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{{intel title|Xeon Platinum 8176F}} | {{intel title|Xeon Platinum 8176F}} | ||
− | {{ | + | {{chip |
|name=Xeon Platinum 8176F | |name=Xeon Platinum 8176F | ||
|image=skylake-sp (hfi).png | |image=skylake-sp (hfi).png | ||
Line 6: | Line 6: | ||
|manufacturer=Intel | |manufacturer=Intel | ||
|model number=8176F | |model number=8176F | ||
+ | |s-spec qs=QNC8 | ||
|market=Server | |market=Server | ||
|first announced=July 11, 2017 | |first announced=July 11, 2017 | ||
Line 21: | Line 22: | ||
|core name=Skylake SP | |core name=Skylake SP | ||
|core family=6 | |core family=6 | ||
+ | |core stepping=H0 | ||
|process=14 nm | |process=14 nm | ||
|technology=CMOS | |technology=CMOS | ||
Line 26: | Line 28: | ||
|core count=28 | |core count=28 | ||
|thread count=56 | |thread count=56 | ||
+ | |max memory=768 GiB | ||
|max cpus=8 | |max cpus=8 | ||
− | | | + | |smp interconnect=UPI |
+ | |smp interconnect links=3 | ||
+ | |smp interconnect rate=10.4 GT/s | ||
|tdp=173 W | |tdp=173 W | ||
|tcase min=0 °C | |tcase min=0 °C | ||
|tcase max=87 °C | |tcase max=87 °C | ||
|dts min=0 °C | |dts min=0 °C | ||
− | |package | + | |package name 1=intel,fclga_3647 |
}} | }} | ||
'''Xeon Platinum 8176F''' is a {{arch|64}} [[28-core]] [[x86]] multi-socket highest performance server microprocessor introduced by [[Intel]] in mid-2017. This chip supports up to 8-way multiprocessing. The Platinum 8176F, which is based on the server configuration of the {{intel|Skylake (server)|Skylake|l=arch}} microarchitecture and is manufactured on a [[14 nm process|14 nm+ process]], sports 2 {{x86|AVX-512}} [[FMA]] units as well as three {{intel|Ultra Path Interconnect}} links. This microprocessor, which operates at 2.1 GHz with a TDP of 173 W and a {{intel|turbo boost}} frequency of up to 3.8 GHz, supports up 768 GiB of hexa-channel DDR4-2666 ECC memory. | '''Xeon Platinum 8176F''' is a {{arch|64}} [[28-core]] [[x86]] multi-socket highest performance server microprocessor introduced by [[Intel]] in mid-2017. This chip supports up to 8-way multiprocessing. The Platinum 8176F, which is based on the server configuration of the {{intel|Skylake (server)|Skylake|l=arch}} microarchitecture and is manufactured on a [[14 nm process|14 nm+ process]], sports 2 {{x86|AVX-512}} [[FMA]] units as well as three {{intel|Ultra Path Interconnect}} links. This microprocessor, which operates at 2.1 GHz with a TDP of 173 W and a {{intel|turbo boost}} frequency of up to 3.8 GHz, supports up 768 GiB of hexa-channel DDR4-2666 ECC memory. |
Latest revision as of 01:38, 29 December 2019
Edit Values | |
Xeon Platinum 8176F | |
General Info | |
Designer | Intel |
Manufacturer | Intel |
Model Number | 8176F |
S-Spec | QNC8 (QS) |
Market | Server |
Introduction | July 11, 2017 (announced) July 11, 2017 (launched) |
Shop | Amazon |
General Specs | |
Family | Xeon Platinum |
Series | 8000 |
Frequency | 2,100 MHz |
Turbo Frequency | 3,800 MHz (1 core) |
Clock multiplier | 21 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Skylake (server) |
Platform | Purley |
Chipset | Lewisburg |
Core Name | Skylake SP |
Core Family | 6 |
Core Stepping | H0 |
Process | 14 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 28 |
Threads | 56 |
Max Memory | 768 GiB |
Multiprocessing | |
Max SMP | 8-Way (Multiprocessor) |
Interconnect | UPI |
Interconnect Links | 3 |
Interconnect Rate | 10.4 GT/s |
Electrical | |
TDP | 173 W |
Tcase | 0 °C – 87 °C |
TDTS | 0 °C – |
Packaging | |
Package | FCLGA-3647 (FCLGA) |
Dimension | 76.16 mm × 56.6 mm |
Pitch | 0.8585 mm × 0.9906 mm |
Contacts | 3647 |
Socket | Socket P, LGA-3647 |
Xeon Platinum 8176F is a 64-bit 28-core x86 multi-socket highest performance server microprocessor introduced by Intel in mid-2017. This chip supports up to 8-way multiprocessing. The Platinum 8176F, which is based on the server configuration of the Skylake microarchitecture and is manufactured on a 14 nm+ process, sports 2 AVX-512 FMA units as well as three Ultra Path Interconnect links. This microprocessor, which operates at 2.1 GHz with a TDP of 173 W and a turbo boost frequency of up to 3.8 GHz, supports up 768 GiB of hexa-channel DDR4-2666 ECC memory.
This specific model incorporates the Omni-Path Host Fabric Interface (HFI) die in the same package as the processor.
The 173 W of TDP for this microprocessor consists of 165 W for the CPU and 8 W for the fabric.
Cache[edit]
- Main article: Skylake § Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
Integrated Memory Controller
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Expansions[edit]
Expansion Options
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Features[edit]
[Edit/Modify Supported Features]
Supported x86 Extensions & Processor Features
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Frequencies[edit]
- See also: Intel's CPU Frequency Behavior
Mode | Base | Turbo Frequency/Active Cores | |||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 | 22 | 23 | 24 | 25 | 26 | 27 | 28 | ||
Normal | 2,100 MHz | 3,800 MHz | 3,800 MHz | 3,600 MHz | 3,600 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,500 MHz | 3,400 MHz | 3,400 MHz | 3,400 MHz | 3,400 MHz | 3,100 MHz | 3,100 MHz | 3,100 MHz | 3,100 MHz | 2,900 MHz | 2,900 MHz | 2,900 MHz | 2,900 MHz | 2,800 MHz | 2,800 MHz | 2,800 MHz | 2,800 MHz |
AVX2 | 1,700 MHz | 3,600 MHz | 3,600 MHz | 3,400 MHz | 3,400 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 3,300 MHz | 2,900 MHz | 2,900 MHz | 2,900 MHz | 2,900 MHz | 2,700 MHz | 2,700 MHz | 2,700 MHz | 2,700 MHz | 2,500 MHz | 2,500 MHz | 2,500 MHz | 2,500 MHz | 2,400 MHz | 2,400 MHz | 2,400 MHz | 2,400 MHz |
AVX512 | 1,300 MHz | 3,500 MHz | 3,500 MHz | 3,300 MHz | 3,300 MHz | 3,000 MHz | 3,000 MHz | 3,000 MHz | 3,000 MHz | 2,600 MHz | 2,600 MHz | 2,600 MHz | 2,600 MHz | 2,300 MHz | 2,300 MHz | 2,300 MHz | 2,300 MHz | 2,100 MHz | 2,100 MHz | 2,100 MHz | 2,100 MHz | 2,000 MHz | 2,000 MHz | 2,000 MHz | 2,000 MHz | 1,900 MHz | 1,900 MHz | 1,900 MHz | 1,900 MHz |
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Xeon Platinum 8176F - Intel#io + |
base frequency | 2,100 MHz (2.1 GHz, 2,100,000 kHz) + |
chipset | Lewisburg + |
clock multiplier | 21 + |
core count | 28 + |
core family | 6 + |
core name | Skylake SP + |
core stepping | H0 + |
designer | Intel + |
family | Xeon Platinum + |
first announced | July 11, 2017 + |
first launched | July 11, 2017 + |
full page name | intel/xeon platinum/8176f + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has advanced vector extensions 512 | true + |
has ecc memory support | true + |
has extended page tables support | true + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Vector Extensions 512 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables + and Transactional Synchronization Extensions + |
has intel enhanced speedstep technology | true + |
has intel speed shift technology | true + |
has intel trusted execution technology | true + |
has intel turbo boost technology 2 0 | true + |
has intel vpro technology | true + |
has intel vt-d technology | true + |
has intel vt-x technology | true + |
has second level address translation support | true + |
has simultaneous multithreading | true + |
has transactional synchronization extensions | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 1,792 KiB (1,835,008 B, 1.75 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 896 KiB (917,504 B, 0.875 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 896 KiB (917,504 B, 0.875 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 28 MiB (28,672 KiB, 29,360,128 B, 0.0273 GiB) + |
l3$ description | 11-way set associative + |
l3$ size | 38.5 MiB (39,424 KiB, 40,370,176 B, 0.0376 GiB) + |
ldate | July 11, 2017 + |
main image | + |
manufacturer | Intel + |
market segment | Server + |
max case temperature | 360.15 K (87 °C, 188.6 °F, 648.27 °R) + |
max cpu count | 8 + |
max memory | 786,432 MiB (805,306,368 KiB, 824,633,720,832 B, 768 GiB, 0.75 TiB) + |
max memory bandwidth | 119.21 GiB/s (122,071.04 MiB/s, 128.001 GB/s, 128,000.763 MB/s, 0.116 TiB/s, 0.128 TB/s) + |
max memory channels | 6 + |
max pcie lanes | 48 + |
microarchitecture | Skylake (server) + |
min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
min dts temperature | 0 °C + |
model number | 8176F + |
name | Xeon Platinum 8176F + |
package | FCLGA-3647 + |
platform | Purley + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
s-spec (qs) | QNC8 + |
series | 8000 + |
smp interconnect | UPI + |
smp interconnect links | 3 + |
smp interconnect rate | 10.4 GT/s + |
smp max ways | 8 + |
socket | Socket P + and LGA-3647 + |
supported memory type | DDR4-2666 + |
tdp | 173 W (173,000 mW, 0.232 hp, 0.173 kW) + |
technology | CMOS + |
thread count | 56 + |
turbo frequency (1 core) | 3,800 MHz (3.8 GHz, 3,800,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |