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Difference between revisions of "mediatek/helio/mt6797t"
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{{mediatek title|Helio X25 (MT6797T)}}
 
{{mediatek title|Helio X25 (MT6797T)}}
−
{{mpu
+
{{chip
−
| name               = MediaTek Helio X25
+
|name=MediaTek Helio X25
−
| no image           = yes
+
|no image=Yes
−
| image              =
+
|designer=MediaTek
−
| image size          =
+
|designer 2=ARM Holdings
−
| caption            =  
+
|manufacturer=TSMC
−
| designer           = MediaTek
+
|model number=Helio X25
−
| designer 2         = ARM Holdings
+
|part number=MT6797T
−
| manufacturer       = TSMC
+
|part number 2=MTK6797T
−
| model number       = Helio X25
+
|market=Mobile
−
| part number         = MT6797T
+
|market 2=Embedded
−
| part number 2       = MTK6797T
+
|first announced=May 12, 2015
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| market             = Mobile
+
|first launched=March 16, 2016
−
| market 2           = Embedded
+
|family=Helio
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| first announced     = May 12, 2015
+
|series=Helio X
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| first launched     = March 16, 2016
+
|frequency=2,500 MHz
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| last order          =
+
|frequency 2=2,000 MHz
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| last shipment      =
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|frequency 3=1,550 MHz
−
| release price      =
+
|bus type=AMBA 4 AXI
−
 
+
|isa=ARMv8
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| family             = Helio
+
|isa family=ARM
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| series             = Helio X
+
|microarch=Cortex-A53
−
| locked              =
+
|microarch 2=Cortex-A72
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| frequency           = 2,500 MHz
+
|core name=Cortex-A53
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| frequency 2         = 1,850 MHz
+
|core name 2=Cortex-A72
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| frequency 3         = 1,400 MHz
+
|process=20 nm
−
| bus type           = AMBA 4 AXI
+
|technology=CMOS
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| bus speed          =  
+
|word size=64 bit
−
| bus rate            =
+
|core count=10
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| bus links          =
+
|thread count=10
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| clock multiplier    =
+
|max cpus=1
−
 
+
|max memory=6 GiB
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| isa family         = ARM
 
−
| isa                = ARMv8
 
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| microarch           = Cortex-A53
 
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| microarch 2         = Cortex-A72
 
−
| platform            =
 
−
| chipset            =
 
−
| core name           = Cortex-A53
 
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| core name 2         = Cortex-A72
 
−
| core family        =
 
−
| core model          =
 
−
| core stepping      =
 
−
| process             = 20 nm
 
−
| transistors        =
 
−
| technology         = CMOS
 
−
| die area            = <!-- XX mm² -->
 
−
| die width          =
 
−
| die length          =
 
−
| word size           = 64 bit
 
−
| core count         = 10
 
−
| thread count       = 10
 
−
| max cpus           = 1
 
−
| max memory         =
 
−
 
 
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| electrical          =
 
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| power              =
 
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| v core              =
 
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| v core tolerance    =
 
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| v io                =
 
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| v io 2              =
 
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| v io 3              =
 
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| sdp                =
 
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| tdp                =
 
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| tdp typical        =
 
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| ctdp down          =
 
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| ctdp down frequency =
 
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| ctdp up            =
 
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| ctdp up frequency  =
 
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| temp min            =
 
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| temp max            =
 
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| tjunc min          =
 
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| tjunc max          =
 
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| tcase min          =
 
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| tcase max          =
 
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| tstorage min        = <!-- °C -->
 
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| tstorage max        =
 
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| tambient min        =
 
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| tambient max        =
 
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| packaging          =
 
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| package 0          =
 
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| package 0 type      =
 
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| package 0 pins      =
 
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| package 0 pitch    =
 
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| package 0 height    =  
 
 
}}
 
}}
−
'''Helio X25''' ('''MT6797T''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports dual-channel LPDDR3-933. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 850 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
+
'''Helio X25''' ('''MT6797T''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a {{armh|Mali-T880 MP4}} [[IGP]] operating at 850 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
 
The Helio X25 is identical to {{\\|Helio X20}} except for the higher clocked {{armh|Cortex-A72|A72|l=arch}} cores and the higher clocked GPU.
 
The Helio X25 is identical to {{\\|Helio X20}} except for the higher clocked {{armh|Cortex-A72|A72|l=arch}} cores and the higher clocked GPU.
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* Extreme Performance - 2x {{armh|Cortex-A72|l=arch}} @ 2.5 GHz
 
* Extreme Performance - 2x {{armh|Cortex-A72|l=arch}} @ 2.5 GHz
−
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 1.85 GHz
+
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2 GHz
−
* Power Efficiency - 4x {{armh|Cortex-A53|l=arch}} @ 1.4 GHz
+
* Power Efficiency - 4x {{armh|Cortex-A53|l=arch}} @ 1.55 GHz
  
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
−
|type=LPDDR3-933
+
|type=LPDDR3-1600
 
|ecc=No
 
|ecc=No
 
|max mem=4 GiB
 
|max mem=4 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
−
|max bandwidth=13.9 GiB/s
+
|width=32 bit
−
|bandwidth schan=6.95 GiB/s
+
|max bandwidth=12.8 GB/s (11.92 GiB/s)
−
|bandwidth dchan=13.9 GiB/s
+
|bandwidth schan=6.4 GB/s (5.96 GiB/s)
 +
|bandwidth dchan=12.8 GB/s (11.92 GiB/s)
 
}}
 
}}
  
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| max displays        =  
 
| max displays        =  
 
| max memory          =  
 
| max memory          =  
−
| frequency          = 780 MHz
+
| frequency          = 850 MHz
  
 
| output dsi          = Yes
 
| output dsi          = Yes
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== Utilizing devices ==
 
== Utilizing devices ==
−
{{empty section}}
+
* [[used by::Meizu Pro 6]]
−
<!-- * [[used by::xxxxxxxxxxxxxxxxx]] -->
+
* [[used by::Meizu Pro 6S]]
 +
* [[used by::LeEco Le 2 X625]]
 +
* [[used by::Xiaomi Redmi Pro]]
 +
* [[used by::Elephone P11 3D]]
 +
* [[used by::Elephone S7]]
 +
* [[used by::Elephone S8]]
 +
* [[used by::Elephone Soldier]]
 +
* [[used by::BMXC S10]]
 +
* [[used by::Planet Computers Gemini (early versions)]]
 +
* [[used by::Brandt Bprime S]]
 +
{{expand list}}

Latest revision as of 13:25, 12 September 2019

Edit Values
MediaTek Helio X25
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X25
Part NumberMT6797T,
MTK6797T
MarketMobile, Embedded
IntroductionMay 12, 2015 (announced)
March 16, 2016 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,500 MHz, 2,000 MHz, 1,550 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A72
Core NameCortex-A53, Cortex-A72
Process20 nm
TechnologyCMOS
Word Size64 bit
Cores10
Threads10
Max Memory6 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X25 (MT6797T) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a Mali-T880 MP4 IGP operating at 850 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.

The Helio X25 is identical to Helio X20 except for the higher clocked A72 cores and the higher clocked GPU.

Architecture[edit]

The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1600
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth12.8 GB/s (11.92 GiB/s)
"GB/s(11.92GiB/s)" is not declared as a valid unit of measurement for this property.
Bandwidth
Single 6.4 GB/s (5.96 GiB/s)
Double 12.8 GB/s (11.92 GiB/s)

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-T880
DesignerARM Holdings
Execution Units4
Frequency850 MHz
0.85 GHz
850,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D11.2
OpenGL3.2
OpenCL1.2
OpenGL ES3.2
OpenVG1.1
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat6

Image[edit]

  • Integrated image signal processor supports 32 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Meizu Pro 6
  • Meizu Pro 6S
  • LeEco Le 2 X625
  • Xiaomi Redmi Pro
  • Elephone P11 3D
  • Elephone S7
  • Elephone S8
  • Elephone Soldier
  • BMXC S10
  • Planet Computers Gemini (early versions)
  • Brandt Bprime S

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6797t&oldid=93522"
Facts about "Helio X25 (MT6797T) - MediaTek"
RDF feed
base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,550 MHz (1.55 GHz, 1,550,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedMay 12, 2015 +
first launchedMarch 16, 2016 +
full page namemediatek/helio/mt6797t +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency850 MHz (0.85 GHz, 850,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateMarch 16, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X25 +
nameMediaTek Helio X25 +
part numberMT6797T + and MTK6797T +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byMeizu Pro 6 +, Meizu Pro 6S +, LeEco Le 2 X625 +, Xiaomi Redmi Pro +, Elephone P11 3D +, Elephone S7 +, Elephone S8 +, Elephone Soldier +, BMXC S10 +, Planet Computers Gemini (early versions) + and Brandt Bprime S +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +