Semiconductor & Computer Engineering
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== Die size == | == Die size == | ||
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Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | ||
Revision as of 10:14, 18 May 2020
A die is the actual bare IC chip and is the final product of the fabrication process. It is the individual chip made following the singulation of a wafer. Dies typically undergo packaging before being sold to the customer as a final product.
Contents
Overview
The die is the final product of the fabrication process. A fully processed wafer will under singulation following probing. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo encapsulation, producing the final chip that ships to customers.
Known good die
- Main article: Known Good Die (KGD)
A known good die is a special type of bare die that underwent additional testing and screening post-singulation. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in multi-chip packages where multiple dies in a single package must function correctly to produce the required product.
Die size
- Main article: die size
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single wafer, the die size is a strong indicator of cost.
| Select Large Dies | |||
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| GPU | Server | Desktop | Mobile |
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