Semiconductor & Computer Engineering
(→Kaby Lake) |
(→Kaby Lake) |
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* '''TDP:''' 112 W | * '''TDP:''' 112 W | ||
* '''ISA:''' Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2) | * '''ISA:''' Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2) | ||
| − | * '''Tech:''' {{intel|Turbo Boost|Turbo Boost 2.0}}, {{intel|Turbo Max|Turbo Max 3.0 | + | * '''Tech:''' {{intel|Turbo Boost|Turbo Boost 2.0}}, {{intel|Turbo Max|Turbo Max 3.0}}, {{intel|VT-x}}, {{intel|VT-d}}, and {{intel|SpeedStep}} |
* 16x PCIe lanes | * 16x PCIe lanes | ||
* Up to 64 [[GiB]] of dual-channel DDR-2666 memory | * Up to 64 [[GiB]] of dual-channel DDR-2666 memory | ||
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--> | --> | ||
{{comp table start}} | {{comp table start}} | ||
| − | <table class="comptable sortable | + | <table class="comptable sortable tc10"> |
<tr class="comptable-header"><th> </th><th colspan="19">List of Kaby Lake-based Core X Processors</th></tr> | <tr class="comptable-header"><th> </th><th colspan="19">List of Kaby Lake-based Core X Processors</th></tr> | ||
| − | <tr class="comptable-header"><th> </th><th colspan=" | + | <tr class="comptable-header"><th> </th><th colspan="8">Main processor</th><th colspan="9">Features</th></tr> |
| − | {{comp table header 1|cols=Price, Process, Launched, Cores, Threads, Frequency, Turbo, TDP}} | + | {{comp table header 1|cols=Price, Process, Launched, Cores, Threads, Frequency, Turbo, TDP, {{intel|Hyper-Threading|HT}}}} |
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[microprocessor family::Core X]] [[microarchitecture::Kaby Lake]] | {{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[microprocessor family::Core X]] [[microarchitecture::Kaby Lake]] | ||
|?full page name | |?full page name | ||
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|?turbo frequency (1 core)#GHz | |?turbo frequency (1 core)#GHz | ||
|?tdp | |?tdp | ||
| + | |?has simultaneous multithreading | ||
|format=template | |format=template | ||
|template=proc table 3 | |template=proc table 3 | ||
| − | |userparam= | + | |userparam=11:11 |
|mainlabel=- | |mainlabel=- | ||
}} | }} | ||
Revision as of 20:15, 30 May 2017
| Core X | |
| Developer | Intel |
| Manufacturer | Intel |
| Type | Microprocessors |
| Introduction | May 30, 2017 (announced) |
| Architecture | High-performance, high core count x86 desktop processors |
| µarch | Skylake, Kaby Lake |
| Word size | 64 bit 8 octets
16 nibbles |
| Process | 14 nm 0.014 μm
1.4e-5 mm |
| Technology | CMOS |
| Clock | 3,300 MHz-4,300 MHz |
| Package | FCLGA-2066 |
| Socket | Socket R |
| Succession | |
| ← | |
| Core i7 Extreme Edition | |
Core X is a family of high-performance and high core count 64-bit x86 microprocessors introduced by Intel in mid-2017.
Overview
The Core X family was announced during Computex 2017. Core X is effectively a successor to the Core i7 Extreme Edition family which used to feature Intel's flagship model from each architecture. The Core X family has expanded into a series of models ranging from 6 to 18 cores.
Members
Skylake
- See also: Skylake µarch and Skylake X core
Skylake-based Core X processors were introduced during Computex 2017. Those processors incorporate a large number of changes over their Broadwell counterparts which brings along a performance increase in addition to other improvements. Those processors are also the first to incorporate the new AVX-512 extension.
- TDP: 140 W
- ISA: Everything up to AVX-512 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2, and AVX-512)
- Tech: Turbo Boost 2.0, Turbo Max 3.0, Hyper-Threading, VT-x, VT-d, and SpeedStep
| List of Skylake-based Core X Processors | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Main processor | |||||||||||||||||||
| Model | Price | Process | Launched | Cores | Threads | Frequency | Turbo | TDP | Max Mem | ||||||||||
| Count: 0 | |||||||||||||||||||
Kaby Lake
- See also: Kaby Lake µarch and Kaby Lake X core
Kaby Lake-based Core X processors were introduced during Computex 2017 at the same time as the Skylake models. Those processors are far more similar to the high-end Core i7 (Kaby Lake S core) contemporaries in terms of features and capabilities vs the Skylake Core X variants. Likewise, they do not incorporate some of the more significant features such as a high core count, the new cache system, and AVX-512.
- TDP: 112 W
- ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2)
- Tech: Turbo Boost 2.0, Turbo Max 3.0, VT-x, VT-d, and SpeedStep
- 16x PCIe lanes
- Up to 64 GiB of dual-channel DDR-2666 memory
| List of Kaby Lake-based Core X Processors | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Main processor | Features | ||||||||||||||||||
| Model | Price | Process | Launched | Cores | Threads | Frequency | Turbo | TDP | HT | ||||||||||
| Count: 0 | |||||||||||||||||||
See also
| designer | Intel + |
| first announced | May 30, 2017 + |
| full page name | intel/core x + |
| instance of | microprocessor family + |
| main designer | Intel + |
| manufacturer | Intel + |
| microarchitecture | Skylake + and Kaby Lake + |
| name | Core X + |
| package | FCLGA-2066 + |
| process | 14 nm (0.014 μm, 1.4e-5 mm) + |
| socket | Socket R + |
| technology | CMOS + |
| word size | 64 bit (8 octets, 16 nibbles) + |