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Difference between revisions of "mediatek/helio/mt6795"
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{{mediatek title|Helio X10 (MT6795)}} | {{mediatek title|Helio X10 (MT6795)}} | ||
− | {{ | + | {{chip |
− | | name | + | |name=MediaTek Helio X10 |
− | | no image | + | |no image=Yes |
− | + | |designer=MediaTek | |
− | + | |designer 2=ARM Holdings | |
− | + | |manufacturer=TSMC | |
− | | designer | + | |model number=Helio X10 |
− | | designer 2 | + | |part number=MT6795 |
− | | manufacturer | + | |part number 2=MTK6795 |
− | | model number | + | |market=Mobile |
− | | part number | + | |market 2=Embedded |
− | | market | + | |first announced=July 15, 2014 |
− | | market 2 | + | |first launched=March 27, 2015 |
− | | first announced | + | |family=Helio |
− | | first launched | + | |series=Helio X |
− | + | |frequency=2,000 MHz | |
− | + | |bus type=AMBA 4 AXI | |
− | + | |isa=ARMv8 | |
− | + | |isa family=ARM | |
− | | family | + | |microarch=Cortex-A53 |
− | | series | + | |core name=Cortex-A53 |
− | + | |process=28 nm | |
− | | frequency | + | |technology=CMOS |
− | | bus type | + | |word size=64 bit |
− | | | + | |core count=8 |
− | + | |thread count=8 | |
− | + | |max cpus=1 | |
− | + | |max memory=4 GiB | |
− | + | |v core=1 V | |
− | | isa family | + | |v io=1.8 V |
− | + | |v io 2=2.8 V | |
− | | microarch | + | |v io 3=3.3 V |
− | + | |temp min=-20 °C | |
− | + | |temp max=80 °C | |
− | | core name | + | |tjunc max=125 °C |
− | + | |tstorage min=0 °C | |
− | + | |tstorage max=125 °C | |
− | + | |packaging=Yes | |
− | | process | + | |package 0=MWPOP-1108 |
− | + | |package 0 type=MWPOP | |
− | | technology | + | |package 0 pins=1108 |
− | + | |package 0 pitch=0.4 mm | |
− | + | |package 0 width=14 mm | |
− | + | |package 0 length=14 mm | |
− | | word size | + | |package 0 height=0.78 mm |
− | | core count | ||
− | | thread count | ||
− | | max cpus | ||
− | | max memory | ||
− | |||
− | |||
− | |||
− | | v core | ||
− | |||
− | | v io | ||
− | | v io 2 | ||
− | | v io 3 | ||
− | |||
− | |||
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− | |||
− | |||
− | |||
− | |||
− | | temp min | ||
− | | temp max | ||
− | |||
− | | tjunc max | ||
− | |||
− | |||
− | | tstorage min | ||
− | | tstorage max | ||
− | |||
− | |||
− | |||
− | | packaging | ||
− | | package 0 | ||
− | | package 0 type | ||
− | | package 0 pins | ||
− | | package 0 pitch | ||
− | | package 0 width | ||
− | | package 0 length | ||
− | | package 0 height | ||
}} | }} | ||
− | '''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[ | + | '''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2015]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 700 MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4. |
This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem. | This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem. | ||
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== Memory controller == | == Memory controller == | ||
{{memory controller | {{memory controller | ||
− | |type= | + | |type=LPDDR3-1866 |
|ecc=No | |ecc=No | ||
|max mem=4 GiB | |max mem=4 GiB | ||
|controllers=1 | |controllers=1 | ||
|channels=2 | |channels=2 | ||
− | |max bandwidth=13. | + | |width=32 bit |
+ | |max bandwidth=13.91 GiB/s | ||
|bandwidth schan=6.95 GiB/s | |bandwidth schan=6.95 GiB/s | ||
− | |bandwidth dchan=13. | + | |bandwidth dchan=13.91 GiB/s |
}} | }} | ||
Line 141: | Line 104: | ||
| opencl ver = 1.2 | | opencl ver = 1.2 | ||
| opengl ver = 3.2 | | opengl ver = 3.2 | ||
− | | | + | | opengl es ver = 3.1 |
| vulkan ver = 1.0 | | vulkan ver = 1.0 | ||
}} | }} | ||
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== Utilizing devices == | == Utilizing devices == | ||
− | * [[used by::Meizu | + | * [[used by::Meizu Blue Charm Metal]] |
+ | * [[used by::Meizu MX5E]] | ||
+ | * [[used by::HTC Desire 830]] | ||
+ | * [[used by::HTC One S9]] | ||
+ | * [[used by::HTC One ME]] | ||
+ | * [[used by::Sony Xperia M5]] | ||
* [[used by::Gionee Elife E8]] | * [[used by::Gionee Elife E8]] | ||
− | + | * [[used by::Allview X2 Xtreme]] | |
+ | * [[used by::BLU Pure XL]] | ||
+ | * [[used by::Elephone Vowney]] | ||
+ | * [[used by::LeEco Le1 X600]] | ||
+ | * [[used by::LeEco Le 1s]] | ||
+ | * [[used by::PPTV King 7]] | ||
+ | * [[used by::Xiaomi Redmi Note 2]] | ||
+ | * [[used by::LG G3]] (Silk White, 16GB) | ||
+ | * [[used by::Xiaomi Redmi Note 3]] | ||
+ | * [[used by::Canvas 6 pro]] | ||
+ | * [[used by::Meitu V4]] | ||
+ | * [[used by::Meitu V4S]] | ||
+ | * [[used by::Lumigon T3]] | ||
+ | * [[used by::Infinix 552]] | ||
+ | * [[used by::Creo Mark 1]] | ||
+ | * [[used by::AMOI L861]] (Stonex One, Santin Dante) | ||
{{expand list}} | {{expand list}} |
Latest revision as of 14:35, 5 August 2020
Edit Values | |
MediaTek Helio X10 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X10 |
Part Number | MT6795, MTK6795 |
Market | Mobile, Embedded |
Introduction | July 15, 2014 (announced) March 27, 2015 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,000 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53 |
Core Name | Cortex-A53 |
Process | 28 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 8 |
Threads | 8 |
Max Memory | 4 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
Vcore | 1 V |
VI/O | 1.8 V, 2.8 V, 3.3 V |
OP Temperature | -20 °C – 80 °C |
Tjunction | – 125 °C |
Tstorage | 0 °C – 125 °C |
Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.
This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.
Contents
Cache[edit]
- Main article: Cortex-A53 § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
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Integrated Memory Controller
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Expansions[edit]
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Expansion Options
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Graphics[edit]
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Integrated Graphics Information
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- OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
- OpenVG 1.1 vector graphics accelerator
Wireless[edit]
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Cellular | |||||||||||||
2G |
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3G |
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4G |
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Image[edit]
- Integrated image signal processor supports 20 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video[edit]
- HEVC decoder 4k2k @ 30fps
- H.264 decoder (30fps/40Mbps)
- Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
- MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
- DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
- VP8 / VC-1 decoders
- MPEG-4 / H.263 / H.264 / HEVC encoders
Audio[edit]
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Meizu Blue Charm Metal
- Meizu MX5E
- HTC Desire 830
- HTC One S9
- HTC One ME
- Sony Xperia M5
- Gionee Elife E8
- Allview X2 Xtreme
- BLU Pure XL
- Elephone Vowney
- LeEco Le1 X600
- LeEco Le 1s
- PPTV King 7
- Xiaomi Redmi Note 2
- LG G3 (Silk White, 16GB)
- Xiaomi Redmi Note 3
- Canvas 6 pro
- Meitu V4
- Meitu V4S
- Lumigon T3
- Infinix 552
- Creo Mark 1
- AMOI L861 (Stonex One, Santin Dante)
This list is incomplete; you can help by expanding it.
Facts about "Helio X10 (MT6795) - MediaTek"
base frequency | 2,000 MHz (2 GHz, 2,000,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 8 + |
core name | Cortex-A53 + |
core voltage | 1 V (10 dV, 100 cV, 1,000 mV) + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | July 15, 2014 + |
first launched | March 27, 2015 + |
full page name | mediatek/helio/mt6795 + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | PowerVR G6200 + |
integrated gpu base frequency | 700 MHz (0.7 GHz, 700,000 KHz) + |
integrated gpu designer | Imagination Technologies + |
io voltage | 1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 2-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
ldate | March 27, 2015 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max junction temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory bandwidth | 13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) + |
max memory channels | 2 + |
max operating temperature | 80 °C + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Cortex-A53 + |
min operating temperature | -20 °C + |
min storage temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | Helio X10 + |
name | MediaTek Helio X10 + |
part number | MT6795 + and MTK6795 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1866 + |
technology | CMOS + |
thread count | 8 + |
used by | Meizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Allview X2 Xtreme +, BLU Pure XL +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 +, LG G3 +, Xiaomi Redmi Note 3 +, Canvas 6 pro +, Meitu V4 +, Meitu V4S +, Lumigon T3 +, Infinix 552 +, Creo Mark 1 + and AMOI L861 + |
user equipment category | 4 + |
word size | 64 bit (8 octets, 16 nibbles) + |