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{{mediatek title|Helio X27 (MT6797X)}}
 
{{mediatek title|Helio X27 (MT6797X)}}
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{{mpu
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{{chip
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| name               = MediaTek Helio X27
+
|name=MediaTek Helio X27
−
| no image           = yes
+
|no image=Yes
−
| image              =
+
|designer=MediaTek
−
| image size          =
+
|designer 2=ARM Holdings
−
| caption            =  
+
|manufacturer=TSMC
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| designer           = MediaTek
+
|model number=Helio X27
−
| designer 2         = ARM Holdings
+
|part number=MT6797X
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| manufacturer       = TSMC
+
|part number 2=MTK6797X
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| model number       = Helio X27
+
|market=Mobile
−
| part number         = MT6797X
+
|market 2=Embedded
−
| part number 2       = MTK6797X
+
|first announced=December 2, 2016
−
| market             = Mobile
+
|first launched=December 2, 2016
−
| market 2           = Embedded
+
|family=Helio
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| first announced     = December 2, 2016
+
|series=Helio X
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| first launched     = December 2, 2016
+
|frequency=2,600 MHz
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| last order          =
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|frequency 2=2,000 MHz
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| last shipment      =
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|frequency 3=1,600 MHz
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| release price      =
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|bus type=AMBA 4 AXI
−
 
+
|isa=ARMv8
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| family             = Helio
+
|isa family=ARM
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| series             = Helio X
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|microarch=Cortex-A53
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| locked              =
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|microarch 2=Cortex-A72
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| frequency           = 2,600 MHz
+
|core name=Cortex-A53
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| frequency 2         = 2,000 MHz
+
|core name 2=Cortex-A72
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| frequency 3         = 1,600 MHz
+
|process=20 nm
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| bus type           = AMBA 4 AXI
+
|technology=CMOS
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| bus speed          =  
+
|word size=64 bit
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| bus rate            =
+
|core count=10
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| bus links          =
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|thread count=10
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| clock multiplier    =
+
|max cpus=1
−
 
 
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| isa family         = ARM
 
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| isa                = ARMv8
 
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| microarch           = Cortex-A53
 
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| microarch 2         = Cortex-A72
 
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| platform            =
 
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| chipset            =
 
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| core name           = Cortex-A53
 
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| core name 2         = Cortex-A72
 
−
| core family        =
 
−
| core model          =
 
−
| core stepping      =
 
−
| process             = 20 nm
 
−
| transistors        =
 
−
| technology         = CMOS
 
−
| die area            = <!-- XX mm² -->
 
−
| die width          =
 
−
| die length          =
 
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| word size           = 64 bit
 
−
| core count         = 10
 
−
| thread count       = 10
 
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| max cpus           = 1
 
−
| max memory          =
 
−
 
 
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| electrical          =
 
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| power              =
 
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| v core              =
 
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| v core tolerance    =
 
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| v io                =
 
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| v io 2              =
 
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| v io 3              =
 
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| sdp                =
 
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| tdp                =
 
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| tdp typical        =
 
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| ctdp down          =
 
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| ctdp down frequency =
 
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| ctdp up            =
 
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| ctdp up frequency  =
 
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| temp min            =
 
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| temp max            =
 
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| tjunc min          =
 
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| tjunc max          =
 
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| tcase min          =
 
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| tcase max          =
 
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| tstorage min        = <!-- °C -->
 
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| tstorage max        =
 
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| tambient min        =
 
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| tambient max        =
 
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| packaging          =
 
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| package 0          =
 
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| package 0 type      =
 
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| package 0 pins      =
 
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| package 0 pitch    =
 
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| package 0 width    =
 
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| package 0 length    =
 
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| package 0 height    =
 
 
}}
 
}}
−
'''Helio X27''' ('''MT6797X''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports dual-channel LPDDR3-933. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
+
'''Helio X27''' ('''MT6797X''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
 
The Helio X27 is identical to {{\\|Helio X20}} with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
 
The Helio X27 is identical to {{\\|Helio X20}} with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
−
|type=LPDDR3-933
+
|type=LPDDR3-1600
 
|ecc=No
 
|ecc=No
 
|max mem=4 GiB
 
|max mem=4 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
−
|max bandwidth=13.9 GiB/s
+
|max bandwidth=11.92 GiB/s
−
|bandwidth schan=6.95 GiB/s
+
|bandwidth schan=5.96 GiB/s
−
|bandwidth dchan=13.9 GiB/s
+
|bandwidth dchan=11.92 GiB/s
 
}}
 
}}
  
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| max displays        =  
 
| max displays        =  
 
| max memory          =  
 
| max memory          =  
−
| frequency          = 780 MHz
+
| frequency          = 875 MHz
  
 
| output dsi          = Yes
 
| output dsi          = Yes
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== Utilizing devices ==
 
== Utilizing devices ==
 +
* [[used by::Chuwi Hi9 Plus]]
 
* [[used by::Doogee F7]]
 
* [[used by::Doogee F7]]
 
* [[used by::Doogee F7 Pro]]
 
* [[used by::Doogee F7 Pro]]
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* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 Pro X620]]
 
* [[used by::LeEco Le 2 X620]]
 
* [[used by::LeEco Le 2 X620]]
 +
* [[used by::LeEco Le Pro 3 AI Edition X650]]
 
* [[used by::Meizu MX6]]
 
* [[used by::Meizu MX6]]
 +
* [[used by::Planet Computers Gemini]]
 
* [[used by::Vernee Apollo Lite]]
 
* [[used by::Vernee Apollo Lite]]
−
* [[used by::Xiaomi Redmi Note 4]]
+
* [[used by::UMIDIGI Z PRO]]
 +
* [[used by::Ulefone Gemini Pro]]
 +
* [[used by::Voyo i8]]

Latest revision as of 07:55, 12 October 2023

Edit Values
MediaTek Helio X27
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X27
Part NumberMT6797X,
MTK6797X
MarketMobile, Embedded
IntroductionDecember 2, 2016 (announced)
December 2, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,600 MHz, 2,000 MHz, 1,600 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A72
Core NameCortex-A53, Cortex-A72
Process20 nm
TechnologyCMOS
Word Size64 bit
Cores10
Threads10
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X27 (MT6797X) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.6 GHz, 2 GHz, and 2.6 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X27 is identical to Helio X20 with higher CPU clocks speed and higher GPU clock speed. Additionally this model also supports for dual-camera setup and MiraVision's EnergySmart Screen technology.

Architecture[edit]

The Helio X27 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1600
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Max Bandwidth11.92 GiB/s
12,206.08 MiB/s
12.799 GB/s
12,799.003 MB/s
0.0116 TiB/s
0.0128 TB/s
Bandwidth
Single 5.96 GiB/s
Double 11.92 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T880
DesignerARM Holdings
Execution Units4
Frequency875 MHz
0.875 GHz
875,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image[edit]

  • Integrated image signal processor supports 32 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Chuwi Hi9 Plus
  • Doogee F7
  • Doogee F7 Pro
  • Elephone R9
  • Elephone S7
  • HomTom HT10
  • LeEco Le 2 Pro X620
  • LeEco Le 2 X620
  • LeEco Le Pro 3 AI Edition X650
  • Meizu MX6
  • Planet Computers Gemini
  • Vernee Apollo Lite
  • UMIDIGI Z PRO
  • Ulefone Gemini Pro
  • Voyo i8
Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6797x&oldid=101942"
Facts about "Helio X27 (MT6797X) - MediaTek"
RDF feed
base frequency2,600 MHz (2.6 GHz, 2,600,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,600 MHz (1.6 GHz, 1,600,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedDecember 2, 2016 +
first launchedDecember 2, 2016 +
full page namemediatek/helio/mt6797x +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has featureDual-Camera Setup +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency875 MHz (0.875 GHz, 875,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateDecember 2, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory bandwidth11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X27 +
nameMediaTek Helio X27 +
part numberMT6797X + and MTK6797X +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byChuwi Hi9 Plus +, Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, LeEco Le Pro 3 AI Edition X650 +, Meizu MX6 +, Planet Computers Gemini +, Vernee Apollo Lite +, UMIDIGI Z PRO +, Ulefone Gemini Pro + and Voyo i8 +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +