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Difference between revisions of "hisilicon/kirin/710"
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'''Kirin 710''' is a {{arch|64}} [[octa-core]] mid-range performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-[[2018]]. This chip, which is fabricated on [[TSMC]]'s [[12 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.2 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.7 GHz. The 710 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G51}} (4 core) IGP and supports up to 6 GiB of dual-channel LPDDR4 memory.
 
'''Kirin 710''' is a {{arch|64}} [[octa-core]] mid-range performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-[[2018]]. This chip, which is fabricated on [[TSMC]]'s [[12 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.2 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.7 GHz. The 710 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G51}} (4 core) IGP and supports up to 6 GiB of dual-channel LPDDR4 memory.
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== Memory controller ==
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{{memory controller
 +
|type=LPDDR4
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|ecc=No
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|max mem=6 GiB
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|controllers=1
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|channels=2
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|width=32 bit
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}}
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 +
== Graphics ==
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{{integrated graphics
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| gpu                = Mali-G51
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| designer            = ARM Holdings
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| execution units    = 4
 +
| max displays        = 2
 +
| max memory          =
 +
| frequency          =
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| max frequency      =
 +
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|max res generic      = 2340x1080
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}}
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* Hardware Acceleration
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** Decode: 1080p @ 60fps
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** Encode: 1080p @ 30fps
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== ISP ==
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* 16MP + 24MP
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== Wireless ==
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* WiFi
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** 802.11 a/b/g/n/ac, 2.4/5 GHz
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* Bluetooth 4.2
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* LTE Modem
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** Downlink
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*** Cat-12, 600 Mbps
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** Uplink
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*** Cat-13, 150 Mbps
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== Utilizing devices ==
 +
* [[used by::Huawei nova 3i]]

Revision as of 12:25, 19 July 2018

Edit Values
Kirin 710
General Info
DesignerHiSilicon,
ARM Holdings
ManufacturerTSMC
Model Number710
MarketMobile
IntroductionJuly 18, 2018 (announced)
July 18, 2018 (launched)
General Specs
FamilyKirin
Series700
Frequency2,200 MHz, 1,700 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A73
Core NameCortex-A53, Cortex-A73
Process12 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory6 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Kirin 710 is a 64-bit octa-core mid-range performance mobile ARM LTE SoC introduced by HiSilicon in mid-2018. This chip, which is fabricated on TSMC's 12 nm process, features four Cortex-A73 big cores operating at up to 2.2 GHz along with four Cortex-A53 little cores operating at up to 1.7 GHz. The 710 incorporates ARM's Mali G51 (4 core) IGP and supports up to 6 GiB of dual-channel LPDDR4 memory.

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4
Supports ECCNo
Max Mem6 GiB
Controllers1
Channels2
Width32 bit

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUMali-G51
DesignerARM Holdings
Execution Units4Max Displays2

Max Resolution
 2340x1080
  • Hardware Acceleration
    • Decode: 1080p @ 60fps
    • Encode: 1080p @ 30fps

ISP

  • 16MP + 24MP

Wireless

  • WiFi
    • 802.11 a/b/g/n/ac, 2.4/5 GHz
  • Bluetooth 4.2
  • LTE Modem
    • Downlink
      • Cat-12, 600 Mbps
    • Uplink
      • Cat-13, 150 Mbps

Utilizing devices

  • Huawei nova 3i
Facts about "Kirin 710 - HiSilicon"
base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,700 MHz (1.7 GHz, 1,700,000 kHz) +
core count8 +
core nameCortex-A53 + and Cortex-A73 +
designerHiSilicon + and ARM Holdings +
familyKirin +
first announcedJuly 18, 2018 +
first launchedJuly 18, 2018 +
full page namehisilicon/kirin/710 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuMali-G51 +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateJuly 18, 2018 +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A73 +
model number710 +
nameKirin 710 +
process12 nm (0.012 μm, 1.2e-5 mm) +
series700 +
smp max ways1 +
supported memory typeLPDDR4 +
technologyCMOS +
thread count8 +
used byHuawei nova 3i +
word size64 bit (8 octets, 16 nibbles) +