From WikiChip
Difference between revisions of "loongson/godson 2/2f"
< loongson‎ | godson 2

Line 138: Line 138:
 
* 43 mm² die size
 
* 43 mm² die size
 
[[File:godson-2f die shot.png]]
 
[[File:godson-2f die shot.png]]
 +
 +
== Datasheet ==
 +
* [[:File:godson 2f ds (v1.1).pdf|Godson 2F Datasheet (V1.1)]]
  
 
== References ==
 
== References ==
 
* Hu, Wei-Wu, and Jian Wang. "Making effective decisions in computer architects’ real-world: Lessons and experiences with Godson-2 processor designs." Journal of Computer Science and Technology 23.4 (2008): 620-632.
 
* Hu, Wei-Wu, and Jian Wang. "Making effective decisions in computer architects’ real-world: Lessons and experiences with Godson-2 processor designs." Journal of Computer Science and Technology 23.4 (2008): 620-632.
 
== Datasheet ==
 
* [[:File:godson 2f ds (v1.1).pdf|Godson 2F Datasheet (V1.1)]]
 

Revision as of 18:26, 19 March 2017

Template:mpu Godson-2F (龙芯2F) is a 64-bit MIPS performance processor developed by ICT and later Loongson for desktop computers. Introduced in mid-2008, the Godson-2F operates at up to 800 MHz consuming 5 W. This chip was manufactured on STMicroelectronics' 90 nm process.

The Godson-2F features a faster memory controller (supporting up to DDR2-667) and integrates some of the functionality of the southbridge including a PCI-X controller and more general-purpose I/O pins.

Cache

Main article: GS464 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
1x64 KiB4-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
1x64 KiB4-way set associative 

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB4-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR2-667
Supports ECCYes
Max Mem4 GiB
Controllers1
Channels1
Max Bandwidth9.934 GiB/s
10,172.416 MiB/s
10.667 GB/s
10,666.551 MB/s
0.0097 TiB/s
0.0107 TB/s
Bandwidth
Single 9.934 GiB/s

Expansions

This chip has integrated HyperTransport 1.0 operating at 400 MHz.

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCI
Revision2.3
Width32 bit
Clock66 MHz
PCI-X
Revision1.0b
Width32 bit
Clock133 MHz
LPC
Revision1.1


Graphics

This chip had no integrated graphics processing unit.

Die Shot

godson-2f die shot.png

Datasheet

References

  • Hu, Wei-Wu, and Jian Wang. "Making effective decisions in computer architects’ real-world: Lessons and experiences with Godson-2 processor designs." Journal of Computer Science and Technology 23.4 (2008): 620-632.
Facts about "Godson-2F - Loongson"
has ecc memory supporttrue +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description4-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description4-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
max memory bandwidth9.934 GiB/s (10,172.416 MiB/s, 10.667 GB/s, 10,666.551 MB/s, 0.0097 TiB/s, 0.0107 TB/s) +
max memory channels1 +
supported memory typeDDR2-667 +