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|manufacturer=TSMC
 
|model number=1000L
 
|model number=1000L
 
|part number=MT6885Z
 
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|contemporary link=mediatek/dimensity/1000
 
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'''Dimensity 1000L''' is a high-performance mobile [[5G]] [[ARM]] [[SoC]] designed by MediaTek serving as the company's 2020 flagship processor. The Dimensity 1000 is fabricated on [[TSMC]] [[N7|7 nm process]] and integrates four high-performance {{armh|Cortex-A77|l=arch}} [[big cores]] operating at 2.6 GHz along with four low-power {{armh|Cortex-A55|l=arch}} [[little cores]] operating at 2.0 GHz. This chip features a [[Mali-G77]] MP9 GPU operating at ? MHz and supports up to ?? GiB of quad-channel LPDDR4X-????.
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'''Dimensity 1000L''' is a high-performance mobile [[5G]] [[ARM]] [[SoC]] designed by MediaTek serving as the company's 2020 flagship processor. The Dimensity 1000 is fabricated on [[TSMC]] [[N7|7 nm process]] and integrates four high-performance {{armh|Cortex-A77|l=arch}} [[big cores]] operating at 2.2 GHz along with four low-power {{armh|Cortex-A55|l=arch}} [[little cores]] operating at 2 GHz. This chip features a [[Mali-G77]] MP9 GPU operating at ? MHz and supports up to ?? GiB of quad-channel LPDDR4X-????.
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This chip is a lower-performance version of the Dimensity {{\\|1000}}.
  
  
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|bandwidth qchan=29.87 GiB/s
 
|bandwidth qchan=29.87 GiB/s
 
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== Neural processor ==
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The Dimensity 1000L integrates MediaTek's AI Processing Unit (APU) 3.0 with six cores (2 big, 3 small, and 1 tiny).
  
 
== Graphics ==
 
== Graphics ==
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== Utilizing devices ==
 
== Utilizing devices ==
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* [[used by::Oppo Reno3]]
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Latest revision as of 23:21, 31 May 2020

Edit Values
Dimensity 1000L
dimensity1000.png
General Info
DesignerMediaTek
ManufacturerTSMC
Model Number1000L
Part NumberMT6885Z
MarketMobile
IntroductionNovember 26, 2019 (announced)
2020 (launched)
General Specs
FamilyDimensity
Frequency2,200 MHz, 2,000 MHz
Microarchitecture
ISAARMv8.2-A (ARM)
MicroarchitectureCortex-A77, Cortex-A55
Core NameCortex-A77, Cortex-A55
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Multiprocessing
Max SMP1-Way (Uniprocessor)
Contemporary
Dimensity 1000

Dimensity 1000L is a high-performance mobile 5G ARM SoC designed by MediaTek serving as the company's 2020 flagship processor. The Dimensity 1000 is fabricated on TSMC 7 nm process and integrates four high-performance Cortex-A77 big cores operating at 2.2 GHz along with four low-power Cortex-A55 little cores operating at 2 GHz. This chip features a Mali-G77 MP9 GPU operating at ? MHz and supports up to ?? GiB of quad-channel LPDDR4X-????.

This chip is a lower-performance version of the Dimensity 1000.


DIL16 Blank.svg Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.


Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3733
Supports ECCNo
Max Mem16 GiB
Frequency1866 MHz
Controllers1
Channels4
Width16 bit
Max Bandwidth29.87 GiB/s
30,586.88 MiB/s
32.073 GB/s
32,072.668 MB/s
0.0292 TiB/s
0.0321 TB/s
Bandwidth
Single 7.47 GB/s
Double 14.93 GiB/s
Quad 29.87 GiB/s

Neural processor[edit]

The Dimensity 1000L integrates MediaTek's AI Processing Unit (APU) 3.0 with six cores (2 big, 3 small, and 1 tiny).

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-G77
DesignerArm Holdings
Execution Units9Max Displays2
Burst Frequency? MHz
"? MHz" is not a number.
Max Resolution
 2520 x 1080
Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.1
Codec H.264 H.265/HEVC VP-9 AV
Encode ✔ ✔ ✘ ✘
Decode ✔ ✔ ✔ ✔

Camera[edit]

  • ISP
    • Single: 80MP
    • Double: 32+16MP
  • Max Capture
    • 3840 x 2160
  • Features
    • HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD

Connectivity[edit]

  • Cellular
    • DL = 4600 Mbps
      • 200MHz 2CA, 256-QAM, 4x4 MIMO
    • UL = 2500 Mbps
      • 200MHz 2CA, 256-QAM, 2x2 MIMO
    • 2G / 3G
    • 4G Carrier Aggregation (CA), FDD / TDD
    • 5G NR Sub-6 GHz, 5G NR mmWave, LTE
    • CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA
    • SA & NSA modes
  • Wi-Fi
    • Wi-Fi 6 (a/b/g/n/ac/ax)
  • Bluetooth
    • Bluetooth 5.1

Utilizing devices[edit]

  • Oppo Reno3

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/dimensity/1000l&oldid=97187"
Facts about "Dimensity 1000L - MediaTek"
RDF feed
base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 2,000 MHz (2 GHz, 2,000,000 kHz) +
core count8 +
core nameCortex-A77 + and Cortex-A55 +
designerMediaTek +
familyDimensity +
first announcedNovember 26, 2019 +
first launched2020 +
full page namemediatek/dimensity/1000l +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuMali-G77 +
integrated gpu designerArm Holdings +
integrated gpu execution units9 +
isaARMv8.2-A +
isa familyARM +
ldate3000 +
main imageFile:dimensity1000.png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory bandwidth29.87 GiB/s (30,586.88 MiB/s, 32.073 GB/s, 32,072.668 MB/s, 0.0292 TiB/s, 0.0321 TB/s) +
max memory channels4 +
microarchitectureCortex-A77 + and Cortex-A55 +
model number1000L +
nameDimensity 1000L +
part numberMT6885Z +
process7 nm (0.007 μm, 7.0e-6 mm) +
smp max ways1 +
supported memory typeLPDDR4X-3733 +
technologyCMOS +
thread count8 +
used byOppo Reno3 +
word size64 bit (8 octets, 16 nibbles) +