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Difference between revisions of "intel/microarchitectures/lakefield"
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== Architecture == | == Architecture == | ||
| + | [[File:intel lakefield overview.png|right|thumb|Lakefield Architectre]] | ||
* [[3d integrated circuit]] | * [[3d integrated circuit]] | ||
** {{intel|Foveros}} packaging | ** {{intel|Foveros}} packaging | ||
Revision as of 23:34, 12 May 2019
| Edit Values | |
| Lakefield µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | Intel |
| Manufacturer | Intel |
| Introduction | 2019 |
| Process | 22 nm, 10 nm |
| Core Configs | 5 |
| Pipeline | |
| Type | Superscalar, Superpipeline |
| OoOE | Yes |
| Speculative | Yes |
| Reg Renaming | Yes |
| Instructions | |
| ISA | x86-64 |
| Cache | |
| L2 Cache | 512 KiB + 1.5 MiB |
| L3 Cache | 4 MiB/chip |
Lakefield (LKF) is a high-performance low-power 3D microarchitecture designed by Intel and introduced in 2019.
Architecture
- 3d integrated circuit
- Foveros packaging
- 22 nm base field
- 10 nm compute field
- 1x Sunny Cove big core
- 4x Tremont small cores
- GPU
- Gen11 graphics
- Memory
- LPDDR4X up to 4266 MT/s
- POP DRAM
- Power
- 5 W and 7 W TDPs
Block diagram
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This section is empty; you can help add the missing info by editing this page. |
Overview
| |
This section is empty; you can help add the missing info by editing this page. |
Facts about "Lakefield - Microarchitectures - Intel"
| codename | Lakefield + |
| core count | 5 + |
| designer | Intel + |
| first launched | 2019 + |
| full page name | intel/microarchitectures/lakefield + |
| instance of | microarchitecture + |
| instruction set architecture | x86-64 + |
| manufacturer | Intel + |
| microarchitecture type | CPU + |
| name | Lakefield + |
| process | 22 nm (0.022 μm, 2.2e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) + |