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Difference between revisions of "arm holdings/microarchitectures/cortex-a57"
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== Die ==
 
== Die ==
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<table class="wikitable">
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<tr><th colspan="3">Cortex-A57 Clusters Silicon Areas (Estimated)</th></tr>
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<tr><th>Company</th><td>[[Samsung]]</td><td>[[Renesas]]</td></tr>
 +
<tr><th>Chip</th><td>[[Exynos 5433]]</td><td>[[R-Car H3]]</td></tr>
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<tr><th>Process</th><td>[[20 nm]]</td><td>[[16 nm]]</td></tr>
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<tr><th>Configuration</th><td>4x Cortex-A57<br>+ 2 MiB L2</td><td>4x Cortex-A57<br>+ 2 MiB L2</td></tr>
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<tr><th>Cluster Size</th><td>~15.85 mm²</td><td>~10.21 mm² cluster</td></tr>
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<tr><th>Core Size</th><td>~3 mm²</td><td>~1.66 mm² cluster</td></tr>
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<tr><th>Cache Size</th><td>~3.87 mm²</td><td>~3.28 mm² cluster</td></tr>
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</table>
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=== 20 nm ===
 
=== 20 nm ===
 
==== Samsung [[Exynos 5433]] ====
 
==== Samsung [[Exynos 5433]] ====
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** ~3.27 mm² cluster
 
** ~3.27 mm² cluster
 
** ~0.60 mm² core
 
** ~0.60 mm² core
** ~0.7`mm² L2 cache
+
** ~0.7 mm² 512 KiB L2 cache
 
* Quad-core Cortex-A57
 
* Quad-core Cortex-A57
 
** ~10.21 mm² cluster
 
** ~10.21 mm² cluster
 
** ~1.66 mm² core
 
** ~1.66 mm² core
** ~3.28 mm² L2 cache
+
** ~3.28 mm² 2 MiB L2 cache
 
* {{\\|Cortex-R7}} (dual-core [[lock-step]])
 
* {{\\|Cortex-R7}} (dual-core [[lock-step]])
 
** ~1.04 mm² cluster
 
** ~1.04 mm² cluster

Revision as of 14:44, 29 December 2018

Edit Values
Cortex-A57 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerTSMC
IntroductionOct 30, 2012
Succession

Cortex-A57 (codename Atlas) is the successor to the Cortex-A15, a low-power high-performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as a synthesizable IP core and is sold to other semiconductor companies to be implemented in their own chips. The Cortex-A57, which implemented the ARMv8 ISA, is the a performant core which is often combined with a number of lower power cores (e.g. Cortex-A53) in a big.LITTLE configuration to achieve better energy/performance.

Architecture

Key changes from Cortex-A15

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Block Diagram

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Memory Hierarchy

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Die

Cortex-A57 Clusters Silicon Areas (Estimated)
CompanySamsungRenesas
ChipExynos 5433R-Car H3
Process20 nm16 nm
Configuration4x Cortex-A57
+ 2 MiB L2
4x Cortex-A57
+ 2 MiB L2
Cluster Size~15.85 mm²~10.21 mm² cluster
Core Size~3 mm²~1.66 mm² cluster
Cache Size~3.87 mm²~3.28 mm² cluster

20 nm

Samsung Exynos 5433

  • Samsung 20 nm process
  • 113 mm² die size
  • Mali-T760 (6 EU)
  • Quad-core Cortex-A53 (small cores)
    • 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
    • 4.4 mm² per cluster
      • ~1 mm² per core
      • ~0.55 mm² for 256 KiB L2 cache
  • Quad-core Cortex-A57 (big cores)
    • 48KB L1I$ and 32KB L1D$ per core, and a shared 2 MiB L2
    • 15.85 mm² per cluster
      • ~3 mm² per core
      • ~3.87 mm² for 2 MiB L2 cache


exynos 5433 die.png

16 nm

Renesas R-Car H3

  • TSMC 16 nm process
  • 12.94 mm × 8.61 mm
  • 111.36 mm² die size
  • Quad-core Cortex-A53
    • ~3.27 mm² cluster
    • ~0.60 mm² core
    • ~0.7 mm² 512 KiB L2 cache
  • Quad-core Cortex-A57
    • ~10.21 mm² cluster
    • ~1.66 mm² core
    • ~3.28 mm² 2 MiB L2 cache
  • Cortex-R7 (dual-core lock-step)
    • ~1.04 mm² cluster
  • GX6650 GPU
    • ~28.12 mm²


r-car h3 die shot.png

Bibliography

  • Pyo, Jungyul, et al. "23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015
codenameCortex-A57 +
designerARM Holdings +
first launchedOctober 30, 2012 +
full page namearm holdings/microarchitectures/cortex-a57 +
instance ofmicroarchitecture +
manufacturerTSMC +
microarchitecture typeCPU +
nameCortex-A57 +