4, 2010 +
full page nameintel/atom/z625 +
has ecc memory supportfalse +
has featureHyper-Threading Technology +, Burst Performance Technology + and Enhanced SpeedStep Technology +
has intel burst performance technologytrue +
has intel enhanced speedstep technologytrue +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuPowerVR SGX535 +
integrated gpu base frequency400 MHz (0.4 GHz, 400,000 KHz) +
integrated gpu designerImagination Technologies +
integrated gpu max memory256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) +
isax86-32 +
isa familyx86 +
l1$ size56 KiB (57,344 B, 0.0547 MiB) +
l1d$ description6-way set associative +
l1d$ size24 KiB (24,576 B, 0.0234 MiB) +
l1i$ description8-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateMay 4, 2010 +
main imageFile:lincroft chips.png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) +
max memory bandwidth2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureBonnell +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature218.15 K (-55 °C, -67 °F, 392.67 °R) +
model numberZ625 +
nameAtom Z625 +
packageFCBGA-518 +
part numberAY80609003987AB +
platformMoorestown +
process45 nm (0.045 μm, 4.5e-5 mm) +
s-specSLBZD +
seriesZ600 +
smp max ways1 +
socketBGA-518 +
supported memory typeDDR-400 + and DDR2-800 +
tdp2.2 W (2,200 mW, 0.00295 hp, 0.0022 kW) +
technologyCMOS +
thread count2 +
transistor count140,000,000 +
turbo frequency (1 core)1,900 MHz (1.9 GHz, 1,900,000 kHz) +
word size32 bit (4 octets, 8 nibbles) +