(1.600.000.000 transfers/second * 4 bytes makes 6.4 GB/s for each channel; (32bit / 8 = 4 bytes); previous values considered an error, unless the previous Bus Width of 32bit per chan is also an error) |
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|channels=2 | |channels=2 | ||
|width=32 bit | |width=32 bit | ||
− | |max bandwidth= | + | |max bandwidth=12.8 GB/s (11.92 GiB/s) |
− | |bandwidth schan= | + | |bandwidth schan=6.4 GB/s (5.96 GiB/s) |
− | |bandwidth dchan= | + | |bandwidth dchan=12.8 GB/s (11.92 GiB/s) |
}} | }} | ||
Revision as of 21:11, 15 November 2018
Edit Values | |
MediaTek Helio X25 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X25 |
Part Number | MT6797T, MTK6797T |
Market | Mobile, Embedded |
Introduction | May 12, 2015 (announced) March 16, 2016 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,500 MHz, 2,000 MHz, 1,550 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A72 |
Core Name | Cortex-A53, Cortex-A72 |
Process | 20 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
Max Memory | 6 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Helio X25 (MT6797T) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a Mali-T880 MP4 IGP operating at 850 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.
The Helio X25 is identical to Helio X20 except for the higher clocked A72 cores and the higher clocked GPU.
Contents
Architecture
The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
- Extreme Performance - 2x Cortex-A72 @ 2.5 GHz
- Performance/Power Balance - 4x Cortex-A53 @ 2 GHz
- Power Efficiency - 4x Cortex-A53 @ 1.55 GHz
The three clusters are designed as a modified big.LITTLE configuration.
Cache
- Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
This section is empty; you can help add the missing info by editing this page. |
Memory controller
Integrated Memory Controller
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Expansions
Expansion Options
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Graphics
Integrated Graphics Information
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Wireless
Wireless Communications | ||||||||||||||||
Wi-Fi | ||||||||||||||||
WiFi |
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Cellular | ||||||||||||||||
2G |
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3G |
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4G |
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Image
- Integrated image signal processor supports 32 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
Audio
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices
- Meizu Pro 6
- Meizu Pro 6S
- LeEco Le 2 X625
- Xiaomi Redmi Pro
- Elephone S7
- Elephone S8
- Elephone Soldier
- BMXC S10
This list is incomplete; you can help by expanding it.
- all microprocessor models
- microprocessor models by mediatek
- microprocessor models by mediatek based on cortex-a53
- microprocessor models by mediatek based on cortex-a72
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a72
- microprocessor models by tsmc
base frequency | 2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,550 MHz (1.55 GHz, 1,550,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 10 + |
core name | Cortex-A53 + and Cortex-A72 + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | May 12, 2015 + |
first launched | March 16, 2016 + |
full page name | mediatek/helio/mt6797t + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has cdma2000 1x support | true + |
has cdma2000 1xev-do support | true + |
has cdma2000 support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | Mali-T880 + |
integrated gpu base frequency | 850 MHz (0.85 GHz, 850,000 KHz) + |
integrated gpu designer | ARM Holdings + |
integrated gpu execution units | 4 + |
isa | ARMv8 + |
isa family | ARM + |
ldate | March 16, 2016 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max memory | 6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) + |
max memory channels | 2 + |
microarchitecture | Cortex-A53 + and Cortex-A72 + |
model number | Helio X25 + |
name | MediaTek Helio X25 + |
part number | MT6797T + and MTK6797T + |
process | 20 nm (0.02 μm, 2.0e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1600 + |
technology | CMOS + |
thread count | 10 + |
used by | Meizu Pro 6 +, Meizu Pro 6S +, LeEco Le 2 X625 +, Xiaomi Redmi Pro +, Elephone P11 3D +, Elephone S7 +, Elephone S8 +, Elephone Soldier +, BMXC S10 +, Planet Computers Gemini (early versions) + and Brandt Bprime S + |
user equipment category | 6 + |
word size | 64 bit (8 octets, 16 nibbles) + |