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− | {{mediatek title|Helio X30}} | + | {{mediatek title|Helio X30 (MT6799)}} |
− | {{ | + | {{chip |
− | + | |name=MediaTek Helio X30 | |
− | | name | + | |no image=Yes |
− | | no image | + | |designer=MediaTek |
− | + | |designer 2=ARM Holdings | |
− | + | |manufacturer=TSMC | |
− | + | |model number=Helio X30 | |
− | | designer | + | |part number=MT6799 |
− | | designer 2 | + | |market=Mobile |
− | | manufacturer | + | |market 2=Embedded |
− | | model number | + | |first announced=September 26, 2016 |
− | | part number | + | |first launched=February 27, 2017 |
− | + | |family=Helio | |
− | | market | + | |series=Helio X |
− | | market 2 | + | |frequency=2,500 MHz |
− | | first announced | + | |frequency 2=2,200 MHz |
− | | first launched | + | |frequency 3=1,900 MHz |
− | + | |bus type=AMBA 4 AXI | |
− | + | |isa=ARMv8 | |
− | + | |isa family=ARM | |
− | + | |microarch=Cortex-A53 | |
− | | family | + | |microarch 2=Cortex-A73 |
− | | series | + | |microarch 3=Cortex-A35 |
− | + | |core name=Cortex-A35 | |
− | | frequency | + | |core name 2=Cortex-A53 |
− | | frequency 2 | + | |core name 3=Cortex-A73 |
− | | frequency 3 | + | |process=10 nm |
− | | bus type | + | |technology=CMOS |
− | | | + | |word size=64 bit |
− | + | |core count=10 | |
− | + | |thread count=10 | |
− | + | |max cpus=1 | |
− | + | |max memory=8 GiB | |
− | | isa family | ||
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− | | microarch | ||
− | | microarch 2 | ||
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− | | technology | ||
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− | | word size | ||
− | | core count | ||
− | | thread count | ||
− | | max cpus | ||
− | | max memory | ||
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}} | }} | ||
− | '''Helio X30''' is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and | + | '''Helio X30''' ('''MT6799''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10. |
== Architecture == | == Architecture == | ||
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications. | The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications. | ||
− | * Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2. | + | * Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.5 GHz |
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz | * Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz | ||
− | * Power Efficiency - 4x {{armh|Cortex- | + | * Power Efficiency - 4x {{armh|Cortex-A35|l=arch}} @ 1.9 GHz |
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration. | The three clusters are designed as a modified {{armh|big.LITTLE}} configuration. | ||
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== Memory controller == | == Memory controller == | ||
{{memory controller | {{memory controller | ||
− | |type= | + | |type=LPDDR4X-3732 |
|ecc=No | |ecc=No | ||
|max mem=8 GiB | |max mem=8 GiB | ||
|controllers=1 | |controllers=1 | ||
− | |channels= | + | |channels=4 |
+ | |width=16 bit | ||
|max bandwidth=27.81 GiB/s | |max bandwidth=27.81 GiB/s | ||
− | |bandwidth schan=13.9 GiB/s | + | |bandwidth schan=6.95 GiB/s |
− | |bandwidth | + | |bandwidth dchan=13.9 GiB/s |
+ | |bandwidth qchan=27.81 GiB/s | ||
}} | }} | ||
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== Graphics == | == Graphics == | ||
{{integrated graphics | {{integrated graphics | ||
− | | gpu = PowerVR GT7400 | + | | gpu = PowerVR GT7400 Plus |
| device id = | | device id = | ||
| designer = Imagination Technologies | | designer = Imagination Technologies | ||
Line 134: | Line 80: | ||
| max displays = | | max displays = | ||
| max memory = | | max memory = | ||
− | | frequency = | + | | frequency = 800 MHz |
| output dsi = Yes | | output dsi = Yes | ||
− | | max res dsi = | + | | max res dsi = 3840x2160 |
| direct3d ver = 11.2 | | direct3d ver = 11.2 | ||
− | | opencl ver = | + | | opencl ver = 2.0 |
− | | opengl ver = 3. | + | | opengl ver = 3.3 |
− | | opengl es ver = 3. | + | | opengl es ver = 3.2 |
| vulkan ver = 1.0 | | vulkan ver = 1.0 | ||
}} | }} | ||
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| ue cat = 10 | | ue cat = 10 | ||
}} | }} | ||
+ | |||
+ | == Image == | ||
+ | * Integrated image signal processor supports 28 MP | ||
+ | * Supports image stabilization | ||
+ | * Supports video stabilization | ||
+ | * Supports noise reduction | ||
+ | * Supports lens shading correction | ||
+ | * Supports AE/AWB/AF | ||
+ | * Supports edge enhancement | ||
+ | * Supports face detection and visual tracking | ||
+ | * Hardware JPEG encoder | ||
+ | |||
+ | == Video == | ||
+ | * Video encoding 4K2K @ 30fps with H.265 and HDR | ||
+ | * Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9 | ||
+ | |||
+ | == Audio == | ||
+ | * Audio content sampling rates 8kHz to 192kHz | ||
+ | * Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo | ||
+ | * I2S, PCM | ||
+ | * Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM | ||
+ | * Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM | ||
+ | * 7.1 channel MHL output | ||
+ | |||
+ | == Utilizing devices == | ||
+ | * [[used by::Meizu Pro 7]] | ||
+ | * [[used by::Meizu Pro 7 Plus]] | ||
+ | {{expand list}} | ||
+ | |||
+ | == Die == | ||
+ | * [[10 nm process]] | ||
+ | |||
+ | :[[File:x30 die shot.png|500px]] | ||
+ | |||
+ | == Bibliography == | ||
+ | * Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017. |
Latest revision as of 15:22, 29 December 2018
Edit Values | |
MediaTek Helio X30 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X30 |
Part Number | MT6799 |
Market | Mobile, Embedded |
Introduction | September 26, 2016 (announced) February 27, 2017 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,500 MHz, 2,200 MHz, 1,900 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A73, Cortex-A35 |
Core Name | Cortex-A35, Cortex-A53, Cortex-A73 |
Process | 10 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
Max Memory | 8 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.
Contents
Architecture[edit]
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
- Extreme Performance - 2x Cortex-A73 @ 2.5 GHz
- Performance/Power Balance - 4x Cortex-A53 @ 2.2 GHz
- Power Efficiency - 4x Cortex-A35 @ 1.9 GHz
The three clusters are designed as a modified big.LITTLE configuration.
Cache[edit]
- Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
This section is empty; you can help add the missing info by editing this page. |
Memory controller[edit]
Integrated Memory Controller
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Expansions[edit]
Expansion Options
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Graphics[edit]
Integrated Graphics Information
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Wireless[edit]
Wireless Communications | ||||||||||||||||
Wi-Fi | ||||||||||||||||
WiFi |
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Cellular | ||||||||||||||||
2G |
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3G |
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4G |
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Image[edit]
- Integrated image signal processor supports 28 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video[edit]
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
Audio[edit]
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Meizu Pro 7
- Meizu Pro 7 Plus
This list is incomplete; you can help by expanding it.
Die[edit]
Bibliography[edit]
- Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
- all microprocessor models
- microprocessor models by mediatek
- microprocessor models by mediatek based on cortex-a53
- microprocessor models by mediatek based on cortex-a73
- microprocessor models by mediatek based on cortex-a35
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a73
- microprocessor models by arm holdings based on cortex-a35
- microprocessor models by tsmc