Revision as of 19:59, 23 September 2020

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Snapdragon 845
Chip package, front
General Info
Designer	Qualcomm, ARM Holdings
Manufacturer	Samsung
Model Number	SDM845
Part Number	SDM845
Introduction	December 6, 2017 (announced) February, 2018 (launched)
General Specs
Family	Snapdragon 800
Series	800
Frequency	2,800 MHz, 1,700 MHz
Microarchitecture
ISA	ARMv8.2 (ARM)
Microarchitecture	Cortex-A75, Cortex-A55
Core Name	Kryo 385 Gold, Kryo 385 Silver
Process	10 nm
Transistors	5,300,000,000
Technology	CMOS
Die	95 mm²
Word Size	64 bit
Cores	8
Threads	8
Max Memory	8 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Packaging
Succession
Snapdragon 835 Snapdragon 855

Block diagram

Snapdragon 845 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2017. Fabricated on Samsung's 10nm 10LPP, the 845 features four Kryo 385 Silver high-efficiency cores operating at 1.7 GHz along with four high-performance Kryo 385 Gold cores operating at 2.8 GHz. The Snapdragon 845 integrates the Adreno 630 GPU operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

Cache

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache

Quad-core cluster Cortex-A75:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 1 MiB 1,024 KiB 1,048,576 B 9.765625e-4 GiB     4x256 KiB 8-way set associative

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 2-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 4x64 KiB 4-way set associative   L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     4x128 KiB 8-way set associative

• 2 MiB L3

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3833 Supports ECC No Max Mem 8 GiB Frequency 1866 MHz Controllers 1 Channels 4 Width 16 bit Max Bandwidth 29.87 GiB/s 30,586.88 MiB/s 32.073 GB/s 32,072.668 MB/s 0.0292 TiB/s 0.0321 TB/s Bandwidth Single 7.47 GiB/s Double 14.93 GiB/s Quad 29.87 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP.

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Adreno 630 GPU Designer Qualcomm Max Displays 2 Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

• UHD video playback/encoding @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
• Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
• H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C support

Audio

• Qualcomm Aqstic audio codec and speaker amplifier
• Qualcomm aptX audio playback with support for aptX Classic and HD
• Native DSD support, PCM up to 384kHz/32bit

Camera

• Image Signal Processor
  • Qualcomm Spectra 280
  • New architecture for 14-bit image signal processing, with support for up to:
    • Single HFR 16 MPix camera at 60fps ZSL
    • Dual 16 MPix cameras at 30fps ZSL
    • Single 32 MPix camera at 30fps ZSL
  • Can connect up to 7 different cameras (many configurations possible)
    • Multi-frame Noise Reduction (MFNR) with accelerated image stabilization
    • Hybrid Autofocus with support for dual phase detection (2PD) sensors
    • Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
    • Higher quality video capture with Motion Compensated Temporal Filtering (MCTF)
    • 3D structured light active depth sensing, with accelerated face detection/recognition

Connectivity

• X20 LTE Modem
  • Downlink:
    • LTE Cat 18 up to 1.2 Gbps, 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
  • Uplink:
    • LTE Cat 13 up to 150 Mbps, Upload+ (2x20 MHz carrier aggregation, up to 64-QAM)
  • License Assisted Access (LAA)
  • Citizens Broadband Radio Service (CBRS) shared radio spectrum
  • Dual SIM Dual VoLTE (DSDV)
  • All Mode with support for all major cellular modes plus LAA.
    • VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G
    • Voice over Wi-Fi (VoWiFi) with LTE call continuity

• Wi-Fi
  • 802.11ad Multi-gigabit with 60 GHz diversity module
  • 802.11ac 2x2 with MU-MIMO
  • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
  • 11k/r/v: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi

• Bluetooth
  • Bluetooth 5.0
    • Proprietary enhancements
      • Ultra-low power wireless earbuds
      • Direct audio broadcast to multiple devices

Location

• Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
• Low Power Geofencing and Tracking, Sensor-assisted Navigation

Utilizing devices

• Asus Zenfone 5Z
• Google Pixel 3
• Google Pixel 3 XL
• HTC U12+
• LG G7 ThinQ
• LG V35 ThinQ
• LG V40 ThinQ
• Nokia 9 PureView
• OnePlus 6
• OnePlus 6T
• Oppo Find X
• PocoPhone F1
• Razer Phone 2
• Samsung Galaxy Note9
• Samsung Galaxy S9
• Samsung Galaxy S9+
• Sony Xperia XZ2
• Sony Xperia XZ2 compact
• Sony Xperia XZ3
• Xiaomi Mi Mix 3
• Xiaomi Mi 8
• ZTE Axon 9 Pro

This list is incomplete; you can help by expanding it.

Die

• Samsung 10nm 10LPP
• 95 mm²

Die photo by TechInsights

Documents

• SDM845 Product Brief
• SDM 845 connectivity presentation
• Architecture deep dive
• Mobile security experiences with Snapdragon 845