Semiconductor & Computer Engineering
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Difference between revisions of "qualcomm/snapdragon 800/845"
| Line 142: | Line 142: | ||
**** Ultra-low power wireless earbuds | **** Ultra-low power wireless earbuds | ||
**** Direct audio broadcast to multiple devices | **** Direct audio broadcast to multiple devices | ||
| − | |||
== Location == | == Location == | ||
* Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS | * Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS | ||
* Low Power Geofencing and Tracking, Sensor-assisted Navigation | * Low Power Geofencing and Tracking, Sensor-assisted Navigation | ||
| + | |||
| + | == Documents == | ||
| + | * [[:File:sdm845pb.pdf|SDM845 Product Brief]] | ||
| + | * [[:File:snapdragon-845-connectivity-pillar-presentation-by-peter-carson.pdf|SDM 845 connectivity presentation]] | ||
| + | * [[:File:snapdragon-845-performance-pillar-presentation-by-travis-lanier.pdf|Architecture deep dive]] | ||
| + | * [[:File:snapdragon-845-security-pillar-presentation-by-sy-choudhury.pdf|Mobile security experiences with Snapdragon 845]] | ||
Revision as of 22:03, 16 June 2019
| Edit Values | |
| Snapdragon 845 | |
 | |
| Chip package, front | |
| General Info | |
| Designer | Qualcomm, ARM Holdings |
| Manufacturer | Samsung |
| Model Number | SDM845 |
| Part Number | SDM845 |
| Introduction | December 6, 2017 (announced) Fabruary, 2018 (launched) |
| General Specs | |
| Family | Snapdragon 800 |
| Series | 800 |
| Frequency | 2,800 MHz, 1,7000 MHz |
| Microarchitecture | |
| ISA | ARMv8.2 (ARM) |
| Microarchitecture | Cortex-A75, Cortex-A55 |
| Core Name | Kryo 385 Gold, Kryo 385 Silver |
| Process | 10 nm |
| Transistors | 5,300,000,000 |
| Technology | CMOS |
| Die | 95 mm² |
| Word Size | 64 bit |
| Cores | 8 |
| Threads | 8 |
| Max Memory | 8 GiB |
| Multiprocessing | |
| Max SMP | 1-Way (Uniprocessor) |
| Packaging | |
 | |
| Succession | |
Snapdragon 845 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2017. Fabricated on Samsung's 10nm 10LPP, the 845 features four Kryo 385 Silver high-efficiency cores operating at 1.7 GHz along with four high-performance Kryo 385 Gold cores operating at 2.8 GHz. The Snapdragon 845 integrates the Adreno 630 GPU operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.
Contents
Memory controller
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Integrated Memory Controller
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DSP
This chip features Qualcomm's Hexagon 685 DSP.
Graphics
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Integrated Graphics Information
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- UHD video playback/encoding @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
- Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
- H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C support
Audio
- Qualcomm Aqstic audio codec and speaker amplifier
- Qualcomm aptX audio playback with support for aptX Classic and HD
- Native DSD support, PCM up to 384kHz/32bit
Camera
- Image Signal Processor
- Qualcomm Spectra 280
- New architecture for 14-bit image signal processing, with support for up to:
- Single HFR 16 MPix camera at 60fps ZSL
- Dual 16 MPix cameras at 30fps ZSL
- Single 32 MPix camera at 30fps ZSL
- Can connect up to 7 different cameras (many configurations possible)
- Multi-frame Noise Reduction (MFNR) with accelerated image stabilization
- Hybrid Autofocus with support for dual phase detection (2PD) sensors
- Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
- Higher quality video capture with Motion Compensated Temporal Filtering (MCTF)
- 3D structured light active depth sensing, with accelerated face detection/recognition
Connectivity
- X20 LTE Modem
- Downlink:
- LTE Cat 18 up to 1.2 Gbps, 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
- Uplink:
- LTE Cat 13 up to 150 Mbps, Upload+ (2x20 MHz carrier aggregation, up to 64-QAM)
- License Assisted Access (LAA)
- Citizens Broadband Radio Service (CBRS) shared radio spectrum
- Dual SIM Dual VoLTE (DSDV)
- All Mode with support for all major cellular modes plus LAA.
- VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G
- Voice over Wi-Fi (VoWiFi) with LTE call continuity
- Downlink:
- Wi-Fi
- 802.11ad Multi-gigabit with 60 GHz diversity module
- 802.11ac 2x2 with MU-MIMO
- Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
- 11k/r/v: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi
- Bluetooth
- Bluetooth 5.0
- Proprietary enhancements
- Ultra-low power wireless earbuds
- Direct audio broadcast to multiple devices
- Proprietary enhancements
- Bluetooth 5.0
Location
- Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
- Low Power Geofencing and Tracking, Sensor-assisted Navigation
Documents
Categories:
- all microprocessor models
- microprocessor models by qualcomm
- microprocessor models by qualcomm based on cortex-a75
- microprocessor models by qualcomm based on cortex-a55
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a75
- microprocessor models by arm holdings based on cortex-a55
- microprocessor models by samsung
Facts about "Snapdragon 845 - Qualcomm"
| back image | .png) + |
| base frequency | 2,800 MHz (2.8 GHz, 2,800,000 kHz) + |
| core count | 8 + |
| core name | Kryo 385 Gold + and Kryo 385 Silver + |
| designer | Qualcomm + and ARM Holdings + |
| die area | 95 mm² (0.147 in², 0.95 cm², 95,000,000 µm²) + |
| dsp | Hexagon 685 DSP + |
| family | Snapdragon 800 + |
| first announced | December 6, 2017 + |
| first launched | 2018 + |
| full page name | qualcomm/snapdragon 800/845 + |
| has ecc memory support | false + |
| instance of | microprocessor + |
| integrated gpu | Adreno 630 GPU + |
| integrated gpu designer | Qualcomm + |
| isa | ARMv8.2 + |
| isa family | ARM + |
| ldate | 2018 + |
| main image | .png) + |
| main image caption | Chip package, front + |
| manufacturer | Samsung + |
| max cpu count | 1 + |
| max memory | 8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) + |
| max memory bandwidth | 29.87 GiB/s (30,586.88 MiB/s, 32.073 GB/s, 32,072.668 MB/s, 0.0292 TiB/s, 0.0321 TB/s) + |
| max memory channels | 4 + |
| microarchitecture | Cortex-A75 + and Cortex-A55 + |
| model number | SDM845 + |
| name | Snapdragon 845 + |
| part number | SDM845 + |
| process | 10 nm (0.01 μm, 1.0e-5 mm) + |
| series | 800 + |
| smp max ways | 1 + |
| supported memory type | LPDDR4X-3833 + |
| technology | CMOS + |
| thread count | 8 + |
| transistor count | 5,300,000,000 + |
| word size | 64 bit (8 octets, 16 nibbles) + |
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