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Difference between revisions of "mediatek/helio/mt6795"
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(Add Creo Mark 1 and AMOI L861)
 
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{{mediatek title|Helio X10 (MT6795)}}
 
{{mediatek title|Helio X10 (MT6795)}}
−
{{mpu
+
{{chip
−
| name               = MediaTek Helio X10
+
|name=MediaTek Helio X10
−
| no image           = yes
+
|no image=Yes
−
| image              =
+
|designer=MediaTek
−
| image size          =
+
|designer 2=ARM Holdings
−
| caption            =  
+
|manufacturer=TSMC
−
| designer           = MediaTek
+
|model number=Helio X10
−
| designer 2         = ARM Holdings
+
|part number=MT6795
−
| manufacturer       = TSMC
+
|part number 2=MTK6795
−
| model number       = Helio X10
+
|market=Mobile
−
| part number         = MT6795
+
|market 2=Embedded
−
| market             = Mobile
+
|first announced=July 15, 2014
−
| market 2           = Embedded
+
|first launched=March 27, 2015
−
| first announced     = July 15, 2014
+
|family=Helio
−
| first launched     = March 27, 2015
+
|series=Helio X
−
| last order          =
+
|frequency=2,000 MHz
−
| last shipment      =
+
|bus type=AMBA 4 AXI
−
| release price      =
+
|isa=ARMv8
−
 
+
|isa family=ARM
−
| family             = Helio
+
|microarch=Cortex-A53
−
| series             = Helio X
+
|core name=Cortex-A53
−
| locked              =
+
|process=28 nm
−
| frequency           = 2,000 MHz
+
|technology=CMOS
−
| bus type           = AMBA 4 AXI
+
|word size=64 bit
−
| bus speed          =
+
|core count=8
−
| bus rate            =
+
|thread count=8
−
| bus links          =  
+
|max cpus=1
−
| clock multiplier    =
+
|max memory=4 GiB
−
 
+
|v core=1 V
−
| isa family         = ARM
+
|v io=1.8 V
−
| isa                = ARMv8
+
|v io 2=2.8 V
−
| microarch           = Cortex-A53
+
|v io 3=3.3 V
−
| platform            =
+
|temp min=-20 °C
−
| chipset            =
+
|temp max=80 °C
−
| core name           = Cortex-A53
+
|tjunc max=125 °C
−
| core family        =
+
|tstorage min=0 °C
−
| core model          =
+
|tstorage max=125 °C
−
| core stepping      =
+
|packaging=Yes
−
| process             = 28 nm
+
|package 0=MWPOP-1108
−
| transistors        =
+
|package 0 type=MWPOP
−
| technology         = CMOS
+
|package 0 pins=1108
−
| die area            = <!-- XX mm² -->
+
|package 0 pitch=0.4 mm
−
| die width          =
+
|package 0 width=14 mm
−
| die length          =
+
|package 0 length=14 mm
−
| word size           = 64 bit
+
|package 0 height=0.78 mm
−
| core count         = 8
 
−
| thread count       = 8
 
−
| max cpus           = 1
 
−
| max memory         = 4 GiB
 
−
 
 
−
| electrical          = Yes
 
−
| power              =
 
−
| v core             = 1 V
 
−
| v core tolerance    =
 
−
| v io               = 1.8 V
 
−
| v io 2             = 2.8 V
 
−
| v io 3             = 3.3 V
 
−
| sdp                =
 
−
| tdp                =
 
−
| tdp typical        =
 
−
| ctdp down          =
 
−
| ctdp down frequency =
 
−
| ctdp up            =
 
−
| ctdp up frequency  =
 
−
| temp min           = -20 °C
 
−
| temp max           = 80 °C
 
−
| tjunc min          =
 
−
| tjunc max           = 125 °C  
 
−
| tcase min          =
 
−
| tcase max          =
 
−
| tstorage min       = 0 °C
 
−
| tstorage max       = 125 °C
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
 
−
| packaging           = Yes
 
−
| package 0           = MWPOP-1108
 
−
| package 0 type     = MWPOP
 
−
| package 0 pins     = 1108
 
−
| package 0 pitch     = 0.4 mm
 
−
| package 0 width     = 14 mm
 
−
| package 0 length   = 14 mm
 
−
| package 0 height   = 0.78 mm
 
 
}}
 
}}
−
'''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2014]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.
+
'''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2015]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.
  
 
This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem.
 
This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
−
|type=DDR3-933
+
|type=LPDDR3-1866
 
|ecc=No
 
|ecc=No
 
|max mem=4 GiB
 
|max mem=4 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
−
|max bandwidth=13.9 GiB/s
+
|width=32 bit
 +
|max bandwidth=13.91 GiB/s
 
|bandwidth schan=6.95 GiB/s
 
|bandwidth schan=6.95 GiB/s
−
|bandwidth dchan=13.9 GiB/s
+
|bandwidth dchan=13.91 GiB/s
 
}}
 
}}
  
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| opencl ver          = 1.2
 
| opencl ver          = 1.2
 
| opengl ver          = 3.2
 
| opengl ver          = 3.2
−
| opencl es ver      = 3.1
+
| opengl es ver      = 3.1
 
| vulkan ver          = 1.0
 
| vulkan ver          = 1.0
 
}}
 
}}
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== Utilizing devices ==
 
== Utilizing devices ==
−
* [[used by::Meizu MX5]]
+
* [[used by::Meizu Blue Charm Metal]]
 +
* [[used by::Meizu MX5E]]
 +
* [[used by::HTC Desire 830]]
 +
* [[used by::HTC One S9]]
 +
* [[used by::HTC One ME]]
 +
* [[used by::Sony Xperia M5]]
 
* [[used by::Gionee Elife E8]]
 
* [[used by::Gionee Elife E8]]
−
 
+
* [[used by::Allview X2 Xtreme]]
 +
* [[used by::BLU Pure XL]]
 +
* [[used by::Elephone Vowney]]
 +
* [[used by::LeEco Le1 X600]]
 +
* [[used by::LeEco Le 1s]]
 +
* [[used by::PPTV King 7]]
 +
* [[used by::Xiaomi Redmi Note 2]]
 +
* [[used by::LG G3]] (Silk White, 16GB)
 +
* [[used by::Xiaomi Redmi Note 3]]
 +
* [[used by::Canvas 6 pro]]
 +
* [[used by::Meitu V4]]
 +
* [[used by::Meitu V4S]]
 +
* [[used by::Lumigon T3]]
 +
* [[used by::Infinix 552]]
 +
* [[used by::Creo Mark 1]]
 +
* [[used by::AMOI L861]] (Stonex One, Santin Dante)
 
{{expand list}}
 
{{expand list}}

Latest revision as of 13:35, 5 August 2020

Edit Values
MediaTek Helio X10
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X10
Part NumberMT6795,
MTK6795
MarketMobile, Embedded
IntroductionJuly 15, 2014 (announced)
March 27, 2015 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,000 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53
Core NameCortex-A53
Process28 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore1 V
VI/O1.8 V, 2.8 V, 3.3 V
OP Temperature-20 °C – 80 °C
Tjunction – 125 °C
Tstorage0 °C – 125 °C

Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.

This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.

Cache[edit]

Main article: Cortex-A53 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB2-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB4-way set associative 
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  2x1 MiB16-way set associative 

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth13.91 GiB/s
14,243.84 MiB/s
14.936 GB/s
14,935.749 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR G6200
DesignerImagination Technologies
Max Displays2
Frequency700 MHz
0.7 GHz
700,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D10.0
OpenGL3.2
OpenCL1.2
OpenGL ES3.1
Vulkan1.0
  • OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
  • OpenVG 1.1 vector graphics accelerator

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
4G
LTE Advanced
E-UTRANYes
UE Cat4

Image[edit]

  • Integrated image signal processor supports 20 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • HEVC decoder 4k2k @ 30fps
  • H.264 decoder (30fps/40Mbps)
  • Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
  • MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
  • DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
  • VP8 / VC-1 decoders
  • MPEG-4 / H.263 / H.264 / HEVC encoders

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Meizu Blue Charm Metal
  • Meizu MX5E
  • HTC Desire 830
  • HTC One S9
  • HTC One ME
  • Sony Xperia M5
  • Gionee Elife E8
  • Allview X2 Xtreme
  • BLU Pure XL
  • Elephone Vowney
  • LeEco Le1 X600
  • LeEco Le 1s
  • PPTV King 7
  • Xiaomi Redmi Note 2
  • LG G3 (Silk White, 16GB)
  • Xiaomi Redmi Note 3
  • Canvas 6 pro
  • Meitu V4
  • Meitu V4S
  • Lumigon T3
  • Infinix 552
  • Creo Mark 1
  • AMOI L861 (Stonex One, Santin Dante)

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6795&oldid=97707"
Facts about "Helio X10 (MT6795) - MediaTek"
RDF feed
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) +
bus typeAMBA 4 AXI +
core count8 +
core nameCortex-A53 +
core voltage1 V (10 dV, 100 cV, 1,000 mV) +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJuly 15, 2014 +
first launchedMarch 27, 2015 +
full page namemediatek/helio/mt6795 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR G6200 +
integrated gpu base frequency700 MHz (0.7 GHz, 700,000 KHz) +
integrated gpu designerImagination Technologies +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description16-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldateMarch 27, 2015 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max junction temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
max operating temperature80 °C +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureCortex-A53 +
min operating temperature-20 °C +
min storage temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberHelio X10 +
nameMediaTek Helio X10 +
part numberMT6795 + and MTK6795 +
process28 nm (0.028 μm, 2.8e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1866 +
technologyCMOS +
thread count8 +
used byMeizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Allview X2 Xtreme +, BLU Pure XL +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 +, LG G3 +, Xiaomi Redmi Note 3 +, Canvas 6 pro +, Meitu V4 +, Meitu V4S +, Lumigon T3 +, Infinix 552 +, Creo Mark 1 + and AMOI L861 +
user equipment category4 +
word size64 bit (8 octets, 16 nibbles) +